Forming and sintering method of low temperature co-fired ceramic substrate

A technology of low-temperature co-fired ceramics and sintering method, which is applied in the field of semiconductors and can solve problems such as poor compactness, poor heat dissipation effect of ceramic substrates, and impact on service life, and achieve the effects of improving density, optimizing physical and chemical properties, and improving heat transfer

Inactive Publication Date: 2017-11-03
FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for forming and sintering low-temperature co-fired ceramic substrates. The technical problem to be solved is: the selection of materials can easily lead to poor heat dissipation and poor compactness of the ceramic substrate, which affects the service life

Method used

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  • Forming and sintering method of low temperature co-fired ceramic substrate

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 As shown, the molding and sintering method of the low temperature co-fired ceramic substrate comprises the following steps:

[0024] Step S1. In parts by weight, take 64 parts of aluminum nitride, 30 parts of boron nitride, 10 parts of beryllium oxide, 30 parts of aluminum oxide, 15 parts of sintering aid, 2 parts of graphene nanoparticles, and 5 parts of calcium fluoride , 3 parts of hydroxymethyl cellulose, 15 parts of deionized water, 5 parts of silicon powder, 1 part of plasticizer, 1 part of dispersant, and 1 part of binder are wet ball milled for 2 hours to make a gel The ceramic slurry is vacuum stirred to defoam; the ceramic slurry after defoaming is cast to obtain a ceramic green sheet, and the thickness of the ceramic green sheet is controlled below 0.300mm;

[0025] Step S2. Stacking and laminating three pieces of ceramic green sheets in vacuum packaging to obtain a ceramic green body group; punching holes in the ceramic green body group, fi...

Embodiment 2

[0032] Such as figure 1 As shown, the molding and sintering method of the low temperature co-fired ceramic substrate comprises the following steps:

[0033] Step S1. In parts by weight, take 50 parts of aluminum nitride, 40 parts of boron nitride, 20 parts of beryllium oxide, 40 parts of aluminum oxide, 20 parts of sintering aid, 4 parts of graphene nanoparticles, and 15 parts of calcium fluoride , 6 parts of hydroxymethyl cellulose, 20 parts of deionized water, 10 parts of silicon powder, 1 part of plasticizer, 1 part of dispersant, and 1 part of binder are wet ball milled for 4 hours to make a gel The ceramic slurry is vacuum stirred to defoam; the ceramic slurry after defoaming is cast to obtain a ceramic green sheet, and the thickness of the ceramic green sheet is controlled below 0.300mm;

[0034] Step S2. Stacking and laminating 4 pieces of ceramic green sheets in vacuum packaging to obtain a ceramic green body group; punching holes in the ceramic green body group, fill...

Embodiment 3

[0041] Such as figure 1 As shown, the molding and sintering method of the low temperature co-fired ceramic substrate comprises the following steps:

[0042] Step S1. In parts by weight, take 57 parts of aluminum nitride, 35 parts of boron nitride, 15 parts of beryllium oxide, 35 parts of aluminum oxide, 18 parts of sintering aid, 3 parts of graphene nanoparticles, and 10 parts of calcium fluoride , 5 parts of hydroxymethyl cellulose, 17 parts of deionized water, 8 parts of silicon powder, 1 part of plasticizer, 1 part of dispersant, and 1 part of binder are wet ball milled for 3 hours to make a gel The ceramic slurry is vacuum stirred to defoam; the ceramic slurry after defoaming is cast to obtain a ceramic green sheet, and the thickness of the ceramic green sheet is controlled below 0.300mm;

[0043] Step S2. Stacking and laminating 3-4 pieces of ceramic green sheets in vacuum packaging to obtain a ceramic green body group; punching holes in the ceramic green body group, fil...

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Abstract

The invention relates to a forming and sintering method of a low temperature co-fired ceramic substrate; the method comprises the steps of preparing ceramic body sheets; stacking the ceramic block sheets, packaging in vacuum, and laminating to obtain a ceramic green body set; punching the ceramic green body set, filling holes with silver paste and, printing circuit patterns on top and bottom surfaces of the ceramic green body set via silver paste to obtain a ceramic green body set to be fired; placing the ceramic green body set to be fired into a rubber removal furnace and performing two-step rubber removal and gluing to obtain a sintered intermediate transition part; heating the sintered intermediate transition part to ceramic green body sintering temperature, and holding the temperature until a compact ceramic substrate is obtained; cooling to obtain the low temperature co-fired ceramic substrate. Compared with the prior art, the method of the invention has the advantages that the combination of aluminum nitride, boron nitride and beryllium oxide decreases cost and maintains heat-dissipating performance; by adding graphene nanoparticles, heat can be transferred, and compactness of the ceramic substrate is also improved; the physiochemical prosperities of the ceramic substrate are optimized via hydroxymethyl cellulose.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a molding and sintering method of a low-temperature co-fired ceramic substrate. Background technique [0002] Low Temperature Co-fired Ceramic (LTCC) (Low Temperature Co-fired Ceramic) technology has been widely used in wireless communication, Automotive electronics, computers, airborne communication and navigation, radar, satellite and other fields. Among many circuit substrates, LTCC not only has excellent high-frequency, high-strength, high-temperature and high-humidity resistance characteristics of ceramics, but the application number of the prior art is 201610473225.8 "An ultra-thin low-temperature co-fired ceramic substrate" Rapid prototyping and sintering method", due to its thin thickness and few co-formed layers, it is more sensitive to the difference in the environment during sintering, and the requirements for temperature and air flow are more stringent. The se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/582C04B35/638C04B35/64C04B41/88C03C12/00C03C6/04
CPCC03C1/00C03C12/00C04B35/581C04B35/638C04B35/64C04B41/5116C04B41/88C04B2235/32C04B2235/3217C04B2235/3409C04B2235/36C04B2235/386C04B2235/425C04B2235/428C04B2235/445C04B2235/656C04B41/4539C04B41/526C04B41/4578C04B41/0072
Inventor 杨大胜施纯锡
Owner FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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