Unlock instant, AI-driven research and patent intelligence for your innovation.

Biological identification chip wafer level preparation method and biological identification chip

A biometric, wafer-level technology, used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as chip warpage, affecting module assembly yield and product performance, and high chip stress. Achieve the effect of improving assembly yield and product performance, and improving thermal strain physical properties

Pending Publication Date: 2017-11-07
苏州科阳半导体有限公司
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In existing chips, the back of the entire biometric chip is coated with a solder mask material. Due to the thermal strain physical properties of the solder mask material, the solder mask layer is deformed by heating during the heating and curing process. The increased tensile force on the chip makes the internal stress of the chip large, which makes the warping phenomenon of the chip after preparation serious, which affects the module assembly yield and product performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Biological identification chip wafer level preparation method and biological identification chip
  • Biological identification chip wafer level preparation method and biological identification chip
  • Biological identification chip wafer level preparation method and biological identification chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] figure 2 It is a schematic flowchart of a method for manufacturing a biometric chip at the wafer level provided by Embodiment 1 of the present invention. This embodiment is applicable to the preparation of biometric chips, Figures 5A-5C It is a schematic structural diagram of the biometric identification chip prepared by the embodiment of the present invention. A wafer-level preparation method of the biometric identification chip provided by the embodiment of the present invention includes:

[0028] Step 110 , preparing a dielectric insulating layer on the back of the base substrate of the chip, and preparing a rewiring layer and pads on the dielectric insulating layer.

[0029] Among them, such as Figures 5A-5C As shown, the dielectric insulating layer 13 is located on the lower surface of the chip substrate 11 , and the rewiring layer 14 and the pad 16 are located on the dielectric insulating layer 13 . For example, the provided chip substrate 11 may be a silico...

Embodiment 2

[0041] image 3 It is a schematic flow chart of a wafer-level preparation method for a biometric chip provided in Embodiment 2 of the present invention, Figures 5A-5C It is a structural schematic diagram of the biometric chip prepared in the embodiment of the present invention. This embodiment is optimized on the basis of the above-mentioned embodiment 1. Specifically, the specific method for forming a solder mask pattern on the surface on which the pad is formed includes: coating a solder mask material on the surface on which the pad is formed, forming Solder resist layer; pre-curing the base substrate forming the solder resist layer; exposing the solder resist layer of the base substrate by using a photolithography mask with a preset pattern, and performing development treatment to engrave Etching away the solder resist layer exposes the pads and retains the protected area pattern. Correspondingly, the method of this embodiment includes:

[0042] Step 210 , preparing a d...

Embodiment 3

[0053] Figure 4 It is a schematic flow chart of a wafer-level preparation method of a biometric chip provided by Embodiment 3 of the present invention, Figures 5A-5C It is a structural schematic diagram of the biometric chip prepared in the embodiment of the present invention. This embodiment is optimized on the basis of the first embodiment above. Specifically, the specific method for forming a solder mask pattern on the surface on which the pad is formed includes: combining a pre-designed patterned screen with the chip substrate substrate Perform alignment; print the solder resist layer material on the chip substrate substrate arranged by the silk screen, and expose the pad and the pattern of the set range around the pad to form a solder resist layer pattern; form the solder resist layer pattern The base substrate is pre-cured. Correspondingly, the method of this embodiment includes:

[0054] Step 310 , preparing a dielectric insulating layer on the back of the base sub...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a biological identification chip wafer level preparation method and a biological identification chip; the biological identification chip wafer level preparation method comprises the following steps: preparing a dielectric insulating layer on the backside of a chip substrate, and forming a rewiring layer and a pad on the dielectric insulating layer; forming a solder mask pattern on the surface with the pad so as to expose the pad, wherein the solder mask pattern comprises a protection area pattern located in the pad peripheral setting scope; baking and solidifying the solder mask pattern. The method can improve the chip preparation process, can solve the large chip internal stress and chip severe warping problems caused by the solder mask material thermal strain physical properties, and improving the module assembling yield and product performance.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of semiconductor preparation, and in particular to a wafer-level preparation method of a biometric identification chip and a biometric identification chip. Background technique [0002] At present, biometric identification technology is mainly through the close combination of high-tech technical means such as optics, acoustics, biosensors and biostatistics principles, and uses the inherent physiological characteristics of the human body (such as biology, face, iris, etc.) to identify personal identities. The biometrics have the characteristics of lifelong deformation, uniqueness and convenience. The biometric system can process the collected biometrics and perform identity authentication quickly and accurately, so the importance of its use in personal identification is becoming more and more prominent. [0003] Figures 1A-1C It is a structural schematic diagram of a biometric chip ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/488
CPCH01L24/18H01L24/27H01L24/30H01L2224/26145H01L2224/27013H01L2224/2761H01L2224/301
Inventor 吕军金科赖芳奇李永智沙长青
Owner 苏州科阳半导体有限公司