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Composition for non-conductive adhesive film and non-conductive adhesive film containing same

A non-conductive, composite technology, applied in the direction of non-polymer adhesive additives, adhesive types, film/sheet adhesives, etc., can solve the problem of reduced stability of adhesive films and bump damage , slow curing speed and other issues, to achieve the effect of improving film adhesion, preventing wafer delamination, and increasing curing speed

Active Publication Date: 2020-12-29
INNOX ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In the case of using the above-mentioned non-conductive adhesive film, although many problems caused in the conventional sealing process by liquid underfill resin are improved, the non-conductive adhesive film developed at present is in the shape of a film, bump Insufficient filling properties, adhesive force, etc., therefore, the phenomenon of poor bump bonding often occurs, in order to solve the above problems, in the process of connecting a non-conductive adhesive film to a semiconductor wafer including bumps by applying excessive pressure case, can induce bump damage
And, in the case where the curing speed of the thermosetting adhesive film is delayed, the melted adhesive components leak out from between the chip and the chip or between the chip and the substrate, thereby contaminating the multi-chip package.
Furthermore, the slow curing speed significantly reduces the productivity along with prolonging the bonding time between chips
At the same time, light-curing or low-temperature thermosetting non-conductive adhesive films are subjected to bump bonding in a low-temperature environment, resulting in poor bonding between bumps
Also, when thermal curing is performed at low temperature, the stability of the adhesive film is significantly reduced

Method used

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  • Composition for non-conductive adhesive film and non-conductive adhesive film containing same
  • Composition for non-conductive adhesive film and non-conductive adhesive film containing same
  • Composition for non-conductive adhesive film and non-conductive adhesive film containing same

Examples

Experimental program
Comparison scheme
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preparation example Construction

[0105] As above image 3 The production method of the adhesive film of is prepared in the following order, that is, by coating the composition for non-conductive adhesive film on the upper part of the peeling substrate, drying it, and laminating the sheet substrate, but it can also be obtained by The composition for non-conductive adhesive film is coated on the upper part of the sheet substrate which is not the peeling substrate, dried, and the peeling substrate is laminated. In the case of not laminating the peeling substrate, it is possible to prepare such figure 2 adhesive film.

[0106] At this time, the melting range of the adhesive layer in which the adhesive film composition is dried in the adhesive film according to the following Mathematical Formula 1 may be 90°C or lower, more preferably 50 to 90°C.

[0107] Mathematical formula 1

[0108] Melting interval (ΔT) = TA (°C) - TB (°C)

[0109] The above-mentioned TA is the temperature (°C) when the melt viscosity is ...

Embodiment 1

[0120] First, 100 parts by weight of the epoxy component (solid, cycloaliphatic, EHPE3150, Daicel (DAICEL)) of the first thermosetting part was dropped into the second thermosetting part of the thermosetting part. A difunctional acrylic component containing a vinyl group as a functional group (M200, Miwon Specialty Chemical Co., Ltd.). Based on the total weight of the above-mentioned epoxy components and acrylic components of 100 parts by weight, 30 parts by weight of an acrylic copolymer (KW197CHM, negamikogyo company) and 10 parts by weight of about 700,000 weight average molecular weight are dropped into the thermoplastic part. Methyl ethyl ketone as a solvent, the above-mentioned acrylic copolymer contains 2,3-epoxypropyl methacrylate (2,3-epoxypropyl methacrylate) as an epoxy group-containing acrylic monomer at 25% by weight In the copolymer, the above-mentioned methyl ethyl ketone as a solvent was mixed by using a stirrer based on 100 parts by weight of the total weight ...

Embodiment 2 to Embodiment 12

[0122] Preparation was carried out in the same manner as in Example 1, and the non-conductive adhesives in Tables 1 to 3 below were obtained by changing the composition ratio of the composition for a non-conductive adhesive film as shown in Tables 1 to 3 below. conjunctiva.

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Abstract

The present invention relates to a composition for a non-conductive adhesive film and a non-conductive adhesive film containing the same, and more specifically, to the following composition for a non-conductive adhesive film and a non-conductive adhesive film containing the same. , By further increasing the curing speed, the soldering between chips and the resin flow during the soldering process between chips and substrates are minimized, improving productivity, and at the same time improving bump fillability and adhesion to semiconductor wafers. Excellent The room temperature stability reflects the heat resistance required for semiconductor products.

Description

technical field [0001] The present invention relates to a composition for a non-conductive adhesive film and a non-conductive adhesive film containing the same, and more specifically, to the following composition for a non-conductive adhesive film and a non-conductive adhesive film containing the same. , by increasing the curing speed to minimize the resin flow during the soldering between chips and the soldering process between chips and substrates, improve productivity, and at the same time improve bump filling and adhesion to semiconductor wafers, with excellent Stability at room temperature reflects the heat resistance required for semiconductor products. Background technique [0002] Recently, electronic devices including mobile devices have gradually become smaller and thinner. For this reason, the semiconductor industry has also become high-capacity, ultra-high-speed, and at the same time showing a trend of extremely miniaturization and thinning. In order to meet the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/10C09J7/30H01L21/683
CPCH01L21/6836C09J7/00C09J2203/326C09J2433/00C09J2463/00H01L2221/68386C09J2301/414H01L2224/16145H01L24/50H01B3/40C09J11/04C09J11/06C09J163/00C09J7/20C09J7/40C09J2301/312
Inventor 蔡成芫尹勤泳崔裁源朴德夏李东烈
Owner INNOX ADVANCED MATERIALS CO LTD
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