Resin, photosensitive resin composition, and electronic component and display device each using same

一种树脂、树脂膜的技术，应用在物,医药中间体的5,5’-二羟基-4,4’-二氨基联领域，能够解决选择性不高、收率低等问题，达到吸光度低、线性热膨胀系数小的效果

Active Publication Date: 2017-11-28
TORAY IND INC
View PDF20 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, multiple positions in the benzene ring of biphenyl derivatives may be substituted by bromine, and the selectivity is not high, so the yield of the reaction is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin, photosensitive resin composition, and electronic component and display device each using same
  • Resin, photosensitive resin composition, and electronic component and display device each using same
  • Resin, photosensitive resin composition, and electronic component and display device each using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0284] Hereinafter, the implementation will be enumerated in the order of (1) resin, photosensitive resin composition, (2) 5,5'-dihydroxy-4,4'-diaminobiphenyl derivative, (3) dibromobiphenyl derivative The present invention is described by way of examples, but the present invention is not limited to these examples.

[0285]

[0286] The evaluation of the resin and resin composition in an Example was performed by the following method.

[0287] 1) Measuring method of film thickness

[0288] Using Lambda Ace STM-602 manufactured by Dainippon Screen Mfg. Co., Ltd., both the resin film and the coating film after heat-curing were measured at a refractive index of 1.629.

[0289] 2) Determination method of linear thermal expansion coefficient

[0290] The resin solution was spin-coated on an 8-inch silicon wafer, followed by baking for 3 minutes on a 120° C. hot plate (using a coating and developing device Act-8 manufactured by Tokyo Electron Limited.) to obtain a resin film.

...

Synthetic example 1

[0322] Synthesis example 1 Synthesis of hydroxyl-containing diamine compound (a)

[0323] Dissolve 17.6 g (0.05 mol) of 2,2'-bis(trifluoromethyl)-5,5'-dihydroxybenzidine in 100 mL of acetone and 17.4 g (0.3 mol) of propylene oxide, and cool to -15°C . A solution obtained by dissolving 20.4 g (0.11 mol) of 3-nitrobenzoyl chloride in 100 mL of acetone was dropped there. After completion of the dropping, the reaction was carried out at -15°C for 4 hours, and then returned to room temperature. The precipitated white solid was obtained by filtration, and vacuum-dried at 50°C.

[0324] 30 g of the obtained white solid was put into a 300 mL stainless steel autoclave, dispersed in 250 mL of methyl cellosolve, and 2 g of 5% palladium-carbon was added. Hydrogen gas is introduced into it with a balloon, and the reduction reaction is carried out at room temperature. After about 2 hours, the reaction was terminated after confirming that the balloon was no longer deflated. After comple...

Synthetic example 2

[0327] Synthesis example 2 Synthesis of hydroxyl-containing diamine compound (b)

[0328] Change 2,2'-bis(trifluoromethyl)-5,5'-dihydroxybenzidine 17.6 g (0.05 mol) to 2,2'-dimethyl-5,5'-dihydroxybenzidine 17.6 g (0.05 mol) and except that, it carried out similarly to the synthesis example 1, and obtained the hydroxyl group containing diamine compound (b) represented by the following formula. The resulting solid was used directly in the reaction.

[0329] [chemical formula 29]

[0330]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
aperture sizeaaaaaaaaaa
residual stressaaaaaaaaaa
Login to view more

Abstract

Provided is a resin which has a low linear thermal expansion coefficient and a low absorbance. The resin is characterized by comprising at least one structure that is selected from among structures represented by general formula (1) or (2).

Description

technical field [0001] The present invention relates to a resin having a specific structure. More specifically, it relates to a surface protective film, an interlayer insulating film, a solder resist for a circuit board, an insulating layer of an organic electroluminescent element, and a display device using an organic electroluminescent element. Resins for flattening films of thin-film transistor substrates for driving, interlayer insulating films of thin-film transistors, on-chip micro lenses of solid-state imaging devices, and flattening films for various displays / solid-state imaging devices; and The photosensitive resin composition using this resin. [0002] The present invention also relates to 5,5'-dihydroxy-4,4'-diaminobiphenyl derivatives that can be used in these resins, resin compositions, and pharmaceutical intermediates, their production methods, and dibromobiphenyls used therein Synthetic methods of derivatives. Background technique [0003] It has been used ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C07C41/22C07C43/225C07C209/74C07C211/52C07C231/02C07C231/12C07C233/43C07D209/48C07D263/62C08L79/08G03F7/023H01L21/027H05K3/28
CPCC07C41/22C07C209/74C07C231/02C07C231/12C07D263/62C07D209/48H01L21/027C07C67/307C07C269/06C07C211/56C07C213/00H01L23/3157H05K3/3452H01L2224/11H01L2224/16145H01L2224/32145H01L2224/48463H01L2224/73204H01L2224/73265C09D179/04C09D179/08C08G69/32C08G73/1017C08G73/1075G03F7/037C07D263/56C08G73/1039C08G73/1042C08G73/106C08G73/1082C08G73/22G03F7/0233H01L23/293C07C233/80C07C215/80C07C233/43C07C271/28C07C43/225C07C69/76H01L2924/00C07C39/373C07C211/52C08G73/10C08G79/08G03F7/032G03F7/039H10K59/124C07C25/18G03F7/162G03F7/168G03F7/2004G03F7/322G03F7/40H01L23/3171H01L27/1248H05K1/0298
Inventor 弓场智之增田有希金佳科李平
Owner TORAY IND INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap