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High heat-conduction ceramic heat-radiation nanocomposite material used for LED lamp

A technology of nano-composite materials and high thermal conductivity ceramics, which is applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc. problems, achieve high thermal conductivity and heat dissipation, increase the effective heat dissipation area, and facilitate the effect of heat conduction

Active Publication Date: 2017-12-05
DONGGUAN CASUN LAMPBASE IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the heat dissipation materials commonly used in packaging are mainly metal aluminum or ceramic materials. These materials have some defects in the actual use process. For example, although aluminum-based heat dissipation materials have relatively good heat dissipation capabilities, they have long molding process cycles and inherent However, there are problems such as electrical conductivity and single shape. Although ceramic materials are insulating, they have a large specificity and high difficulty in molding, which is not conducive to mass production and its application is also limited.

Method used

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  • High heat-conduction ceramic heat-radiation nanocomposite material used for LED lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Step 1. Combine 10 parts of MgAl 2 O 4 / SSZ-13 nanomaterials, 30 parts of bentonite, 10 parts of magnesium oxide, 20 parts of calcium carbonate are dispersed in 300 parts of absolute ethanol to form a mixed slurry, which is dried to prepare a composite sintering aid for use;

[0020] Step 2. Add 30 parts of polymerized modified phenolic resin, 10 parts of silicon dioxide, 14 parts of boron nitride, 6 parts of hydroxymethyl cellulose, 10 parts of methyl acrylate and the composite sintering aid prepared in step 1 to the ball mill. 25 parts of the agent were subjected to wet ball milling, ball milling for 2 hours, and vacuum stirring and defoaming to prepare ceramic slurry for use;

[0021] Step 3. Press the ceramic slurry prepared in the above steps into the mold from the bottom of the mold, and place it naturally to complete the gel process. Take out the ceramic green sheet and dry it at a temperature of 60°C for 2 hours, and then spread the ceramic green body in a single piec...

Embodiment 2

[0032] Step 1. Mix 20 parts of MgAl 2 O 4 / SSZ-13 nano material, 15 parts of bentonite, 10 parts of magnesium oxide, 20 parts of calcium carbonate are dispersed in 300 parts of absolute ethanol to form a mixed slurry, which is dried to prepare a composite sintering aid for use;

[0033] Step 2. Add 30 parts of polymerized modified phenolic resin, 10 parts of silicon dioxide, 14 parts of boron nitride, 6 parts of hydroxymethyl cellulose, 10 parts of methyl acrylate and the composite sintering aid prepared in step 1 to the ball mill. 25 parts of the agent were subjected to wet ball milling, ball milling for 2 hours, and vacuum stirring and defoaming to prepare ceramic slurry for use;

[0034] Step 3. Press the ceramic slurry prepared in the above steps into the mold from the bottom of the mold, and place it naturally to complete the gel process. Take out the ceramic green sheet and dry it at a temperature of 60°C for 2 hours, and then spread the ceramic green body in a single piece A...

Embodiment 3

[0037] Step 1. Mix 30 parts of MgAl 2 O 4 / SSZ-13 nanomaterials, 20 parts of bentonite, 10 parts of magnesium oxide, 25 parts of calcium carbonate are dispersed in 300 parts of absolute ethanol to form a mixed slurry, which is dried to prepare a composite sintering aid for use;

[0038] Step 2. Add 30 parts of polymerized modified phenolic resin, 10 parts of silicon dioxide, 14 parts of boron nitride, 6 parts of hydroxymethyl cellulose, 10 parts of methyl acrylate and the composite sintering aid prepared in step 1 to the ball mill. 25 parts of the agent were subjected to wet ball milling, ball milling for 2 hours, and vacuum stirring and defoaming to prepare ceramic slurry for use;

[0039] Step 3. Press the ceramic slurry prepared in the above steps into the mold from the bottom of the mold, and place it naturally to complete the gel process. Take out the ceramic green sheet and dry it at a temperature of 60°C for 2 hours, and then spread the ceramic green body in a single piece A...

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Abstract

The invention discloses a high heat-conduction ceramic heat-radiation nanocomposite material used for a LED lamp. The material takes bentonite, magnesium oxide, calcium carbonate, a MgAl2O4 / SSZ-13 nano material, polymerization modified phenolic resin, silica, boron nitride, hydroxymethyl cellulose, and methyl acrylate as main materials, a MgAl2O4 / SSZ-13 nano molecular sieve is subjected to coupling treatment, and then the organic modification of polyphenyl ether phenolic resin is carried out, the MgAl2O4 / SSZ-13 nano molecular sieve material can be employed for forming heat-radiation particles, the heat-radiation particles have high thermal conductivity and thermal diffusivity on radial and axial directions, so that the ceramic heat-radiation material having excellent performance is produced. According to the invention, the MgAl2O4 / SSZ-13 nano molecular sieve is subjected to coupling treatment, and then the organic modification of polyphenyl ether phenolic resin is carried out, and the prepared high heat-conduction ceramic heat-radiation nanocomposite material has excellent mechanical strength and heat-radiation performance.

Description

Technical field [0001] The present invention relates to a high thermal conductivity ceramic heat dissipation nano composite material for LED lamps, and belongs to the field of ceramic preparation. Background technique [0002] As a new generation of light source, LED has the advantages of high efficiency, energy saving, environmental protection, long service life, easy maintenance and so on. It is predicted to be the third-generation light source that can replace incandescent lamps and fluorescent lamps. The light output efficiency and life span of the chip are compatible with the working temperature of the chip. Directly, the heat dissipation problem is the main problem that limits the power and luminous efficiency of packaged products. The effective way to solve the heat dissipation problem is to use high thermal conductivity, high insulation, and high transmittance materials to quickly transfer heat. At present, the commonly used heat dissipation materials for packaging are ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/583C04B35/64C04B35/624F21V29/85F21Y115/10
CPCC04B35/583C04B35/624C04B35/64C04B2235/3206C04B2235/3222C04B2235/3418C04B2235/3472C04B2235/349C04B2235/442C04B2235/96C04B2235/9607F21V29/86F21Y2115/10
Inventor 袁波
Owner DONGGUAN CASUN LAMPBASE IND CO LTD
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