A liquid metal thermally conductive filler and preparation method thereof

A technology of thermal conductive filler and liquid metal, which is applied in the direction of heat exchange materials, chemical instruments and methods, adhesive additives, etc. The coating effect is not ideal and other problems, to achieve the effect of saving preparation cost, good compatibility and stable structure

Active Publication Date: 2022-03-22
深圳沃尔提莫电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, for the application technology of liquid metal as a heat-conducting material, one is to directly disperse the liquid metal in the polymer matrix, but because the van der Waals force between the liquid metal is very large, the droplets dispersed in the polymer matrix are relatively large, and The size uniformity is poor, and the bonding between the metal droplet and the polymer matrix is ​​poor, and the interface difference makes the thermal conductivity of the entire thermal conductivity material not increase but decrease; there is another method to try to use the solidified metal powder and process it Surface coating, and then disperse the coated metal powder in the polymer matrix as a thermally conductive material, but due to the low melting point of liquid metal, the operation of metal particles and coating needs to be carried out at low temperature, and the operating conditions are harsh And the coating effect is not ideal
In addition, the existing technical means are to disperse the liquid metal in the whole polymer matrix, and exist as a specific heat-conducting material (heat-conducting patch), and cannot exist as an independent heat-conducting filler, which greatly limits the liquid metal as a Breadth and depth of applications for thermally conductive materials

Method used

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  • A liquid metal thermally conductive filler and preparation method thereof
  • A liquid metal thermally conductive filler and preparation method thereof
  • A liquid metal thermally conductive filler and preparation method thereof

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Embodiment Construction

[0029] The invention will be further described below. For the convenience of description, the equipment in the present invention omits necessary or conventional operation steps or conditions, and those skilled in the art can make arbitrary adjustments according to the needs of the reaction. Under the condition of no conflict, the features of the various embodiments in the solution of the present invention can be combined with each other.

[0030] 1. Preparation of materials

[0031] All raw materials of the present invention are commercially available or can be obtained by conventional methods. The following commercially available or self-made raw materials (preparation methods are conventional methods) are adopted in the examples of this case:

[0032] Low melting point metals or alloys (commercially available): indium gallium alloy: melting point 12°C; indium gallium tin alloy: melting point 10°C;

[0033] Side chain carboxyl-containing polysiloxane (self-made): add octam...

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Abstract

The invention provides a liquid metal thermal conductive filler and a preparation method thereof. The low melting point metal or alloy in the molten state and the polysiloxane containing carboxyl groups in the side chain are fully stirred until they are evenly mixed, and the temperature is raised to 60-80° C. Under the action of platinum catalyst, the reaction is fully stirred; then the reaction product is grafted with organosilicon modified polyurethane and SiO 2 The aerogel is mixed and fully stirred at a high speed to obtain a liquid metal thermally conductive filler product. The product created by the invention has a uniformly coated nano-scale particle structure, can be widely added to various heat-conducting substrates as an independent heat-conducting filler, and has high heat-conducting efficiency and good universality.

Description

technical field [0001] The invention relates to the technical field of thermally conductive materials, in particular to a nanoscale thermally conductive filler containing liquid metal. Background technique [0002] Thermally conductive fillers are fillers added to the matrix material to increase the thermal conductivity of the material. At present, most thermally conductive fillers are inorganic non-metallic materials, including aluminum oxide, magnesium oxide, zinc oxide and other metal oxides, silicon nitride, boron nitride, etc. metal nitrides. There are also some technologies that try to use metal solid particles such as gold, silver, copper, and aluminum as thermal fillers, but such metal particles are dense and easy to deposit, so they are not suitable for dispersion as a heat-conducting medium. [0003] Liquid metal refers to an amorphous metal, usually including mercury, which is truly liquid, and low-melting metals such as indium and gallium, and their alloys. Liq...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/14C09J11/04
CPCC09J11/04C09K5/14
Inventor 何千舟
Owner 深圳沃尔提莫电子材料有限公司
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