Moldable organic silicon resin, composition and semiconductor light-emitting element

A technology of resin composition and molding, which is applied in the field of silicone resin and composition, and can solve problems such as difficulty in compounding and molding, poor processability at low temperature, and no teaching of condensation-type silicone molding compounds. Achieve good low-temperature processability and good weather resistance

Active Publication Date: 2017-12-22
BEIJING KMT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high melting point of the silicone resin used, it is difficult to mix the silicone resin with other components uniformly at the conventional compounding temperature (usually below 100°C) when compounding the molding compound; Mold filling properties usually require controlling the molding temperature at a high temperature of 150-190°C. These defects lead to poor low-te

Method used

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  • Moldable organic silicon resin, composition and semiconductor light-emitting element
  • Moldable organic silicon resin, composition and semiconductor light-emitting element
  • Moldable organic silicon resin, composition and semiconductor light-emitting element

Examples

Experimental program
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preparation example Construction

[0047]

[0048] As the preparation method of the silicone resin of the present invention, comprising:

[0049] (a) Hydrolysis step: adding the first mixed solution comprising water, an acid catalyst, and the first organic solvent to the second mixed solution comprising chlorosilane and the second organic solvent, so that the chlorosilane undergoes a hydrolysis reaction, and from Separate the organic phase and the aqueous phase in the hydrolysis reaction product;

[0050] (b) Condensation step: after the pH value of the separated organic phase is neutralized to 7-14, condensation reaction occurs;

[0051] Wherein, the chlorosilane is MeSiCl 3 , PhSiCl 3 and R 2 SiCl 2 and R represents Me or Ph.

[0052] In the hydrolysis step (a), the water is preferably deionized water.

[0053] In the hydrolysis step (a), the type of the acidic catalyst is not particularly limited, and its examples include but are not limited to: inorganic acids such as sulfuric acid, hydrochloric aci...

Embodiment

[0117] Hereinafter, the present invention will be further described through examples, but the protection scope of the present invention is not limited by the examples.

[0118]

[0119] Utilize the AVANCE II 400MHz type nuclear magnetic resonance instrument that Switzerland Bruker company manufactures, by measuring the proton nuclear magnetic resonance spectrum of organosilicon resin ( 1 H-NMR) and silicon NMR spectra ( 29 Si-NMR), determine the average unit formula of the silicone resin.

[0120]

[0121] The melting point of the silicone resin was determined by measuring the DSC curve of the silicone resin with a DSC 204HP differential scanning calorimeter manufactured by Netzsch, Germany.

[0122]

[0123] After molding the silicone resin into a test sample with a size of 10cm×10cm×2mm, place it on the surface of a steel plate with a size of 15cm×15cm×1mm and a flat surface. Place the steel plate loaded with the test sample in the center of the stage of the TA.TX Pl...

Synthetic example 1

[0129]In the reactor equipped with stirrer, thermometer, and condensing reflux element, open the stirrer, add 504.0 grams (28.0 moles) of deionized water, 9.0 grams of hydrochloric acid with a concentration of 0.05N, and 1000.0 grams of toluene to form the first mixed solution; The reactor was slowly warmed up, and at the same time, 747.5 grams (5.0 moles) of methyltrichlorosilane, 634.5 grams (3.0 moles) of phenyltrichlorosilane, 258.0 grams (2.0 moles) of dimethyl A second mixed solution composed of dichlorosilane and 1000.0 grams of toluene; after the second mixed solution is added dropwise, keep the inner temperature of the reactor at 70°C, and perform a hydrolysis reaction under reflux for 3 hours to obtain a hydrolysis reaction product; The obtained hydrolysis reaction product was cooled and allowed to stand to separate layers, and then the organic phase and the aqueous phase were separated. Adjust the pH value of the separated organic phase to 9 with potassium hydroxide...

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Abstract

The invention relates to moldable organic silicon resin, a composition and a semiconductor light-emitting element. The moldable organic silicon resin and a preparation method thereof are firstly provided. The organic silicon resin is in a solid state at 25 DEG C by controlling a molar ratio of a [MeSiO3/2] unit, a [PhSiO3/2] unit, a [R2SiO2/2] unit and hydroxyl in the organic silicon resin within a specific value range, and the melting point is lower than 50 DEG C, so that the moldable organic silicon resin which is applicable to condensed type organic silicon mold plastic and has the relatively low melting point can be obtained. The invention further provides a moldable organic silicon resin composition. By at least mixing the organic silicon resin with a crosslinking agent, an inorganic filler and a condensed catalyst, the condensed type organic silicon mold plastic which is high in low-temperature processibility and weather resistance is obtained. Furthermore, the invention further provides a molded body and a manufacturing method thereof, an LED shell and the semiconductor light-emitting element.

Description

technical field [0001] The invention relates to a moldable silicone resin, a composition and a semiconductor light-emitting element thereof, in particular to a moldable silicone resin, a composition, and an LED casing suitable for condensation-type silicone molding compounds with a low melting point and its semiconductor light-emitting elements. Background technique [0002] Semiconductor light-emitting elements such as LEDs have the advantages of small size, high efficiency, long life, and excellent performance, and have attracted much attention in recent years. A typical semiconductor light-emitting element is usually made of polyamide, epoxy resin and other molding materials through molding to form a casing, then arrange chips and leads in the casing, and then fill the casing with sealing material and then cure and package it. Due to the poor heat resistance and light resistance of the above-mentioned housing materials, problems such as yellowing, decrease in reflectivit...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K13/02C08K3/22C08K3/36H01L33/48C08G77/04
CPCH01L33/483C08G77/04C08K3/22C08K3/36C08K13/02C08K2003/2241C08L2203/20C08L83/04C08G77/20C08G77/08C08K3/013C08K5/0025H10K50/00
Inventor 孙宏杰邓斯奇
Owner BEIJING KMT TECH
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