Novel laser indirect impact micro-forming device and method

Abstract

The invention discloses a novel laser indirect impact micro-forming device and method. The device and method are mainly applied to plastic forming technique and manufacturing of fine micro parts. The device and method solve the problem that a conventional laser impact micro-forming method is difficult in forming, and materials cannot be formed. The device comprises a mold-debug light spot centering assembly, a workpiece positioning assembly, a workpiece assembly, an Nd:YAG pulsed laser system used for impact forming, a CW optical fiber laser system used for heating, an ultrasonic vibration system and a control system. The device can achieve the aim that pulsed laser impact force is adopted to serve as an energy source, meanwhile, ultrasonic vibration is applied to a mold and a workpiece, or, a laser beam sent out by a CW optical fiber laser is used for carrying out non-contact type quasi-static heating on the surface of the workpiece, or, under the joint effect, workpiece micro-forming is achieved; due to the design, work efficiency is improved, design is reasonable, control performance is good, quality and precision of micro-forming parts are ensured, and the device is suitable for industrialized application.

Description

technical field [0001] The invention belongs to the field of laser processing and manufacturing and mechanical advanced manufacturing of micron-level parts, in particular to a novel laser indirect impact micro-forming device and method. Background technique [0002] With the rapid development of high technology, Micro Electro Mechanical System (Micro Electro Mechanical System, MEMS) and Micro System Technology (Micro System Technology, MST) are widely used in aerospace due to their advantages of space saving, energy saving, easy reorganization, portability and light weight. , automotive industry, biomedicine, environmental monitoring, communications, military applications, microelectronics and many other civilian and military fields are favored. Therefore, research on thin plate microforming has received extensive attention. [0003] Traditional micromachining techniques, such as LIGA, photolithography, and etching, are difficult to process microdevices with complex three-d...

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Problems solved by technology

However, this device does not use a protection system, that is, the temperature of the heated workpiece cannot be guaranteed, and the forming quality of the workpiece cannot be guaranteed; and the device uses the punch to act on the workpiece, because the temperature of the workpiece after heating is high, and the friction between the punch and the workpiece Cause micro molds to be easily damaged

The Chinese patent with the publication number CN104162595A adopts ultrasonic vibration-assisted foil plate micro-punching forming device to solve the problems of severe mold wear and low service life. The foil plate is also difficult to transmit energy and the vibration system is difficult to realize in the vibration-assisted forming of large-scale components. Wait for the bottleneck problem, complete the fine blanking and forming of the foil plate

However, there are still some problems in this device using the micro-rigid punch and die to realize micro-plastic forming, such as the punch is easily damaged, the punch and the die are difficult to center, and there is friction between the punch and the die, which leads to poor forming quality of the workpiece. advanced defects

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