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A kind of preparation method of high concealment ultraviolet light deep layer curing adhesive

A deep curing, ultraviolet light technology, applied in the direction of adhesives, polymer adhesive additives, microsphere preparation, etc., can solve the problems of reducing the curing depth, hindering the transmission of ultraviolet rays, etc., to achieve low shrinkage, excellent adhesion and mechanical properties. The effect of sex and low density

Active Publication Date: 2020-04-24
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the cationic photocuring system, immediately after ultraviolet light irradiation and only acid (no free radical species) is produced, it can immediately react with the above-mentioned leuco dye, and after the color deepens, it will quickly hinder the penetration of ultraviolet light and reduce the curing depth.

Method used

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  • A kind of preparation method of high concealment ultraviolet light deep layer curing adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 55 parts of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, 3.5 parts of triaryl sulfonium hexafluorophosphate, 0.5 part of N-vinylcarbazole, 1,2, 6 parts of 8,9-diepoxy-4-vinylcyclohexene and 4 parts of γ-aminopropyltriethoxysilane were added to the stirring tank, and the pressure was -0.1 MPa, stirred for 0.5 h, and added 25 parts of silicon micropowder and 1 part of irreversible color capsule, under the condition of pressure of -0.1 MPa, control the temperature not to be higher than 35 ℃, disperse at high speed for 0.6h, add 5 parts of meteorological silica, stir evenly, under the pressure of -0.1 MPa Under the condition, control the temperature not higher than 35 ℃, disperse and stir at a high speed for 1 hour, and then discharge the material, that is, to obtain a highly concealed UV light deep curing adhesive; the speed of the high-speed stirring is revolution 10-50 r / min, and rotation 600-2000 r / min.

[0044] The irreversible color capsule microparticl...

Embodiment 2

[0050] 30 parts of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, 23 parts of bisphenol A epoxy resin, 3 parts of diaryl hexafluoroantimonate iodonium salt, 1- 0.5 parts of hydroxy-cyclohexyl-phenyl ketone, 10 parts of 3,3'-(oxybismethylene)bis(3-ethyl)oxetane and γ-aminopropyltriethoxysilane Add 3.5 parts into the stirring kettle, stir for 0.5h under the pressure of -0.1MPa, add 20 parts of silicon micropowder and 5 parts of irreversible color capsules, under the pressure of -0.1MPa, control the temperature not to be higher than 35 ℃, Disperse at high speed for 0.6h, add 5 parts of meteorological silica, stir evenly, under the condition of pressure of -0.1 MPa, control the temperature not to be higher than 35 ℃, disperse at high speed for 1h, and then discharge the material, that is to obtain high concealment UV light deep curing Adhesive; the rotational speed of the high-speed stirring is 10-50 r / min for revolution and 600-2000 r / min for autorotation.

[0051] Th...

Embodiment 3

[0057] 25 parts of bis-(3,4-epoxycyclohexylmethyl) adipate, 15 parts of hydrogenated bisphenol A epoxy resin, 3.5 parts of iodonium diaryl hexafluorophosphate, ( 2,4,6 - 0.5 parts of trimethylbenzoyl) diphenylphosphine oxide, 20 parts of 1,2,8,9-diepoxy-4-vinylcyclohexene and 3 parts of γ-aminopropyltriethoxysilane Add it to the stirring tank, stir for 0.5h under the pressure of -0.1 MPa, add 26 parts of silicon micropowder and 5 parts of irreversible color capsules, under the pressure of -0.1 MPa, control the temperature not to be higher than 35 ℃, and disperse at high speed 0.6h, add 2 parts of meteorological silica, stir evenly, under the condition of pressure of -0.1 MPa, control the temperature not to be higher than 35℃, disperse and stir at high speed for 1h, then discharge the material, that is to obtain a highly concealed UV light deep curing adhesive; The rotational speed of the high-speed stirring is 10-50 r / min for revolution and 600-2000 r / min for autorotation.

...

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Abstract

The invention relates to a preparation method of a high-concealment ultraviolet light deep curing adhesive. The adhesive is prepared from the following raw materials in parts by weight: 30 to 60 partsof epoxy resin, 0.01 to 10 parts of transparent / semitransparent irreversible color capsules, 5 to 20 parts of reactive diluents, 5 to 25 parts of fillers, 1 to 5 parts of cationic photoinitiators, 0.1 to 2.5 parts of photosencitizers, 1 to 5 parts of thixotropic agents and 1 to 5 parts of auxiliary agents. The transparent / semitransparent irreversible color capsules are added into colloid, ultraviolet light irradiates the colloid so that the polyreaction is caused; the generated reaction heat is aggregated to reach a certain temperature for melting a casing at the surface of the irreversible color capsules, so that color change pigment in the irreversible color capsules changes the color after acid contact with light; high concealment of light is realized; the problems of the existing colored ultraviolet light curing adhesive that the curing depth is low, and the bottom glue layer is difficult to cure are solved.

Description

technical field [0001] The invention relates to a preparation method of a highly concealed ultraviolet light deep curing adhesive. Background technique [0002] UV-LED curing technology is a new type of ultraviolet (UV) curing technology. Compared with traditional UV (mercury lamp) curing, UV-LED curing technology adopts UV-LED cold light source, which has a single wavelength, high luminous efficiency, energy Low consumption; no infrared and ozone generation; no need for preheating; long service life, low maintenance cost; high flexibility of use, small system size and other unique advantages, must be the future development trend of light curing technology. [0003] However, the existing UV-LED is a single-band UV light source (mainly 365nm, 385nm, 395nm, 405nm), and the energy is concentrated, and a photoinitiator that matches its emission spectrum can achieve a good initiation effect. However, the absorption peaks of currently available cationic photoinitiators are genera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C08G59/68C08G59/38C08G59/24B01J13/02
Inventor 魏芳芳李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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