High-molecular mask plate and manufacturing method and application thereof

Abstract

The invention discloses a high-molecular mask plate. The high-molecular mask plate comprises a bearing substrate, a sacrificial layer and a mask, and the sacrificial layer and the mask are sequentially arranged on the bearing substrate in an overlapped mode. The mask comprises a high-molecular membrane layer and a plurality of holes which are formed in the high-molecular membrane layer and penetrate through the high-molecular membrane layer, and magnetic nano-particles are doped in the high-molecular membrane layer. The invention further discloses a manufacturing method of the high-molecular mask plate. The manufacturing method comprises the steps that S1, the sacrificial layer is manufactured on the bearing substrate; S2, the sacrificial layer is coated with a high-molecular precursor doped with the magnetic nano-particles, curing is conducted for membrane forming, and a raw high-molecular membrane is formed; S3, ablation is conducted on the area, unshielded by a photomask mask plate,of the raw high-molecular membrane through the photomask mask plate in a laser scanning mode so as to form holes and the mask, and a high-molecular mask plate precursor is obtained; and S4, after thehigh-molecular mask plate precursor is cleaned and dried, the acting force between the bearing substrate and the mask is weakened, and the high-molecular mask plate is obtained. The invention furtherdiscloses application of the high-molecular mask plate to OLED manufacturing.

Description

technical field [0001] The invention belongs to the technical field of organic light-emitting diode display manufacturing, and in particular relates to a polymer mask, a manufacturing method thereof, and an application of the polymer mask in producing OLEDs. Background technique [0002] Organic light emitting diode display (Organic Light Emitting Diode, OLED) is a promising flat panel display technology, it has very excellent display performance, especially self-illumination, simple structure, ultra-thin, fast response, wide Viewing angle, low power consumption, and flexible display are known as "dream display". In addition, the investment in its production equipment is much smaller than that of TFT-LCD. It has been favored by major display manufacturers and has become the No. 1 display technology in the field of display technology. The main force of the three generations of display devices. At present, OLED is on the eve of mass production. With the further deepening of r...

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Problems solved by technology

[0005] At present, there is a technical scheme of using PI film for in-situ mask production. The process is: the PI film is stretched and fixed with a jig, and then bonded to the evaporation substrate, and the laser is used to open the area corresponding to the pixel on the evaporation substrate. However, this process also has the following defects: (1) The PI film needs to be stretched and bonded to the evaporation substrate, and laser drilling is used after bonding. The risk of damaging the Ag electrode on the evaporation substrate. When the PI film is punched, the burning residue of the PI film will also pollute the ITO surface; (2) The PI film is first tensioned and then punched. After the hole is punched, the effective area of ​​the PI film is reduced, and the tension The force will change. At this time, adjusting the tension will cause the TP CD of the PI mask to change; (3) Since the PI film is not magnetic during coating, it is difficult for the PI film and the evaporation substrate to fit tightly, resulting in a large shadow

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