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Method for preparing modified polyimide fiber paper

A technology of polyimide fiber and polyimide, which is applied in the field of preparation of modified polyimide fiber paper, can solve the problems of low strength of fiber base paper, poor pulping performance, difficult to separate filaments, etc., and achieve The effect of increasing the active group, improving the pulping property and improving the smoothness

Active Publication Date: 2018-02-09
乐凯特科技铜陵有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the molecular structure of polyimide fibers contains stable imide groups, the fiber surface is passivated, there is no hydrophilic group, and the fiber density is high, easy to settle, poor dispersibility, poor pulping performance, and its The surface is smooth and there are no microfibers. During the beating and defibering process of the pulp, the fibers will not be difficult to segregate, and its surface activity is low, and there is no intermolecular bonding force between the fibers, resulting in low strength of the fiber base paper.

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] A preparation method of modified polyimide fiber paper, comprising the following steps:

[0023] (1) Preparation of polyimide fiber pulp:

[0024] Sequentially add p-phenylenediamine and diphenyltetracarboxylic dianhydride into the reaction kettle containing the solvent N,N-dimethylacetyl, stir and react at a speed of 200r / min at 0°C for 1h, and obtain a polyamic acid solution for later use ;

[0025] Put the amphiphilic block copolymer into DMF, stir to dissolve it completely, then slowly add the obtained solution into the polyamic acid solution under stirring, the stirring speed is 100r / min, after the addition is completed, pass the composite solution through a porous spray The filaments are extruded into absolute ethanol, and the volume ratio of the fibers in the control system is 10%, and then the fibers are sheared at a stirring speed of 3500r / min to form short fibers of 1mm, and then the system is disentangled, cut, and Brooming and drying to obtain polyamic aci...

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PUM

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Abstract

The invention discloses a method for preparing modified polyimide fiber paper. The method comprises the following steps of: mixing polyimide fiber pulp which is modified by an amphiphilic block copolymer and polyimide chopped fiber which is modified through microwave radiation so as to obtain modified polyimide fiber base paper, wherein the polyimide fiber pulp and the polyimide chopped fiber havedifferent lengths; and then performing resin bonding and curing treatment to obtain the modified polyimide fiber paper. Since the polyimide fiber pulp has certain performance of hydrophilicity, and the surface of the polyimide fiber pulp comprises active groups, the dispersibility and slurryability of the system are improved, and the smoothness of the base paper is improved; since the roughness of the surface of the polyimide chopped fiber which is modified through the microwave irradiation is increased, the quantity of active groups is increased, the crystallinity is decreased, and hydrogenbonds is more easily generated among the fiber so that the fibre is combined; finally, the fiber paper with higher strength and stability is obtained, and can be applied to printed circuit board substrates as a reinforcing material with beneficially comprehensive-performance.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate reinforcing materials, in particular to a preparation method of modified polyimide fiber paper. Background technique [0002] Printed circuit board, also known as PCB circuit board, is a printed circuit board that forms point-to-point connections and printed components on a common substrate according to a predetermined design. Printed circuit boards are indispensable accessories in modern electronic equipment. It is widely used in communication , digital products, instruments, medical equipment, aerospace and military industries and other fields. [0003] PCB substrate is commonly known as copper clad laminate, which is made by impregnating resin with reinforcing material, then covering one or both sides with copper foil, and then hot pressing. The commonly used reinforcement materials are wood pulp paper, glass fiber cloth, synthetic fiber cloth, non-woven fabric and some composite ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21H15/10D21H15/02D21H13/26D21H19/10C08G73/10D01F1/10D01F6/74
CPCC08G73/1067D01F1/10D01F6/74D21H13/26D21H15/02D21H15/10D21H19/10
Inventor 沈志刚
Owner 乐凯特科技铜陵有限公司
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