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A kind of nanometer silver solder paste connects the power module manufacturing method of bare copper DBC

A power module and nano-silver technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem that the diffusion connection between nano-silver and bare copper substrates or copper-clad substrates cannot be realized, and nano-silver cannot be well moistened. Wet substrates, affecting the reliability of chip connection, etc., to achieve the effect of improving connection strength and reliability, low elastic modulus, and high reliability

Active Publication Date: 2019-09-20
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional nano-silver solder paste connections use silver-plated copper-clad ceramic substrates. However, for nano-silver connections to bare copper substrates or copper-clad substrates, since bare copper substrates or copper-clad substrates are easily oxidized in air, An oxide layer is formed on the surface, so that the nano-silver cannot wet the substrate well, resulting in serious voids and delamination of the solder layer
Oxygen in the air atmosphere during sintering will seriously oxidize the bare copper substrate or copper-clad substrate, hinder the diffusion between atoms, and cannot achieve a good diffusion connection between nano-silver and bare copper substrate or copper-clad substrate, seriously affecting the chip connection. Reliability, oxides also affect subsequent wire bonding, further reducing module reliability

Method used

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  • A kind of nanometer silver solder paste connects the power module manufacturing method of bare copper DBC
  • A kind of nanometer silver solder paste connects the power module manufacturing method of bare copper DBC
  • A kind of nanometer silver solder paste connects the power module manufacturing method of bare copper DBC

Examples

Experimental program
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Effect test

Embodiment 1

[0031] (1) if figure 1 Shown is the manufacturing process of a high-power semiconductor power module with nano-silver solder paste connected to a bare copper DBC substrate, which are DBC substrate cleaning, nano-silver printing, chip mounting, and nano-silver sintering.

[0032] (2) Cleaning process: first clean the bare copper DBC with dilute hydrochloric acid, and then use an ultrasonic cleaner to vibrate and clean for 1 min, then clean it with absolute ethanol, and use an ultrasonic cleaner to vibrate and clean for 10 min.

[0033] (3) Solder paste printing process, printing nano-silver on the cleaned bare copper DBC, using stencil printing technology to print nano-silver solder paste, preheating after the first printing, preheating temperature 150 ℃, holding time 20min, and then Make a second print.

[0034] (4) Mounting process, using a placement machine for placement, the placement pressure is 200gf. See attached Figure 4 ;

[0035] (5) Sintering process, vacuumize ...

Embodiment 2

[0038] (1) if figure 1 Shown is the manufacturing process of a high-power semiconductor power module with nano-silver solder paste connected to a bare copper DBC substrate, which are DBC substrate cleaning, nano-silver printing, chip mounting, and nano-silver sintering.

[0039] (2) Cleaning process: first clean the bare copper DBC with dilute hydrochloric acid, and then use an ultrasonic cleaner to vibrate and clean for 1 min, then clean it with absolute ethanol, and use an ultrasonic cleaner to vibrate and clean for 10 min.

[0040] (3) Solder paste printing process, printing nano-silver on the cleaned bare copper DBC, printing nano-silver solder paste with stencil printing technology, preheating after the first printing, preheating temperature 180 ℃, holding time 20min, and then Make a second print.

[0041] (4) Mounting process, using a placement machine for placement, the placement pressure is 200gf. See attached Figure 4 ;

[0042] (5) Sintering process, vacuumize t...

Embodiment 3

[0045] (1) if figure 1 Shown is the manufacturing process of a high-power semiconductor power module with nano-silver solder paste connected to a bare copper DBC substrate, which are DBC substrate cleaning, nano-silver printing, chip mounting, and nano-silver sintering.

[0046] (2) Cleaning process: first clean the bare copper DBC with dilute hydrochloric acid, and then use an ultrasonic cleaner to vibrate and clean for 1 min, then clean it with absolute ethanol, and use an ultrasonic cleaner to vibrate and clean for 10 min.

[0047] (3) Solder paste printing process, printing nano-silver on the cleaned bare copper DBC, using stencil printing technology to print nano-silver solder paste, preheating after the first printing, preheating temperature 200 ℃, holding time 20min, and then Make a second print.

[0048] (4) Mounting process, using a placement machine for placement, the placement pressure is 200gf. See attached Figure 4 ;

[0049] (5) Sintering process, vacuumize ...

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Abstract

The invention relates to a method for manufacturing a power module for connecting bare copper DBCs with nano-silver solder paste, including a cleaning process, a solder paste printing process, a patch process, and a sintering process; the cleaning process uses ultrasonic oscillation to clean the bare copper DBC, and the solder paste The printing process adopts stencil printing to realize the printing of nano-silver solder paste, and the nano-silver is printed twice; the placement process adopts placement machine placement; the sintering process adopts vacuum reflow furnace sintering to obtain formic acid oxygen-free atmosphere, and control the sintering temperature and temperature rise rate. It can not only realize the densified connection between the nano-silver solder paste and the bare copper DBC, but also prevent the oxidation of the bare copper DBC. The invention does not require special equipment, the processing procedure is convenient and easy, and the process is simple. It is suitable for realizing the connection between the power chip and the bare copper substrate or the copper-clad substrate through the nano-silver solder paste, which ensures the reliability of the subsequent wire bonding and improves the The reliability of the power module has greatly promoted the application of nano-silver solder paste in the packaging of power semiconductor modules.

Description

technical field [0001] The invention relates to a method for manufacturing a power module for connecting bare copper DBCs with nano-silver solder paste, and belongs to the field of packaging and manufacturing of high-temperature power electronic modules. Background technique [0002] The chip connection materials of traditional power modules use solder alloys, and their melting points are generally lower than 300°C. This solder alloy is prone to creep fatigue failure due to its low melting point and tendency to generate intermetallic compounds, especially in the high temperature application environment of the module. Therefore, traditional solder alloys have become a major bottleneck restricting high-temperature applications of high-power modules. As a promising thermal interface material, nano-silver solder paste has high thermal conductivity (240W / m K), high electrical conductivity (2.6×10 5 Ω·cm -1 ), low Young's modulus (about 9-20GPa), high melting point (961°C), and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/01H01L2224/0603H01L2224/48472H01L2224/49111H01L2224/8384H01L2224/83211
Inventor 梅云辉刘文闫海东李欣陆国权
Owner TIANJIN UNIV
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