Reaction type thermal conductive insulating double sided tape and preparation method thereof

Abstract

The invention discloses a reaction type thermal conductive insulating double sided tape and a preparation method thereof. The method comprises the following steps that the raw materials of, by weight,5%-30% of epoxy resin, 3%-50% of film former, 0.2%-3.0% of a curing agent, 0.01%-2.0% of an accelerator and 30%-90% of thermal conductive powder are taken, the raw materials are added into a planetary mixer, mixing is conducted to be uniform, vacuum defoamation is conducted, and reaction type heat-conducting glue is obtained; the reaction type heat-conducting glue and a PET release film are extruded by a calender to obtain a heat-conducting glue film; the heat-conducting glue film is attached to the two sides of a polyimide thin film through laminating equipment, and the reaction type thermalconductive insulating double sided tape is obtained. Accordingly, the requirements of high initial adhesion of the high heat-conducting glue tape can be met, and the heat-conducting tape can have higher mechanical strength and more excellent adhesion; the problem that for a traditional coating process, solvent must be used, and the environment pollution is caused is solved, the air hole problem possibly generated in the baking process is avoided, energy consumption can be saved, and the production cost is lowered.

Description

technical field [0001] The invention relates to the field of heat dissipation materials for electronic packaging, in particular to a reactive heat-conducting and insulating double-sided adhesive tape and a preparation method thereof. Background technique [0002] With the rapid development of electronic and electrical technology in recent years, smart electronic devices, such as laptops, tablets and smart phones, have become more and more powerful, while the integration density of electronic components and devices has become higher and higher, and their volume has continued to shrink , heat dissipation becomes a prominent problem. If the heat cannot be dissipated in time and continues to accumulate, it will have a significant impact on the operating speed, working stability, and reliability of electronic components and equipment, and problems such as system crashes or thermal deformation will occur, and even lead to failure and the use of electronic components. Life expecta...

AI Technical Summary

Problems solved by technology

However, silicone is a non-polar polymer, and the force between molecules is relatively low, resulting in the defects of low mechanical strength and weak cohesive force, especially when the thermal conductive powder is highly filled, the initial viscosity and cohesive force will be further reduced , even loses its viscosity

With the development of electronic packaging technology in the direction of high density, three-dimensional packaging, high integration and high performance, the requirements for thermal conductivity, insulation and reliability of heat dissipation materials are also getting higher and higher. Ester pressure-sensitive thermally conductive double-sided tapes cannot meet the demand, so it is of great significance to develop thermally conductive insulating tapes with high thermal conductivity, high bonding strength, and high reliability.

[0004] Most of the current thermally conductive tapes mentioned above use polyacrylate or silicone with low crosslinking density as the thermally conductive adhesive layer. This type of pressure-sensitive resin has low modulus and strength, poor creep resistance, weather resistance, Poor solvent resistance, low adhesion, and environmental pollution caused by the use of a large amount of solvents in the preparation process, cannot be used in some permanent bonding occasions that require temporary positioning and structural adhesive levels

Images