High-lubricity self-defoaming easy-to-clean environment-friendly oily wire-cutting fluid

Abstract

The invention discloses a high-lubricity self-defoaming easy-to-clean environment-friendly oily wire-cutting fluid. The wire-cutting fluid comprises the following components in percentage by weight: 40-50% of a high-boiling-point alcohol antifreeze agent, 5-10% of a multifunctional foam inhibitor, 30-40% of a non-ionic cleaning lubricant, 2-6% of a polymer surfactant, 1-3% of a wetting penetrant,and the balance of water. The high-lubricity self-defoaming easy-to-clean environment-friendly oily wire-cutting fluid provided by the invention has excellent lubricating, cleaning and cooling performance, and excellent defoaming performance is achieved, so that the problems of much foam and low cutting efficiency existing in a wire-cutting process are effectively improved; in addition, the high-lubricity self-defoaming easy-to-clean environment-friendly oily wire-cutting fluid prepared by the method provided by the invention is an oily system, and is diluted for use by adding pure water in ause process, so that the discharge amount of COD is effectively reduced, and the environment-protection requirements are met.

Description

technical field [0001] The invention relates to the field of fine chemicals, in particular to a highly lubricating, self-defoaming, easy-to-clean, and environment-friendly oily wire cutting fluid. Background technique [0002] In recent years, with the development of the integrated circuit (IC) and photovoltaic power generation (PV) industries, the use of silicon wafers has increased dramatically. According to statistics, about 80% of solar cells and more than 90% of integrated circuits in the world use silicon wafers. In the silicon wafer manufacturing process, material loss is relatively low in the steps of material cutting, sectioning, and square cutting, but the loss of slicing is relatively large, accounting for about 30% of the total cost. [0003] At the same time, slicing is the most important process that causes problems such as stress, chipping, and damage. The quality and efficiency of slicing directly affect subsequent processes such as corrosion and polishing, ...

AI Technical Summary

Problems solved by technology

[0003] At the same time, slicing is the most important process that causes problems such as stress, chipping, and damage. The quality and efficiency of slicing directly affect subsequent processes such as corrosion and polishing, and even affect the conversion efficiency of solar cells, which in turn affects the entire manufacturing process.