The invention discloses a high-weather-resistance wide-temperature-range bottom filling
adhesive for
semiconductor packaging and a preparation method thereof, and relates to the technical field of filling adhesives for
semiconductor packaging, and the preparation method comprises the following steps: synthesizing glycidyl
sulfonate by taking bio-based glycidyl and
sulfonyl chloride as raw materials, and synthesizing
halogen-free DGEBA resin by taking
bisphenol and glycidyl
sulfonate as raw materials; the preparation method comprises the following steps: synthesizing phosphorylated modified resin by taking
halogen-free DGEBA resin and
phosphoryl chloride as raw materials; the preparation method comprises the following steps: uniformly stirring and melting
halogen-free DGEBA resin and phosphorylated modified resin, adding a cross-linking agent, and uniformly stirring to obtain a
resin matrix; the preparation method comprises the following steps: sequentially adding the
siloxane latent accelerator and the composite filler into the
resin matrix, stirring in vacuum, defoaming, adding the initiator, uniformly stirring, injecting into a mold, heating, curing, and cooling to
room temperature to obtain the filling
adhesive for
semiconductor packaging, the composite filler is prepared from KH550 modified FeNi
alloy particles.