Substrate-free reactive fiber conductive hot melt adhesive tape, glue for melt adhesive tape as well as preparation methods of melt adhesive tape and glue

A hot-melt tape, reactive technology, applied in the field of pressure-sensitive adhesives, can solve the problems of easy oxidation of metal materials, low conductivity, high density of conductive metal materials, etc., to achieve easy die-cutting and sizing process, good dispersion effect , the effect of high bonding strength

Active Publication Date: 2018-07-20
苏州世诺新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Conductive hot-melt adhesives should appear on the market in response to product demand. The existing conductive hot-melt adhesives achieve electrical conductivity by adding conductive metal materials to the hot-melt adhesive. These metal materials are easy to oxidize and expensive. Grinding is required before the system, and due to the high density of these conductive metal materials, precipitation often occurs during dispersion, the dispersion effect is not good, the electrical conductivity decreases, and the electrical conductivity is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Select 15 parts of thermoplastic polyurethane with softening point temperature of 70 °C, tensile strength of 20 MPa and elongation at break of 380 %; 25 parts of rosin glyceride with softening point temperature of 80 °C; 1 part of polyester resin with softening point temperature of 45 °C; 40 parts of ketone and 20 parts of ethyl acetate as a mixed solvent; 0.5 parts of conductive fibers with a diameter of 8 μm and a length of 400 μm; 2 parts of closed curing agent; 0.25 parts of wetting and leveling agent; 0.2 parts of stabilizer, 0.15 parts of defoamer, and 1 part of plasticizer.

[0033] Dissolve thermoplastic polyurethane, rosin glyceride and polyester resin in 55%, 15% and 30% solvents respectively, mix well after the three are completely dissolved, add dispersant, conductive fiber, plasticizer, defoaming agent in sequence Agent, leveling agent, oxidation stabilizer, sealed curing agent.

[0034] Use a vacuum stirring and degassing machine to degas the mixture in s...

Embodiment 2

[0038] 30 parts of thermoplastic polyurethane with softening point temperature of 120 °C, tensile strength of 30 MPa and elongation at break of 290 %; 30 parts of rosin glyceride with softening point temperature of 160 °C; 25 parts of polyester resin with softening point temperature of 80 °C; 40 parts of hexanone and 20 parts of acetone as a mixed solvent; 1.5 parts of conductive fibers with a diameter of 9 μm and a length of 340 μm; 3 parts of closed curing agent; 0.35 parts of wetting and leveling agent; 0.8 parts of dispersant; thermal oxidation stability 0.25 parts of agent; 0.3 parts of defoamer; 2.5 parts of plasticizer.

[0039] Dissolve thermoplastic polyurethane, rosin glyceride and polyester resin in 70%, 20% and 10% solvents respectively, mix well after the three are completely dissolved, add dispersant, conductive fiber, plasticizer, defoaming agent in sequence Agent, leveling agent, oxidation stabilizer, sealed curing agent.

[0040] Use a vacuum stirring and deg...

Embodiment 3

[0044] Select 28 parts of thermoplastic polyurethane with softening point temperature of 140 °C, tensile strength of 40 MPa and elongation at break of 550 %; 35 parts of rosin glyceride with softening point temperature of 135 °C; 30 parts of polyester resin with softening point temperature of 65 °C; acetone 38 parts and 35 parts of ethyl acetate as a mixed solvent; 1.2 parts of conductive fibers with a diameter of 10 μm and a length of 150 μm, 4 parts of closed curing agent; 0.4 parts of wetting and leveling agent; 0.3 parts of agent, 0.35 parts of defoamer, 2 parts of plasticizer.

[0045] Dissolve thermoplastic polyurethane, rosin glyceride and polyester resin in 60%, 25% and 15% solvent respectively, mix well after the three are completely dissolved, add dispersant, conductive fiber, plasticizer, defoaming agent in sequence Agent, leveling agent, oxidation stabilizer, sealed curing agent.

[0046] Use a vacuum stirring and degassing machine to degas the mixture in step (1)...

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Abstract

The invention discloses substrate-free reactive fiber conductive hot melt adhesive tape, glue for the melt adhesive tape as well as preparation methods of the melt adhesive tape and the glue. The preparation method of the glue comprises the steps of separately dissolving thermoplastic polyurethane, rosin glycerin ester and polyester resin into a solvent in advance, then evenly mixing the solutionsof thermoplastic polyurethane, rosin glycerin ester and polyester resin, adding conductive fibers, an enclosed type curing agent, a flatting agent, a dispersing agent, a thermal oxidation stabilizer,a defoaming agent and a plasticizer, and evenly stirring to obtain the substrate-free reactive fiber conductive hot melt glue; the preparation method of the substrate-free reactive fiber conductive hot melt adhesive tape comprises the steps of coating a substrate with the glue, heating for drying, and then rolling up to obtain the substrate-free reactive fiber conductive hot melt adhesive tape. The conductive hot melt glue solves the problem that the conventional hot melt glue can not conduct electricity, and has good adhesive property and electrical conductivity, thus being suitable for bonding the special parts of electronic products and conducting electricity.

Description

technical field [0001] The invention discloses a base material-free reactive fiber conductive hot-melt adhesive tape, its glue and a preparation method, and belongs to the field of pressure-sensitive adhesives. Background technique [0002] Traditional hot melt adhesives have limited heat resistance due to their thermoplastic nature and are prone to creep when heated, and their solvent resistance and chemical resistance are not ideal. Inspired by reactive adhesives, a reactive active group is introduced into the thermoplastic polyurethane molecule, and the hot melt adhesive composed of it is coated on the adherend, and the active group reacts to make it cross-linked, thereby improving the adhesion. Strength, heat resistance, solvent resistance, chemical resistance and creep resistance and other properties. Hot-melt polyurethane adhesive is a solvent-free polyurethane adhesive. It is solid at room temperature. It is heated to melt and sizing, and the adhesive layer is cooled...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/06C09J193/04C09J167/00C09J9/02C09J11/08C09J11/06C09J7/10
CPCC08L2205/035C09J7/00C09J9/02C09J11/06C09J11/08C09J175/06C09J193/04C09J2475/00C09J2493/00C08L75/06C08L67/00C08K5/29C08L93/04
Inventor 顾正青王淑凤计建荣
Owner 苏州世诺新材料科技有限公司
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