A compound containing phosphaazine group and maleimide group, epoxy resin material and its preparation method and application
A technology of maleimide group and epoxy resin, which is applied in the field of epoxy resin material and its preparation, compound field containing phosphazine group and maleimide group, can solve the flame retardant efficiency of flame retardant low thermal and mechanical properties of epoxy resin materials, etc., to achieve high flame retardant efficiency, good thermal and mechanical properties, and little influence on thermal and mechanical properties.
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Embodiment 1
[0059] Compound of Example 1 (DPPA-HPM)
[0060] This embodiment provides a compound (DPPA-HPM), which can be used as a novel high-efficiency phosphorus-containing heteroazine-based and maleimide-based flame retardant, and its name is 1-(4-hydroxyphenyl)-3-( 10-oxa-5-hydrogen-phosphazinyl-10-yl)pyrrolidin-2,5-dione, the structural formula is as formula (I):
[0061] .
[0062] The compound is prepared by the following preparation method:
[0063] (1) Add 0.30 mol of diphenylamine to a three-necked round-bottomed flask equipped with a mechanical stirrer, condenser and gas absorption device, and quickly add 0.32 mol of phosphorus trichloride, and start stirring. The reaction was stirred at room temperature for 30 min, then the temperature was slowly raised to 210 °C, and the reaction was continued to stir for 7 h. After cooling to room temperature, nitrogen gas was introduced to remove residual hydrogen chloride and phosphorus trichloride in the reaction flask to obtain a b...
Embodiment 2~5
[0067] Embodiment 2~5 flame retardant epoxy resin material
[0068] The compound DPPA-HPM prepared in Example 1 was applied to the epoxy resin material to prepare the flame retardant epoxy resin material. According to the weight percentage ratio in Table 1, the epoxy resin prepolymer E-51, the compound (flame retardant) DPPA-HPM, and the curing accelerator triphenylphosphine were stirred at 165 ºC for 1.5 h to obtain a homogeneous liquid. Then when the temperature of the system drops to 80 ºC, add 4,4'-diaminodiphenylmethane. After it dissolves, pour the sample into a preheated mold, place it in a vacuum drying oven to degas, and then put it in In the programmed blast drying oven, thermal curing was carried out according to the preset heating program of 80°C for 1 h, 150°C for 2 h, 180°C for 2 h, and 200°C for 2 h. Then cool naturally to room temperature, demould to obtain a flame retardant epoxy cured sample, and then polish the sample to a standard size to prepare the cured...
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Abstract
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