Composition containing high-phenyl-group polysiloxane, and packaging material or optical thin film comprising the composition

A high phenyl polysiloxane, polysiloxane technology, used in electrical components, circuits, semiconductor devices and other directions

Active Publication Date: 2018-07-27
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with LED packaging materials prepared by thermal curing, there are fewer reports on curing by ultraviolet curing.

Method used

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  • Composition containing high-phenyl-group polysiloxane, and packaging material or optical thin film comprising the composition
  • Composition containing high-phenyl-group polysiloxane, and packaging material or optical thin film comprising the composition
  • Composition containing high-phenyl-group polysiloxane, and packaging material or optical thin film comprising the composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] High phenylpolysiloxane (II-1) was prepared from diphenylsilanediol, phenyltrimethoxysilane, methacryloxypropyldimethylmethoxysilane.

[0100] (1) Under the protection of dry nitrogen, put 50ml of phenyltrimethoxysilane in a multi-necked flask equipped with a condenser tube and a dropping funnel, and mix 10 grams of diphenylsilanediol and 80 The mixed solution of 1.5 grams of tetrahydrofuran was added in batches to a multi-neck bottle, and ammonia gas was introduced at the same time; the reaction was stopped for 3 hours, and the ammonia gas was stopped, and the temperature was gradually raised to remove ammonia; after the reaction was stopped, distillation was concentrated and purified to obtain 20wt% siloxane intermediate solution;

[0101] (2) Add 10 grams (0.56 moles) of water to the siloxane intermediate solution in step (1), adjust the pH value of the system with ammonia water to 8; stir at 25°C to 80°C for 24 hours; remove the water from the reaction mixture , pu...

Embodiment 2

[0112] The high phenylpolysiloxane (II-1) obtained in Example 1 is added to methylphenyl silicone oil (methacryloyloxy terminated), photoinitiator 2-hydroxyl-2-methyl-1- Phenylacetone, antioxidant Irganox-1076, antioxidant Irgafos-168, and UV curing to prepare films.

[0113] 1 gram of high phenyl polysiloxane (II-1), 0.25 gram of methyl phenyl silicone oil (methacryloxy-terminated), 0.0125 g of initiator 2-hydroxyl-2-methyl-1 -Phenylacetone, 0.05g of antioxidant Irganox-1076, and 0.0125g of antioxidant Irgafos-168 were mixed evenly. The homogeneously mixed composition was placed at room temperature, and vacuumized in a vacuum drying oven for 30 minutes to remove air bubbles. After vacuum defoaming, it is placed in a mold. Under a high-pressure mercury lamp with a dominant wavelength of 365 nm and a nitrogen atmosphere, irradiate for 15 minutes to cure, and prepare a transparent film material with a thickness of 1 mm.

[0114] By FT-IR spectrogram, different from the high p...

Embodiment 3

[0120] Preparation of materials for LED chip packaging.

[0121] Add the phosphor powder (YGG-530, China Minmetals Corporation) of 10wt% (0.1325g) to the composition described in Example 2, drop it on the dried LED chip after defoaming, and the main wavelength is 365nm Irradiate under a high-pressure mercury lamp for 15 minutes to cure, and prepare the material for LED chip packaging.

[0122] According to the characterization result of the light extraction efficiency, the light extraction efficiency is 142lm / W.

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Abstract

The invention provides high-phenyl-group polysiloxane, a polysiloxane composition containing the high-phenyl-group polysiloxane, and a packaging material or an optical thin film, comprising the composition, and preparation methods and applications thereof. In the high-phenyl-group polysiloxane, molar percentage of phenyl group in organic groups, connected to silicon, in a main chain can reach morethan 50 mol%. The high-phenyl-group polysiloxane can be used for preparing a polysiloxane composition used for the packaging material or optical thin film, especially ultraviolet curing. The preparation method of the polysiloxane composition is simple and can achieve ultraviolet curing. The packaging material or optical thin film can be cured under ultraviolet light, wherein the obtained materialhas excellent optical property, can reach up to 1.64 in refractive index, is equal to or larger than 90% in transmittance within wavelength range of visible light, and has excellent heat resistance.According to thermogravimetic analysis, in a nitrogen atmosphere, temperature can optimally reach up to 480 DEG C when weightlessness is 5%.

Description

technical field [0001] The invention belongs to the field of encapsulation materials or optical films, in particular to a polysiloxane composition for an ultraviolet curable encapsulation material or optical film containing high phenyl polysiloxane, an LED encapsulation material or an optical film comprising the composition. Thin films and their methods of preparation and applications. Background technique [0002] Light-emitting diode (LED) is a kind of semiconductor diode, which can convert electric energy into light energy, has the advantages of power saving, long service life, etc., and is widely used in every corner of life. At present, in the LED industry, the development of high-efficiency, high-brightness, and small-size LED products is mostly the mainstream direction, but the increase in these demands will inevitably put forward higher requirements for the development of LED manufacturing processes. Among them, the study of LED packaging materials has important res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/14C08L83/06H01L33/56
CPCC08G77/14C08J5/18C08J2383/06C08J2483/06C08L83/06C08L2201/08C08L2201/10C08L2203/16C08L2203/206C08L2205/025H01L33/56C08L83/04
Inventor 曹新宇尚欣欣马永梅李晓郑鲲张京楠庄亚芳
Owner INST OF CHEM CHINESE ACAD OF SCI
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