Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same

A curable composition and wiring technology, which is applied in the fields of printed circuit manufacturing, coating, polyurea/polyurethane coating, etc., can solve the problem of narrowing the distance between wiring of flexible wiring boards, difficulty in forming a uniform film, and failure to meet Require performance and other issues to achieve the effect of good operability, high long-term electrical insulation reliability, and low warpage

Active Publication Date: 2018-08-03
NIPPON POLYTECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the curable external coating agent currently cannot meet the required performance in terms of flexibility and warpage caused by curing shrinkage.
[0004] For example, Patent Document 1 discloses a resin composition of blocked isocyanate and polyol using polybutadiene. Although the cured product is excellent in flexibility and shrinkage rate, it has insufficient heat resistance.
[0005] Patent Document 2 discloses a composition comprising a polyamide-imide resin obtained by reacting a polycarbonate diol with a diisocyanate compound and an amine-type epoxy resin. Isocyanate polyurethane, obtained by reacting with trimellitic acid, but there is a defect that the long-term reliability of the electrical characteristics of the cured product obtained from polyamide-imide resin and amine-type epoxy resin is insufficient.
[0006] Patent Document 3 discloses a composition comprising a carboxyl group-containing polyurethane polyimide and an epoxidized polybutadiene, but this composition has the following defect: when the solvent is removed by drying, the carboxyl group-containing polyurethane polyimide Imide and epoxidized polybutadiene tend to produce a phase separation structure, and it is difficult to form a uniform film
[0011] However, with the development of the semi-additive method, it is expected that the distance between the wirings of the flexible wiring board will be further narrowed (for example, below 20μm pitch)

Method used

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  • Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same
  • Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same
  • Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same

Examples

Experimental program
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Effect test

Embodiment

[0234] The following examples illustrate the present invention more specifically, but the present invention is not limited to the following examples.

[0235]

[0236] The solvent in the polyurethane solution used in the present invention (I) was distilled off under reduced pressure under heating to obtain component a.

[0237] Using the component a obtained by the above method, the acid value was measured by the potentiometric titration method according to JIS K0070.

[0238]The apparatus used in the potentiometric titration method is described below.

[0239] Device name: AT-510 potentiometric automatic titration device manufactured by Kyoto Electronics Industry Co., Ltd.

[0240] Electrode: Composite glass electrode C-173 manufactured by Kyoto Denshi Kogyo Co., Ltd.

[0241]

[0242] The number average molecular weight is a polystyrene-equivalent number average molecular weight measured by GPC, and the measurement conditions of GPC are as follows.

[0243] Device nam...

Embodiment 1～9、 comparative example 1 and comparative example 2

[0356] Using the curable compositions F1 to F11 and the curable compositions G1 and G2, evaluations of flexibility, disconnection suppression properties, warping properties, and long-term electrical insulation reliability were performed by the methods described below. The results are described in Table 5.

[0357]

[0358] On copper of a flexible copper-clad laminate (manufactured by Sumitomo Metal Mining Co., Ltd., grade name: Esperflex, copper thickness: 8 μm, polyimide thickness: 38 μm), the size is 75 mm in width and 110 mm in length. The curable composition F1 was applied by screen printing so that the film thickness was 15 μm, kept at room temperature for 10 minutes, and placed in a hot air circulation dryer at 120° C. for 60 minutes to be cured. Peel off the inner PET film of the prepared test piece, cut it into a strip with a width of 10mm with a cutter, bend it at about 180 degrees so that the cured film surface is on the outside, and compress it at 0.5±0.2MPa with ...

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Abstract

A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol / g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.

Description

technical field [0001] The present invention relates to a curable composition with little bleeding during screen printing, its cured product, an overcoat film obtained by curing the curable composition, and a flexible wiring board coated with the overcoat film and methods of manufacture thereof. Background technique [0002] In the past, the surface protective film of flexible wiring circuits was a type in which a polyimide film called a cover film was punched out with a mold matching the pattern, and then pasted with an adhesive; it was applied by a screen printing method A surface protection film having a flexible ultraviolet-curable or heat-curable topcoat, especially the latter, is useful in terms of handling. Resin compositions mainly composed of epoxy resins, acrylic resins, or composites thereof are known as these curing types of top coating agents. In particular, many of them mainly contain resins modified by introduction of butadiene skeleton, siloxane skeleton, p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/06C08G18/42C08K3/34C08K3/36C08L63/00C09D7/61C09D175/04
CPCC08K2003/267C08G18/3215C08G18/348C08G18/0823C08G18/4211C08G18/6659C08G18/664C08G18/758C08G18/4213C08G59/3227C09D175/04C09D7/60C08K3/36H05K3/285C08K3/042C08L63/00C08G18/4244C08K3/34C08L75/06C09D175/06H05K3/281C08G18/42C09D7/40C08G18/168C08K3/26C09D11/037C09D11/102H05K1/0271H05K1/028H05K1/0353H05K3/4644H05K2203/1105
Inventor 大贺一彦村田直树铃木快
Owner NIPPON POLYTECH CORP
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