Curved magnetron sputtering cathode, closed magnetic field coating magnetron sputtering equipment and application methods thereof

Abstract

The invention discloses a curved magnetron sputtering cathode, closed magnetic field coating magnetron sputtering equipment and application methods thereof. The curved magnetron sputtering cathode comprises a curved target material, a water jacket, an electrode, an insulating bush, a shielding component, a magnetic boot, a magnetic boot rotating component and a supporting and fixing mechanism, wherein the insulating bush performs potential insulation on a cathode component; the shielding component is a suspended potential component in a discharge process; and the magnetic boot rotating component can realize sliding of the magnetic boot. The utilization ratio of the magnetic material is improved; the curved target material is formed by splicing a plurality of metal-based tiles, of which thesurfaces can be bonded with nonmetals, and is fixed on the water jacket which is formed by welding the surface of a stainless steel tube with a water-cooled tube; the electrode is connected with a negative voltage to perform magnetron sputtering glow discharge; and limited by the shape of the cathode, electrons in glow discharge are gathered to produce a hollow cathode effect, so that not only the sputtering rate but also the particle ionization rate is improved. The curved magnetron sputtering cathode can perform magnetron sputtering in a high-vacuum state to generate big-beam high-ionization-rate particles so as to obtain a high-quality coating.

Description

technical field [0001] The invention belongs to the technical field of magnetron sputtering coating production equipment, and specifically refers to a curved surface magnetron sputtering cathode, closed magnetic field coating equipment and a preparation method applied to diamond-like coatings, optical films and decorative coatings. Background technique [0002] Magnetron sputtering technology is widely used in hardware decoration, optical glass coating, thin-film solar energy, nano-functional thin film, hard coating and other fields. It is the most widely used in physical vapor deposition (PVD) technology. Energetic particles bombard the surface of the target under the action of an electric field, and the atoms of the target obtain energy after cascading collision energy transfer, overflowing the surface of the target and depositing on the surface of the substrate to form a film or coating. During the sputtering process, the main function of the electrons in the plasma is to...

AI Technical Summary

Problems solved by technology

However, there are still many problems in the preparation process of diamond-like coatings

[0006] The existing DLC ​​deposition technologies are mainly physical vapor deposition (PVD) and chemical vapor deposition (CVD). PVD mainly includes ion beam deposition (IBD), magnetron sputtering, multi-arc ion plating, pulsed laser deposition, etc. CVD includes thermal Silk chemical vapor deposition and plasma chemically enhanced vapor deposition (PECVD) have some problems: ion beam deposition has low sputtering rate and low deposition rate due to graphite sputtering; magnetron sputtering deposition has low sputtering rate on the one hand and low On the one hand, low atomic energy leads to loose structure and low hardness; a large number of carbon particles will be produced during multi-arc ion plating deposition; pulsed laser deposition has high energy consumption, poor coating uniformity, and small effective deposition area; hot wire vapor deposition technology has high deposition temperature, The range of matrix materials is greatly limited; although PECVD effectively reduces the reaction temperature, the deposition efficiency is low during the deposition process, the ionization rate of carbon atoms is low, and the film quality structure is not dense enough

There are two limiting factors in the deposition of optical functional coatings by magnetron sputtering: on the one hand, the deposition rate is low, and during the deposition process, some metal elements (Al) are polluted by the impurities in the vacuum chamber, which cannot effectively form metallic luster reflections At the same time, the low deposition rate also leads to low production efficiency and high control costs; on the other hand, the ionization rate is low, and the formed film pores and other defects and structural compactness are not satisfactory

[0009] Although unbalanced magnetron sputtering can obtain dense and delicate hard coatings under certain process conditions, the low deposition rate limits the application of magnetron sputtering technology in hard coatings

At present, the preparation process of hard coating is mainly realized by arc ion plating, but the problem of large particles in the deposition process still hinders the wide and efficient application of hard coating in the tool and mold industry

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