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High-strength transparent polyamide-imide and its manufacturing method

A polyamide and imide technology, applied in the field of colorless and transparent polyamide-imide and its manufacture, can solve the problems of reduced thermal expansion coefficient, not meeting the basic requirements of the display, not meeting the requirements of the plastic substrate, etc., and achieving excellent transparency Effect

Active Publication Date: 2020-08-28
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, although polyimide is a high-performance polymer with excellent thermal stability, mechanical properties, chemical resistance, and electrical properties, it does not meet basic requirements in the display field, such as colorless transparency, and the coefficient of thermal expansion should be further reduced
For example, KAPTON sold by Dupont has a low thermal coefficient of about 30ppm / °C, but it also does not meet the requirements for plastic substrates

Method used

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  • High-strength transparent polyamide-imide and its manufacturing method
  • High-strength transparent polyamide-imide and its manufacturing method
  • High-strength transparent polyamide-imide and its manufacturing method

Examples

Experimental program
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Effect test

Embodiment 1

[0158] TFMB(1) / BPDA(0.18)_6FDA(0.02)_TPC(0.8)

[0159] Under a nitrogen atmosphere, 250 g of N,N-dimethylacetamide (DMAc) was filled into the reactor, and then 21.7 g of 2,2'-bis(trifluoro Methyl)-4,4'-biphenylenediamine (TFMB) was dissolved. Add 3.6 g of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and 0.6 g of 4,4'-(hexafluoroisopropylidene)dicarbonate to the TFMB solution at the same temperature Phthalic anhydride (6FDA) and dissolved under stirring for a predetermined period of time. After sufficient stirring, the temperature was lowered to 0° C., 11 g of terephthaloyl chloride (TPC) was added thereto, and stirring was continued to obtain a polyamide-imide precursor solution.

[0160] Pyridine and acetic anhydride were added to the solution and stirred well, then precipitated with a mixture of methanol and water. The precipitated polyamide-imide powder was dried and dissolved in DMAc to obtain a polyamide-imide precursor solution having a solid content of 13% by...

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Abstract

Provided in the present invention are polyamide-imide films having significantly enhanced mechanical physical properties and heat resistance while maintaining transparency. Polyamide-imide is excellent in transparency, heat resistance, mechanical strength, and flexibility, so it can be used in various fields including device substrates, cover substrates for displays, optical films, integrated circuit (IC) packages, Adhesive films, multilayer flexible printed circuits, tapes, touch panels and protective films for optical discs.

Description

technical field [0001] This application claims the benefit of priority from Korean Patent Application No. 10-2016-0050695 filed on Apr. 26, 2016, which is hereby incorporated by reference in its entirety for all purposes. [0002] The present invention relates to a colorless and transparent polyamide-imide having high-strength mechanical properties and a method for producing the same. Background technique [0003] Polyimide (PI) is a polymer with a relatively low degree of crystallinity or a substantially amorphous structure, and it has advantages such as simple manufacturing methods, easy processing to make thin films and no cross-linkable moieties necessary for curing, As well as polymeric properties such as high transparency, excellent heat and chemical resistance, excellent mechanical and electrical properties, and dimensional stability due to its rigid chain structure. Polyimides are now widely used as electrical and electronic materials in the automotive and aerospace...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/14C08G73/10C08J5/18C08L79/08
CPCC08G73/1039C08G73/1067C08G73/14C08J5/18C08J2379/08C09D179/08C08G73/1007C08G73/1064C08L79/08C08L2201/10
Inventor 尹哲民徐浚植金璟晙
Owner LG CHEM LTD
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