UV visbreaking composition, UV visbreaking film, and production method of film

Abstract

The invention relates to the technical field of protection films, and especially to a UV visbreaking composition, a UV visbreaking film, and a production method of the film. The UV visbreaking composition is mainly prepared from, by weight, 20-50% of acrylate pressure-sensitive adhesive resin, 1-30% of a multifunctional oligomer and / or a multifunctional monomer, 0.3-2% of a cross-linking agent, 0.1-5% of an antistatic agent, 0-2% of a dispersant, 0.2-2% of a leveling agent, 0.5-5% of a photoinitiator and 25-60% of a solvent. The UV visbreaking film comprises a substrate layer, a UV visbreakinglayer and a release film layer which are sequentially bonded, and the UV visbreaking layer is obtained by coating the surface of the substrate layer with the UV visbreaking composition, and drying and curing the UV visbreaking composition. The UV visbreaking composition has excellent adhesion, has high adhesion and high peel strength before UV irradiation, has low adhesion and low UV peel strength after the UV irradiation, and also has a good antistatic effect.

Description

technical field [0001] The invention relates to the technical field of protective films, in particular to a UV viscous reducing composition, a UV viscous reducing film and a preparation method thereof. Background technique [0002] In the semiconductor manufacturing process, when cutting and polishing semiconductor wafers, in order to reduce the defect density of silicon thin layers, wafer cutting and adhesion-reducing protective films are often used. Anti-adhesive protective film means that the adhesive force is strong when it is used, and the adhesive force is weakened for peeling in the later peeling process. [0003] At present, most of the anti-adhesive protective films on the market are UV anti-adhesive protective films, which means that they have high adhesive force and good adhesion before UV irradiation, and the adhesive force decreases significantly after UV irradiation and is easy to peel off. In the domestic market, most of the UV viscosifying adhesives used for...

AI Technical Summary

Problems solved by technology

In the domestic market, most of the UV viscosifying adhesives used for wafer cutting and picking process protection are mainly from Japan and Taiwan. There are also several domestic UV viscosifying adhesives that are developing and promoting, but their performance is not yet fully stable.

Moreover, the base material of the UV anti-adhesive protective film is prone to static electricity due to friction during use, and its use in the field of electronic parts with high static requirements is limited, such as easy to absorb dust, and then transferred to the attached product The surface, or the electrostatic voltage is too high, resulting in defective parts, etc.

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