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Magnetron sputtering method for plating silver on surface of copper contact

A technology of magnetron sputtering and copper contacts, which is applied in sputtering plating, ion implantation plating, vacuum evaporation plating, etc., and can solve the problems of unreliable bonding force of plating, highly toxic cyanide, and human injury , to achieve the effect of improving abnormal ablation phenomenon, low cost and improving binding force

Active Publication Date: 2018-08-31
XIAN FULAI ELECTRICAL ALLOY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method mainly has the following problems: electroplating silver is carried out in the cyanide electroplating solution, and cyanide is highly toxic, which is easy to cause harm to the human body and cause serious pollution to the environment
As one of the three major polluting industries in the world, the electroplating industry is facing more and more environmental protection pressure, so it is necessary to use a green and environmentally friendly coating process; limited by the process and pre-treatment, the coating bonding force is not reliable, and it is easy to fall off during the friction process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A pure copper contact with a density of 99.5% was selected as the base material, and the surface of the copper contact base was mechanically polished to a surface roughness of about 0.5 μm. Wash it with ion water, dry it with dry nitrogen and set it aside; place the copper contact base material on a special fixture, put the base surface upwards into the exchange chamber and vacuum the chamber to 1×10 -3 Pa; at the same time, put four silver targets in the sputtering chamber, adjust the inclination angle of each target to 30 degrees; and evacuate the sputtering chamber until the specified background vacuum reaches 5×10 -4 Pa; Introduce argon gas into the exchange chamber and adjust the air pressure to 2Pa, connect the radio frequency power supply and adjust its power to 150W glow to clean the contact surface for 60min; send the glow cleaned contact surface downward into sputtering After the cavity is filled with argon and the air pressure is adjusted to 0.2Pa, the sample...

Embodiment 2

[0034] A pure copper contact with a density of 99.5% was selected as the base material, and the surface of the copper contact base was mechanically polished to a surface roughness of about 0.5 μm. Wash it with ion water, dry it with dry nitrogen and set it aside; place the copper contact base material on a special fixture, put the base surface upwards into the exchange chamber and vacuum the chamber to 1×10 -4 Pa; at the same time, put four silver targets in the sputtering chamber, adjust the inclination angle of each target to 45 degrees; and evacuate the sputtering chamber until the specified background vacuum reaches 1×10 -5Pa; Introduce argon gas into the exchange chamber and adjust the air pressure to 1Pa, connect the RF power supply and adjust its power to 200W glow to clean the contact surface for 30min; transmit the glow-cleaned contact surface downward into sputtering After the cavity is filled with argon and the air pressure is adjusted to 0.5Pa, the sample plate is ...

Embodiment 3

[0036] Select a pure copper contact with a density of 99.5% as the base material, mechanically polish the surface of the copper contact base to a surface roughness of about 0.5 μm, and then immerse it in acetone, absolute ethanol, and deionized water for 10 minutes for ultrasonic cleaning Take it out and dry it with dry nitrogen for use; place the copper contact substrate material on a special fixture, put the substrate surface upwards into the exchange chamber and vacuum the chamber to 1×10 -4 Pa; at the same time, put four silver targets in the sputtering chamber, adjust the inclination angle of each target to 45 degrees; and evacuate the sputtering chamber until the specified background vacuum reaches 1×10 -5 Pa; Introduce argon gas into the exchange chamber and adjust the air pressure to 1Pa, connect the radio frequency power supply and adjust its power to 180W glow to clean the contact surface for 40min; send the glow cleaned contact surface downward into sputtering After...

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PUM

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Abstract

The invention discloses a magnetron sputtering method for plating silver on the surface of copper contact, wherein the method comprises the steps: carrying out mechanical polishing, cleaning and drying of a copper contact substrate material; putting into a vacuum chamber, carrying out ion cleaning, and directly depositing a silver film on the surface of the copper contact substrate by a magnetronsputtering principle; and finally, carrying out annealing treatment. The silver film obtained by the method has the advantages of good binding with the substrate, uniform thickness of a film layer, nano-scale grain size, fast deposition rate, low surface roughness and good contact resistance, improves ablation resistance and prolongs the service life. Compared with a traditional electroplating method, the method has the advantages of fewer working procedures, high efficiency, green environmental protection, good binding force of a plating layer, simple equipment, convenient operation, and goodindustrial application prospect.

Description

technical field [0001] The invention relates to a magnetron sputtering method for plating silver on the surface of a copper contact. The magnetron sputtering technology is used to directly deposit a silver film on the surface of a copper contact. The method obtains lower surface roughness, remarkably improves the surface contact resistance of electrical contacts, improves ablation resistance, and improves service life, and belongs to the technical field of material surface treatment and modification. Background technique [0002] In the field of low-voltage electrical appliances and switches, copper metal is widely used as an electrical contact contact material due to its high conductivity, ease of processing and low cost. The role of copper oxide will be formed, which greatly reduces the contact resistance and service life. Compared with copper, silver has better electrical conductivity and contact resistance, as well as lubricity, wear resistance, and weldability, and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/02C23C14/16C23C14/58
CPCC23C14/022C23C14/165C23C14/35C23C14/5806
Inventor 何建国何美荣宋忠孝高磊雯
Owner XIAN FULAI ELECTRICAL ALLOY
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