Highly heat-resistant ultralow-expansion polyimide film and preparation method and application thereof

A polyimide film and polyimide technology, which is applied in the field of polyimide, can solve the problems of low thermal expansion coefficient and heat resistance of polyimide film, so as to improve the packing density and achieve good super performance. Low coefficient of expansion, the effect of reducing the coefficient of thermal expansion

Active Publication Date: 2018-10-16
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above analysis, the present invention aims to provide a high heat-resistant ultra-low expansion polyimide film and its preparation method and application, in order to solve the low thermal expansion coefficient and good heat resistance of the existing polyimide film The problem of incompatibility, especially the problem of high heat resistance and ultra-low expansion coefficient (<5ppm / ℃) in a wide temperature range (30-350°C)

Method used

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  • Highly heat-resistant ultralow-expansion polyimide film and preparation method and application thereof
  • Highly heat-resistant ultralow-expansion polyimide film and preparation method and application thereof
  • Highly heat-resistant ultralow-expansion polyimide film and preparation method and application thereof

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Experimental program
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Effect test

Embodiment 1

[0053] (1) Under the protection of an inert gas, add 17.30 grams (0.05 moles) of N,N'-bis(4-aminophenyl)-terephthalamide to a three-necked flask equipped with mechanical stirring, nitrogen inlet and outlet, and a thermometer and 110 grams of N-methylpyrrolidone (NMP), stirring at room temperature until completely dissolved; lowering the system to a low temperature of -10°C, adding 10.91 grams (0.05 moles) of 1,2,4,5-pyromellitic dianhydride, After complete dissolution, stir at low temperature for 24 hours to obtain a homogeneous polyamic acid homogeneous solution with a viscosity of 20,000 cP and a solid content of about 20 wt.%.

[0054] (2) The polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then coated on a dry glass plate with a flat and smooth surface, placed in an oven and heated and solidified under a nitrogen atmosphere, specifically 60°C / 2 hours, 180°C / 1 hour, and 350°C / 1 hour. After cooling down to room temperature, the subs...

Embodiment 2

[0058] (1) Under the protection of an inert gas, add 17.79 grams (0.0475 moles) of N,N'-bis(4-amino-2-methylphenyl)- Terephthalamide and 290 grams of N,N'-dimethylacetamide (DMAc), stirred at room temperature until completely dissolved; the system was lowered to -5°C, and 14.71 grams (0.05 moles) of 3,3', 4,4'-biphenyltetracarboxylic dianhydride was completely dissolved and then stirred at low temperature for 15 hours to obtain a homogeneous polyamic acid homogeneous solution with a viscosity of 13000 cP and a solid content of about 10 wt.%.

[0059] (2) The polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then coated on a dry glass plate with a flat and smooth surface, placed in an oven and heated and solidified under a nitrogen atmosphere, specifically 80°C / 1.5 hours, 200°C / 2 hours, and 350°C / 1 hour. After cooling down to room temperature, the substrate is soaked in deionized water, the film is automatically peeled off and placed in ...

Embodiment 3

[0063] (1) Under the protection of an inert gas, add 18.17 g (0.0525 moles) of N,N'-(1,4-phenylene)-bis(4- aminobenzamide) and 150 grams of N-methylpyrrolidone (NMP), stirred at room temperature until completely dissolved; the system was lowered to a low temperature of 0°C, and 14.71 grams (0.05 moles) of 3,3',4,4'-bis Benzophenone tetra-acid dianhydride is completely dissolved and stirred at low temperature for 12 hours to obtain a homogeneous polyamic acid homogeneous solution with a viscosity of 16500 cP and a solid content of about 18 wt.%.

[0064] (2) The polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then coated on a dry stainless steel plate with a flat and smooth surface, placed in an oven and heated and solidified under a nitrogen atmosphere, specifically 100°C / 1 hour, 250°C / 1 hour, and 350°C / 0.5 hour. After cooling down to room temperature, the substrate is soaked in deionized water, the film is automatically peeled off an...

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Abstract

The invention relates to a highly heat-resistant ultralow-expansion polyimide film and a preparation method and application thereof, which belong to the technical field of polyimide and solve the problem that the polyimide film in the prior art can not have both low thermal expansion coefficient and good heat resistance, particularly the problem that the polyimide film in the prior art can not have both high heat resistance and ultralow expansion coefficient within a wide temperature range. According to the highly heat-resistant ultralow-expansion polyimide film, a linear rigid unit and a polar amide group are contained in the molecular main chain structure of polyimide; and preparation raw materials include aromatic dianhydride and diamine with an amide structure. According to the preparation method, aromatic diamine is dissolved in organic solvent, aromatic dianhydride is added, and thereby a homogeneous phase polyamic acid solution is obtained; the homogeneous phase polyamic acid solution is coated, solidified, stripped, dried and annealed, and thereby the polyimide film is obtained. The highly heat-resistant ultralow-expansion polyimide film and the preparation method and application thereof realize application in the fields of electronics, microelectronics, optical display, optical communication and the like, particularly wide application in the field of flexible photoelectronics.

Description

technical field [0001] The invention relates to the technical field of polyimide, in particular to a high heat-resistant ultra-low expansion polyimide film and its preparation method and application. Background technique [0002] In the fields of optoelectronic display and optical communication, flexible, curly, lightweight, thin and wearable devices are the future development trend. At present, flexible liquid crystal displays (LCDs), flexible organic electroluminescent devices (OLEDs), and flexible solar cells have become research hotspots. In order to realize the flexibility and thinning of optoelectronic devices, it is necessary to find polymer films with excellent comprehensive properties to replace traditional hard optical glass substrates. [0003] Polyimide has outstanding heat resistance, mechanical properties, insulation properties and other characteristics, and has been widely used in the fields of flexible electronics, microelectronics and optoelectronics. Howe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/10
CPCC08G73/1064C08G73/1067C08J5/18C08J2379/08
Inventor 翟磊白兰范琳何民辉莫松
Owner INST OF CHEM CHINESE ACAD OF SCI
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