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Polyimide precursor composition, method for producing polyimide resin, and polyimide resin

A technology of polyimide precursor and polyimide resin, which is applied in the field of polyimide precursor composition, can solve the problems of high skin permeability, high biological toxicity burden, and large environmental burden, and achieve peelability Excellent, excellent coatability and storage stability, excellent solvent resistance and water resistance

Active Publication Date: 2018-11-13
JFE CHEMICAL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, these solvents have been pointed out that they are toxic to reproduction, generate nitrogen oxides and sulfur oxides during combustion, and have a large environmental burden, and there are problems that they cannot be handled without special equipment and protective equipment.
[0005] The polyimide precursor is often unstable to water. In the case of an aqueous composition using water as a solvent or dispersion medium, it is difficult to maintain properties suitable for coating without gelation and precipitation. Problems in workability and storage stability when applying and drying the composition
[0006] However, N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethylmethylene Aprotic polar solvents such as sulfone have high skin permeability due to polar groups, are biologically toxic, and have high environmental burdens such as nitrogen oxides when burned
In addition, since these organic solvents are relatively expensive solvents, they cause an increase in production costs.

Method used

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  • Polyimide precursor composition, method for producing polyimide resin, and polyimide resin
  • Polyimide precursor composition, method for producing polyimide resin, and polyimide resin
  • Polyimide precursor composition, method for producing polyimide resin, and polyimide resin

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preparation example Construction

[0206] [Manufacturing method of polyimide precursor composition]

[0207] The preparation method of the polyimide precursor composition of this invention is not specifically limited, For example, it can prepare by implementing the 1st process and 2nd process of the manufacturing method of the polyimide resin of this invention mentioned later.

[0208] [Manufacturing method of polyimide resin]

[0209] The manufacturing method of the polyimide resin of this invention contains the following 1st process, 2nd process, and 3rd process.

[0210] In addition, the manufacturing method of the polyimide resin of this invention also includes using the polyimide precursor composition of this invention instead of the polyimide precursor composition prepared by carrying out a 1st process and a 2nd process. Manufacturing method of polyimide resin.

[0211] 〈The first process〉

[0212] In the first step, a cyclic unsaturated ether compound represented by the following formula (A) (hereinaf...

Embodiment 1

[0329]

[0330] 2,3,3,4-Biphenyltetracarboxylic acid (2.9 g) and water (35.0 g) were added to a detachable flask (100 mL; cylinder type) equipped with a stirrer, stirred and mixed at 25° C. for 10 minutes, and then 2,3-Benzofuran (1.0g) was added, and it stirred and mixed at 25 degreeC for 45 minutes, and obtained the aqueous dispersion liquid of the tetracarboxylic-acid derivative.

[0331] Styrene acrylic polyamine (manufactured by Nippon Shokubai Co., Ltd., Polyment (trademark) NK-200PM; non-volatile content 56% by mass, amine value 2.55mmol / g-solid; m=60) was added to the obtained aqueous dispersion ( 10.0 g), isophthalic acid dihydrazide (0.5 g), and stirred and mixed at 25° C. for 2 hours to obtain a milky white dispersion liquid (polyimide precursor composition) of a polyimide precursor.

Embodiment 2

[0333]

[0334] Water (35.3g) was used instead of water (35.0g), and 2,3-dihydrofuran (0.7g) was used instead of 2,3-benzofuran (1.0g), except that, as in Example 1 Similarly, a milky white dispersion liquid (polyimide precursor composition) of a polyimide precursor was obtained.

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Abstract

Provided are: a polyimide precursor composition comprising a hemiacetal ester compound represented by formula (1), a polyamino compound having at least two primary amino groups per molecule, and an aqueous medium, the polyamino compound containing a hydrazide compound; a method for producing a polyimide resin; and a polyimide resin.

Description

technical field [0001] The present invention relates to a polyimide precursor composition, a method for producing a polyimide resin, and a polyimide resin. Background technique [0002] Polyimide is one of the super engineering plastics. Compared with other polymer materials, polyimide not only boasts high heat resistance, but also has extremely excellent performance in terms of mechanical strength and chemical resistance. In addition, it has a low dielectric constant, excellent electrical insulation, rich elongation characteristics, and a small thermal expansion coefficient. Therefore, it has been widely used in industrial products such as insulating layers of electronic circuits and adhesives carrying conductive materials. [0003] Generally, polyimide lacks solubility in solvents and is difficult to process. Therefore, in many cases, it is used in the state of a composition containing a precursor, molded into a desired shape, and then heated to obtain polyimide. imine. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/14C08L79/08
CPCC08G73/14C08L79/08
Inventor 小林正典
Owner JFE CHEMICAL CORP