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Diamond grinding pad and its preparation process

A preparation process and diamond technology, applied in the field of grinding pads, can solve the problems of scratched surface quality, scratches, and good smoothness, and achieve the effects of good stability of grinding efficiency, improved grinding efficiency and low surface roughness.

Active Publication Date: 2020-09-25
黄文魁
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Domestic traditional grinding and processing enterprises all adopt the free abrasive process. This process has problems such as low efficiency, poor stability, and high cost. Using a new type of diamond grinding pad with cooling liquid can achieve easy operation, high production efficiency, good stability, and can effectively reduce energy consumption. , waste discharge, cost saving, and truly energy saving and environmental protection; and the Mohs hardness of superhard materials such as sapphire and ceramics is about 9, and only diamond materials with a Mohs hardness of 10 can be ground, so the development of diamond grinding The demand for materials is increasing
[0004] The shape of artificial single crystal diamond is irregular, and it is easy to introduce scratches during the grinding process.
In addition, in the ordinary grinding process, when the particles are large, the cutting force is large, but the grinding is easy to cause scratches and scratches, and the surface quality is poor. When the particles are small, the cutting force is small but the finish is good.

Method used

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preparation example Construction

[0029] The invention also discloses a preparation process of a diamond grinding pad, comprising the following steps:

[0030] (1) Preparation of diamond group abrasives: Firstly, single-grain diamond, adhesive and filler are mixed and dispersed uniformly; then spherical aggregates are obtained by spray drying, fluidized bed or sol-gel method; then the spherical aggregates are solidified And sieve to obtain diamond group abrasives with suitable particle size. The curing method is light curing or thermal curing; the adhesive used in the preparation of diamond group abrasives is inorganic or organic adhesive, or ceramic adhesive, metal bond, UV glue or epoxy resin, and all fillers are calcium carbonate, limestone, One or more of wollastonite and silica.

[0031] (2) Preparation of abrasive layer: Mix and disperse the diamond group abrasive prepared in step (1) with adhesive and filler evenly; after fully dispersed, vacuumize to eliminate air bubbles to obtain the required slurry...

Embodiment 1

[0035] A specific structure of a diamond grinding pad, including a substrate 10 and an abrasive layer 20 arranged on the surface of the substrate 10, the abrasive layer 20 includes the following mass percentage raw materials: 8% diamond group abrasive, 72% adhesive, and the remainder is filler ; Wherein the diamond group abrasive is formed by a single-grain diamond group.

[0036] The particle size of the diamond group abrasive is 50-80 μm. The single-grain diamond is single crystal diamond, which is treated with a surface modifier and acid-base, the adhesive is an inorganic adhesive, and the filler is calcium carbonate. And, the abrasive layer 20 is pasted and fixed on the surface of the substrate 10 through the adhesive layer 30 , and the bottom surface of the substrate 10 is covered with a back adhesive layer 40 for mounting and fixing with the outside.

[0037] The invention also discloses a preparation process of a diamond grinding pad, comprising the following steps:

...

Embodiment 2

[0045] A specific structure of a diamond grinding pad, including a substrate 10 and an abrasive layer 20 arranged on the surface of the substrate 10, the abrasive layer 20 includes the following mass percentage raw materials: 5% diamond group abrasive, 70% adhesive, and the remainder is filler ; Wherein the diamond group abrasive is formed by a single-grain diamond group.

[0046]The particle size of the diamond group abrasive is 50-80 μm. The single-grain diamond is single-crystal diamond, which is treated with a surface modifier and acid-base, the adhesive is an organic adhesive, and the filler is limestone. And, the abrasive layer 20 is pasted and fixed on the surface of the substrate 10 through the adhesive layer 30 , and the bottom surface of the substrate 10 is covered with a back adhesive layer 40 for mounting and fixing with the outside.

[0047] The invention also discloses a preparation process of a diamond grinding pad, comprising the following steps:

[0048] (1)...

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Abstract

The invention discloses a diamond polishing pad and a preparation process thereof. The diamond polishing pad comprises a substrate and an abrasive layer arranged on the surface of the substrate. The abrasive layer comprises the following raw materials of, by mass, 5-10% of diamond cluster abrasive, 70-75% of adhesive and the balance filler, wherein the diamond cluster abrasive is composed of single-grain diamond clusters. The diamond polishing pad prepared through the formula and the process, is high in removal amount, the cutting force is ensured, the grinding efficiency is effectively improved, the grinding efficiency and stability are better, the service life is greatly prolonged, meanwhile, the surface roughness of machined products is lower, the surface quality of the machined products is greatly improved, and the diamond polishing pad is worthy of application and popularization.

Description

technical field [0001] The invention relates to the technology in the field of grinding pads, in particular to a diamond grinding pad and a preparation process thereof. Background technique [0002] With the rapid development of semiconductor chip substrates, the high-speed signal transmission of 5G networks requires demetallization of communication devices, signal receiving terminals, etc. Superhard materials such as ceramics, high-strength glass, and sapphire will gradually replace metals in communication due to their excellent performance. The role of the field, and the use of these superhard materials also put forward higher requirements for its processing. [0003] Domestic traditional grinding and processing enterprises all adopt the free abrasive process. This process has problems such as low efficiency, poor stability, and high cost. Using a new type of diamond grinding pad with cooling liquid can achieve easy operation, high production efficiency, good stability, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/22
CPCB24B37/22
Inventor 彭立龙
Owner 黄文魁
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