Ultra-low-expansion fluorine-containing polyimide thin film and preparation method and application thereof

A technology of polyimide film and polyimide, which is applied in the field of polyimide, can solve the problem of reducing the coefficient of linear thermal expansion, the mechanical properties of polyimide film, and the performance of water absorption rate, and the linear thermal expansion coefficient is not low enough. and other problems, to achieve the effect of reducing thermal expansion coefficient, low water absorption, and ultra-low linear thermal expansion coefficient

Active Publication Date: 2018-11-23
INST OF CHEM CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of above-mentioned analysis, the present invention aims to provide a kind of ultra-low expansion fluorine-containing polyimide film and its preparation method and application, in order to solve existing polyimide film in wide temperature range (30

Method used

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  • Ultra-low-expansion fluorine-containing polyimide thin film and preparation method and application thereof
  • Ultra-low-expansion fluorine-containing polyimide thin film and preparation method and application thereof
  • Ultra-low-expansion fluorine-containing polyimide thin film and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] (1) At room temperature and under the protection of an inert gas, add 19.12 grams (0.05 moles) of N,N'-bis(2-fluoro-4-aminophenyl) to a three-necked flask equipped with mechanical stirring, nitrogen inlet and outlet, and a thermometer Terephthalamide and 270 grams of N-methylpyrrolidone (NMP), stirred until completely dissolved; the system was lowered to a low temperature of -5°C, and 11.12 grams (0.051 moles) of 1,2,4,5-pyromellitic acid was added After the dianhydride was completely dissolved, it was stirred at low temperature for 18 hours to obtain a polyamic acid homogeneous solution with a solid content of 10 wt.%.

[0056] (2) The polyamic acid homogeneous solution polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then it is coated on a dry glass plate with a flat and smooth surface, placed in an oven and heated in a nitrogen atmosphere The curing is carried out at elevated temperatures, specifically 60°C / 2 hours, 180°C / 1.5 ...

Embodiment 2

[0060] (1) Under the protection of an inert gas, add 22.92 grams (0.0475 moles) of N,N'-bis(2-trifluoromethyl-4-aminophenyl ) terephthalamide and 110 grams of N,N'-dimethylacetamide (DMAc), stirred at room temperature until completely dissolved; lowered the system to a low temperature of 0°C, and added 13.41 grams (0.05 moles) of 2,3,6 , 7-naphthalene tetracarboxylic dianhydride (BNDA), after completely dissolving, stir at low temperature for 24 hours to obtain a polyamic acid homogeneous solution with a solid content of 25wt.%.

[0061] (2) The polyamic acid homogeneous solution polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then it is coated on a dry glass plate with a flat and smooth surface, placed in an oven and heated in a nitrogen atmosphere The curing is carried out at elevated temperatures, specifically 80°C / 1 hour, 200°C / 1 hour, and 350°C / 2 hours. After cooling down to room temperature, the substrate is soaked in deionized ...

Embodiment 3

[0065] (1) Under the protection of an inert gas, add 20.92 grams (0.05 moles) of N,N'-bis(2,5-difluoro-4-aminophenyl ) terephthalamide and 200 grams of N,N'-dimethylformamide (DMF), stirred at room temperature until completely dissolved; lowered the system to a low temperature of 5°C, and added 14.71 grams (0.05 moles) of 3,3,4 , 4-biphenyltetracarboxylic dianhydride (s-BPDA), was completely dissolved and stirred at low temperature for 20 hours to obtain a polyamic acid homogeneous solution with a solid content of 15wt.%.

[0066] (2) The polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then coated on a dry stainless steel plate with a flat and smooth surface, placed in an oven and heated in a nitrogen atmosphere The curing is carried out at elevated temperatures, specifically 100°C / 1 hour, 250°C / 2 hours, and 350°C / 1 hour. After cooling down to room temperature, the substrate is soaked in deionized water, the film is automatically peel...

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Abstract

The invention relates to an ultra-low-expansion fluorine-containing polyimide thin film and a preparation method and application thereof, belongs to the technical field of polyimide, and solves the problem that in the prior art, a linear thermal expansion coefficient of a polyimide thin film in a wide temperature range is not low enough and when the linear thermal expansion coefficient is reduced,other performances of the polyimide thin film are difficult to obtain concurrently. According to the ultra-low-expansion fluorine-containing polyimide thin film, a molecule main chain structure of polyimide comprises a linear rigid unit, a polar amide group and a fluorine-containing group; preparation raw materials comprise aromatic dianhydride and diamine with the amide group and the fluorine-containing group. The preparation method comprises dissolving the aromatic diamine with the amide group and the fluorine-containing group, and adding the aromatic dianhydride to obtain polyamic acid homogeneous solution; carrying out film coating, curing, stripping and drying; tiling the product on a substrate, and carrying out fixing and annealing processing to obtain the polyimide thin film. The ultra-low-expansion fluorine-containing polyimide thin film and the preparation method and the application thereof implement wide application in the field of electronic and flexible display.

Description

technical field [0001] The invention relates to the technical field of polyimide, in particular to an ultra-low expansion fluorine-containing polyimide film and its preparation method and application. Background technique [0002] In the fields of optoelectronic display and optical communication in the future, devices will gradually show the development trend of flexibility, curling, light weight, thinning and wearable, such as flexible liquid crystal display (LCD), flexible organic electroluminescent device (OLED) , flexible solar cells, etc., and related electronic and optical devices are facing new requirements such as weight reduction, thinning, and flexibility. In order to meet the development requirements of the above-mentioned many fields, polyimide film materials with good comprehensive properties have been widely used. [0003] However, the thermal dimensional stability of traditional polyimide films is not ideal. Usually, the coefficient of linear thermal expansio...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1007C08G73/1039C08G73/1067C08J5/18C08J2379/08
Inventor 范琳白兰翟磊何民辉莫松
Owner INST OF CHEM CHINESE ACAD OF SCI
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