A kind of metal coating and its preparation method and application

A technology of metal plating and gold layer, applied in metal material coating process, metal pattern material, coating, etc., can solve the problems of difficult application of gold layer, interdiffusion of palladium layer, low density of nickel layer, etc., and achieve the preparation method Simple and easy to solve the effect of mutual diffusion

Active Publication Date: 2021-07-16
深圳市化讯半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] CN105543818A discloses a method and equipment for optimizing the chemical nickel-palladium-gold coating, which solves the problem of how to press the solder paste into the die hole of the steel template evenly and quickly within the scope of the equipment, but does not solve the problem of nickel-palladium-gold coating in essence. The problem that gold process exists; CN105112892A discloses a kind of electroless nickel-palladium-gold process for printed circuit board, comprises the steps such as degreasing-microetching-presoaking-activation-chemical nickel-chemical palladium-chemical gold; CN102956604A provides A thin nickel-palladium-gold plating layer and a packaging structure formed by the plating layer with wires and its preparation method
Although the nickel-palladium-gold process can meet the coating requirements of various packaging processes, there are still some problems, such as the low density of the nickel layer and high porosity, and the possibility of mutual diffusion between the palladium layer and the substrate copper. problems; and there is also the problem that the material hardness increases and the ductility decreases due to the high hardness of the metal nickel, which makes it impossible to successfully bond the copper wire or the copper-palladium wire in the follow-up, and the problem that it is difficult to apply a gold layer on the palladium layer, etc.

Method used

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  • A kind of metal coating and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A metal coating such as figure 1 As shown, the metal plating layer (2) is located on the substrate (1), and there are palladium layer (201), nickel layer (202) and gold layer (203) in sequence from bottom to top.

[0035] The preparation method is as follows:

[0036] (1) Degreasing: Soak in acidic degreasing solution at 35-45°C for 2-3 minutes, then wash with water;

[0037] (2) Microetching: Soak in a mixed solution of sodium persulfate (60g / L) and sulfuric acid (20mL / L) for 1-2min at room temperature, then wash with water;

[0038] (3) Activation: use activator (10ppm Pd 2+ (complexed palladium salt), 5ppm surfactant, 30ppm complexing agent, sulfuric acid to adjust the pH to 1-1.5), activate at room temperature for 1-2min, and then wash with water;

[0039] (4) Electroless palladium: use electroless palladium plating solution (about 0.1g / L palladium salt, with 0.5-1g / L nitrogen-containing heterocyclic organic complexing agent, using sodium hypophosphite as reducin...

Embodiment 2

[0043] A metal coating, which is located on the substrate, from bottom to top is palladium layer, nickel layer and gold layer.

[0044] The difference between the preparation method and Example 1 is that in the present embodiment, the method of step (4) palladium plating layer is different, and in the present embodiment, the plating method of the palladium layer is electroplating palladium: utilize palladium electroplating solution (network Palladium salt 15g / L; NH 4 SO 4 80g / L; (NH 4 ) 2 HPO 4 60g / L; sulfamic acid 1g / L; urea 10g / L) at 45-55°C.

Embodiment 3

[0046] A metal coating, which is located on the substrate, from bottom to top is palladium layer, nickel layer and gold layer.

[0047]The difference between the preparation method and Example 1 is only that, in the present embodiment, the method of step (5) nickel plating layer is different, and in the present embodiment, the plating method of the nickel layer is electroplating: adopt nickel electroplating solution (nickel sulfate 280g / L; Nickel Chloride 40g / L; Boric Acid 45g / L; Cylinder 9mL / L; Brightener 0.2mL / L; pH 4.2) Plating at 50-60°C.

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Abstract

The invention provides a metal coating and its preparation method and application. The metal coating is located on a substrate, and consists of a palladium layer, a nickel layer and a gold layer from bottom to top. The invention provides a new protective layer for metal plating. The nickel layer is placed between the palladium layer and the gold layer. On the one hand, it can solve the problem that the gold layer is difficult to be plated on the palladium layer. Problems such as interphase diffusion of metals due to low layer density.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, and relates to a metal coating and its preparation method and application. Background technique [0002] In the electronic packaging industry, including surface treatment processes such as wafer-level packaging, IC substrates, PCBs, and FPCs, the chemical nickel-gold process proposed in the 1980s, the coating formed by chemical immersion gold has good oxidation resistance and electrical conductivity. , nickel is used as a barrier layer to prevent the interdiffusion of copper and gold, but the nickel layer of chemical nickel gold is low in density, and there are often quality problems of missed plating, gold penetration, black nickel or white gold layer; then the chemical nickel palladium The gold surface treatment process is a further development of the chemical nickel-gold process. The chemical palladium layer is added between the chemical nickel plating layer and the immersion gold la...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/02C23C18/32C23C18/42C25D5/12H05K1/09H05K3/24H01L21/02
CPCC23C18/165C23C18/32C23C18/42C23C28/021C23C28/023C25D5/12H01L21/02697H05K1/09H05K3/24H05K3/241
Inventor 苏星宇黄明起刘强夏建文陈元甫
Owner 深圳市化讯半导体材料有限公司
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