Superlattice structure and delta doping-based efficient light-emitting diode and preparation method
A light-emitting diode and superlattice technology, applied in the field of microelectronics, can solve the problems of low ionization rate, low luminous efficiency of LED, and difficulty, and achieve the effect of improving ionization rate and improving luminous efficiency.
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Embodiment 1
[0029] Example 1, preparing a deep ultraviolet light-emitting diode with an emission wavelength of 270nm.
[0030] In step one, the substrate is pretreated.
[0031] 1a) After cleaning the c-plane sapphire substrate, place it in the metal organic chemical vapor deposition MOCVD reaction chamber, and reduce the vacuum degree of the reaction chamber to 2×10 -2 Torr: Introduce hydrogen gas into the reaction chamber, and under the condition that the pressure of the MOCVD reaction chamber reaches 20 Torr, heat the substrate to a temperature of 900°C and keep it for 10 minutes to complete the heat treatment of the substrate;
[0032] 1b) The heat-treated substrate is placed in a reaction chamber at a temperature of 1000° C., and ammonia gas with a flow rate of 3500 sccm is passed in for 5 minutes to carry out nitriding to complete the nitriding.
[0033] Step 2, using the MOCVD process to grow a high-temperature AlN layer, such as figure 2 (a).
[0034] Adjust the temperature of...
Embodiment 2
[0047] Example 2, preparing a deep ultraviolet light-emitting diode with an emission wavelength of 290nm
[0048] Step 1, pretreating the substrate.
[0049] 1.1) Place the cleaned c-plane sapphire substrate in the metal organic chemical vapor deposition MOCVD reaction chamber, and reduce the vacuum degree of the reaction chamber to 2×10 -2 Torr: Introduce hydrogen gas into the reaction chamber, and under the condition that the pressure of the MOCVD reaction chamber reaches 760 Torr, the substrate is heated to a temperature of 1200° C. and kept for 5 minutes to complete the heat treatment of the substrate.
[0050] 1.2 Place the heat-treated substrate in a reaction chamber at a temperature of 1100° C., pass through ammonia gas with a flow rate of 3800 sccm, and carry out nitriding for 3 minutes to complete nitriding.
[0051] Step 2, using the MOCVD process to grow a high-temperature AlN layer, such as figure 2 (a).
[0052] Adjust the temperature of the reaction chamber t...
Embodiment 3
[0065] Example 3, preparing an ultraviolet light-emitting diode with an emission wavelength of 330 nm.
[0066] Step A, pretreating the substrate.
[0067] After the c-plane sapphire substrate was cleaned, it was placed in the metal organic chemical vapor deposition MOCVD reaction chamber, and the vacuum degree of the reaction chamber was reduced to 2×10 -2 Torr: Introduce hydrogen gas into the reaction chamber, and under the condition that the pressure of the MOCVD reaction chamber reaches 400 Torr, heat the substrate to a temperature of 1000°C and keep it for 8 minutes to complete the heat treatment of the substrate substrate; then heat-treated the substrate Place in a reaction chamber with a temperature of 1080° C., pass through ammonia gas with a flow rate of 3500 sccm, and carry out nitriding for 4 minutes to complete nitriding.
[0068] In step B, a high-temperature AlN layer is grown by MOCVD process.
[0069] Adjust the temperature of the reaction chamber to 1000°C, ...
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