High-performance silicon nitride ceramic mobile phone rear cover material as well as preparation method and application thereof
A silicon nitride ceramic and mobile phone back cover technology is applied in the field of high-performance silicon nitride ceramic mobile phone back cover material and its preparation field, which can solve the problems of reducing strength, wear resistance, appearance, etc. High toughness, the effect of improving ceramic properties
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Embodiment 1
[0028] The preparation of a high-performance silicon nitride ceramic mobile phone back cover, the specific method is as follows:
[0029] (1) with Si 3 N 4 powder as raw material, Si 3 N 4 The purity of the powder is 99%, and the particle size is 0.1 μm; as MgO-Y 2 o 3 As a sintering aid, the purity of MgO powder is 99.9%, Y 2 o 3 The purity is 99.9%. Press Si 3 N 4 : MgO-Y 2 o 3 The mass fraction ratio is 90%: 10% mixed with ethanol as solvent and Si 3 N 4 The ball is the ball milling medium, mixed on the planetary ball mill for 8 hours, and after drying, Si 3 N 4 -MgO-Y 2 o 3 The mixed powder is recorded as powder A; the MgO-Y 2 o 3 MgO in:Y 2 o 3 The mass fraction ratio is 55%: 45%; pure Si 3 N 4 The powder obtained by the same mixing and drying process as above is designated as powder B.
[0030] (2) Put powder A: powder B in the ratio of 80vol%:20vol%, sequentially add them into the hot-press sintering furnace, keep warm at 1300°C for 60min, pressur...
Embodiment 2
[0033] According to Si 3 N 4 : MgO-Yb 2 o 3 The mass fraction ratio is 80%: 20% for batching, where Si 3 N 4 The particle size of the powder is 30nm, MgO:Yb 2 o 3 The mass fraction ratio is 60%:40%, and the ratio of powder A:powder B is 90vol%:10vol%. Prepare Si according to embodiment 1 method 3 N 4 Gradient ceramics, where the sintering process is: heating to 1200°C for 5 minutes in a spark plasma sintering furnace, mechanically pressurized at 50MPa, and nitrogen pressure at 10 3 Pa. In this example, the high-performance silicon nitride ceramic mobile phone back cover material has a relative density of 99%, a surface hardness of 26GPa, and a fracture toughness of 10MPa·m 1 / 2 , the bending strength is 1400Mpa; finally, the high-performance silicon nitride ceramic mobile phone back cover product is obtained after cutting, rough grinding, fine grinding and polishing processes.
Embodiment 3
[0035] According to Si 3 N 4 : MgO-La 2 o 3 The mass fraction ratio is 90%: 10% for batching, where Si 3 N 4 The particle size of the powder is 10nm, MgO:Yb 2 o 3 The mass fraction ratio is 60%:40%, and the ratio of powder A:powder B is 90vol%:10vol%. Prepare Si according to embodiment 1 method 3 N 4 Gradient ceramics, where the sintering process is: heating to 1000°C for 5 minutes in a spark plasma sintering furnace, mechanically pressurized at 50MPa, and nitrogen pressure at 10 2 Pa. In this example, the high-performance silicon nitride ceramic mobile phone back cover material has a relative density of 99%, a surface hardness of 28GPa, and a fracture toughness of 12MPa·m 1 / 2 , the bending strength is 1500Mpa; finally, the high-performance silicon nitride ceramic mobile phone back cover product is obtained after cutting, rough grinding, fine grinding and polishing processes.
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