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Graphene composite nano-copper conductive ink composition and preparation method thereof

A graphene composite and conductive ink technology, which is applied in ink, household utensils, applications, etc., can solve the problems of difficult dispersion of graphene fillers, high resistivity of conductive inks, easy aggregation of nanoparticles, etc., to achieve mass production and production High efficiency, solve the effect of easy reunion

Inactive Publication Date: 2018-11-30
UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a graphene composite nano-copper conductive ink composition with ultra-high conductivity, aiming at solving the problem of high resistivity of conventional conductive inks, easy aggregation of nanoparticles and difficult dispersion of graphene fillers , a technical problem with high production costs

Method used

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  • Graphene composite nano-copper conductive ink composition and preparation method thereof
  • Graphene composite nano-copper conductive ink composition and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Preparation of graphene composite nano-copper conductive ink composition

[0039] Raw materials: 50wt% graphene-coated nano copper powder, 10wt% epoxy resin, 5wt% epoxy resin curing agent, 2.5wt% polyvinyl acetal, 20wt% organic solvent, 8wt% toughening agent, 1wt defoamer %, antioxidant 2wt%, adhesion promoter 1wt%, thixotropic agent 0.5wt%.

[0040] The particle size range of the metal copper of the above-mentioned graphene-coated nano-copper powder is 50-100 nanometers; the epoxy resin is bisphenol A epoxy resin; the epoxy resin curing agent is MOCA; polyvinyl acetal is polyvinyl acetal Formaldehyde; organic solvent is N,N-dimethylformamide and butanone; toughener is carboxy-terminated nitrile rubber; defoamer is polydimethylsiloxane, viscosity 500cPs; antioxidant is BHT; The bonding force promoter is a silane coupling agent with epoxy groups; the thixotropic agent is fumed silica.

[0041] Preparation steps:

[0042] (1) Preparation of graphene-coated nano-copper ...

Embodiment 2

[0052] Preparation of graphene composite nano-copper conductive ink composition

[0053] Raw materials: graphene coated nano-copper powder 64wt%, epoxy resin 8wt%, epoxy resin curing agent 4wt%, polyvinyl acetal 2wt%, organic solvent 15wt%, toughening agent 2wt%, defoamer 1.5wt %, antioxidant 1.5wt%, adhesion promoter 1wt%, thixotropic agent 1wt%.

[0054] The particle size range of the metal copper of the above-mentioned graphene-coated nano-copper powder is 50-100 nanometers; the epoxy resin is bisphenol F epoxy resin; the epoxy resin curing agent is DDS; polyvinyl acetal is polyvinyl acetal Butyraldehyde; organic solvent is N,N-dimethylacetamide and acetone; toughening agent is carboxyl-terminated nitrile rubber modified epoxy resin; defoamer is polydimethylsiloxane, viscosity 1500cPs; antioxidant The agent is 168 and 1010 mixed in a ratio of 1:1; the adhesion promoter is a silane coupling agent with amino groups; the thixotropic agent is hydrogenated castor oil.

[0055]...

Embodiment 3

[0066] Preparation of graphene composite nano-copper conductive ink composition

[0067] Raw materials: graphene coated nano-copper powder 68wt%, epoxy resin 9wt%, epoxy resin curing agent 5wt%, polyvinyl acetal 1wt%, organic solvent 11wt%, toughening agent 2wt%, defoamer 1wt% , Antioxidant 1wt%, adhesion promoter 1.5wt%, thixotropic agent 0.5wt%.

[0068] The particle size range of the metal copper of the above-mentioned graphene-coated nano-copper powder is 50-100 nanometers; the epoxy resin is bisphenol A epoxy resin; the epoxy resin curing agent is DDS; polyvinyl acetal is polyvinyl acetal Butyraldehyde; organic solvents are dipropylene glycol methyl ether and butanone; toughener is hydroxyl-terminated nitrile rubber; defoamer is polydimethylsiloxane, viscosity 1000cPs; antioxidant is BHT; adhesion promoter It is a silane coupling agent with an amino group; the thixotropic agent is hydrogenated castor oil.

[0069] Preparation steps:

[0070] (1) Preparation of graphene...

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Abstract

The invention discloses a graphene composite nano-copper conductive ink composition and a preparation method thereof. The graphene composite nano-copper conductive ink composition comprises the following components in mass fraction: 10-80wt% of graphene coated nano copper powder, 1-20wt% of epoxy resin, 1-15wt% of an epoxy resin curing agent, 1-30wt% of polyvinyl acetal resin, 1-30wt% of an organic solvent, 0.5-10wt% of a flexibilizer, 0.5-2wt% of a defoaming agent, 0.5-3wt% of an antioxidant, 0.1-2wt% of an adhesion promoter and 0.1-1wt% of a thixotropic agent. The preparation method comprises the following steps that firstly, the graphene coated nano-copper powder is prepared, then the flexibilizer and the organic solvent are mixed to prepare a flexibilizer system, then the epoxy resin,the epoxy resin curing agent, the organic solvent, the graphene coated nano copper powder, the flexibilizer system, the defoaming agent, the antioxidant, the adhesion promoter and the thixotropic agent are sequentially mixed so as to obtain the graphene composite nano-copper conductive ink composition. The graphene composite nano-copper conductive ink composition prepared through the preparation method has the advantages of being high in conductivity, small in usage amount of graphene, easy to disperse, low in cost and suitable for mass production.

Description

technical field [0001] The invention relates to the field of conductive inks, in particular to a graphene composite nano-copper conductive ink composition and a preparation method thereof. Background technique [0002] Silicon conductive ink is generally composed of conductive functional units and matrix materials. The conductive functional units are mostly conductive metal powder, conductive carbon material, and conductive polymer material, which are mainly dispersed in the ink carrier to conduct current; while the matrix material is a high molecular polymer, which plays the role of bonding and mechanical support. [0003] In addition to conductive functional units and matrix materials, conductive ink also needs paste or liquid slurry made of some fillers, binders, solvents and additives. At present, gold-based conductive inks, copper-based conductive inks, copper-based conductive inks, and carbon-based conductive inks have been put into practical use and are used in print...

Claims

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Application Information

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IPC IPC(8): C09D11/52C09D11/102C09D11/106C09D11/03
CPCC09D11/03C09D11/102C09D11/106C09D11/52
Inventor 王可张小艳王悦辉
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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