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Ceramic-based PCB copper-clad laminate and copper cladding method

A technology of ceramic base and copper clad laminate, which is applied in the direction of circuit substrate materials, chemical instruments and methods, electronic equipment, etc., can solve the problems affecting the signal transmission in the copper wire of the PCB board, the copper sheet is not firmly attached, and is easy to fall off, etc., to achieve improvement Copper foil peel strength, low cost, and simple manufacturing process

Pending Publication Date: 2018-12-07
NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A very critical technology in ceramic-based copper clad laminates is the lamination of ceramic sheets and copper sheets. The conventional lamination copper clad method is very easy to cause the copper sheet to be not firmly attached, which is easy to fall off or foam, which affects the signal in the copper wire of the PCB board. transmission, especially for the transmission of high-frequency information has a greater impact

Method used

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  • Ceramic-based PCB copper-clad laminate and copper cladding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Such as figure 1 As shown, it includes a ceramic sheet 1 and a copper foil 3. There is a layer of metal titanium film 2 obtained by electron beam evaporation between the ceramic sheet 1 and the copper foil 3. The upper and lower layers of copper foil 3 are sandwiched between the copper foil 3. The upper and lower layers of metal titanium film 2 and the ceramic sheet 1 are aligned and pressed together.

[0028] S1: By weight ratio, weigh 97 parts of Al 2 o 3 Powder, 1 part of MgO powder, 1 part of CaO powder, 1 part of SiO 2 Powder (the average particle size of the powder is 100 nanometers), put the weighed powder into a planetary mixing ball mill, add 200ml of alcohol, and ball mill for 12 hours at a speed of 300r / min;

[0029] S2: After drying the mixture obtained in step S1, use a dry pressing molding machine to dry press at a pressure of 6 MPa to form a ceramic green body;

[0030] S3: placing the ceramic green body obtained in step S2 in a muffle furnace, and si...

Embodiment 2

[0037] Such as figure 1 As shown, it includes a ceramic sheet 1 and a copper foil 3. There is a metal nickel film 2 obtained by electron beam evaporation between the ceramic sheet 1 and the copper foil 3. The upper and lower layers of copper foil 3 are sandwiched between the copper foil 3. The upper and lower layers of metal nickel film 2 and the ceramic sheet 1 are aligned and pressed together.

[0038] S1: By weight ratio, weigh 98 parts of Al 2 o 3 Powder, 1 part of MgO powder, 0.5 part of CaO powder, 0.5 part of SiO 2 Powder (the average particle size of the powder is 150 nanometers), put the weighed powder into a planetary mixing ball mill, add 200ml of alcohol, and ball mill for 12 hours at a speed of 300r / min;

[0039] S2: After drying the mixture obtained in step S1, use a dry pressing molding machine to dry press at a pressure of 5 MPa to form a ceramic green body;

[0040] S3: placing the ceramic green body obtained in step S2 in a muffle furnace, and sintering a...

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Abstract

The invention discloses a ceramic-based PCB copper-clad laminate and a copper cladding method. The method mainly includes the following steps: a metal film is evaporated on each of the upper and lowersurfaces of a sintered and polished ceramic sheet by means of electron beam evaporation; and then, copper foils are placed on the upper and lower sides of an obtained sample, and the sample is put ina hot pressing furnace for pressing and copper cladding, wherein the metal films can also be titanium films or nickel films, and suitable evaporation conditions are selected according to the films. The method is very suitable for ceramic sheets as ceramic sheets are more resistant to high temperature than ordinary prepregs. The copper foil peeling strength of the ceramic-based PCB copper-clad laminate obtained by the method is obviously improved, which lays a foundation for the higher requirements for PCB in the 5G era.

Description

technical field [0001] The invention relates to a ceramic-based PCB copper-clad board and a copper-clad method, belonging to the field of preparation of PCB copper-clad boards. Background technique [0002] Printed Circuit Board (PCB) is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. With the continuous progress of the development of electronic information technology, the high frequency of electronic equipment is a development trend, especially with the increasing development of wireless networks and satellite communications, information products are constantly moving towards high speed and high frequency. The development of a new generation of products requires high-frequency PCB boards, especially communication products such as satellite systems and mobile phone receiving base stations must use high-frequency circuit boards. With the rapid development of these applications in the ne...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K3/02B32B9/00B32B9/04B32B15/20B32B37/10B32B37/06B32B38/00
CPCH05K1/0306H05K3/022B32B9/005B32B9/041B32B15/20B32B37/06B32B37/10B32B38/00B32B2457/08
Inventor 张军然徐永兵张勇王倩
Owner NANJING UNIV