Organosilicon pressure sensitive adhesive and preparation method thereof, composite film structure, vibration film and sound generating device

A technology of silicone and silicone rubber, applied in the direction of pressure-sensitive films/sheets, adhesives, etc., can solve the problems of damping rubber layer rigidity and damping performance degradation, diaphragm polarization, sound quality of sound-generating devices and poor listening stability, etc.

Pending Publication Date: 2018-12-18
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the acrylic pressure-sensitive adhesive contains polar groups such as ester groups, the high temperature resistance of the damping adhesive layer is poor. When the input voltage increases,...

Method used

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  • Organosilicon pressure sensitive adhesive and preparation method thereof, composite film structure, vibration film and sound generating device
  • Organosilicon pressure sensitive adhesive and preparation method thereof, composite film structure, vibration film and sound generating device
  • Organosilicon pressure sensitive adhesive and preparation method thereof, composite film structure, vibration film and sound generating device

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preparation example Construction

[0089] The present invention also provides a preparation method of the silicone pressure-sensitive adhesive, comprising the following steps:

[0090] By weight, mix 20-80 parts of silicone resin, 5-55 parts of silicone rubber, and 30-60 parts of organic solvent to obtain a mixture;

[0091] adding 0.1-5 parts of a catalyst to the mixture, and heating the mixture to which the catalyst was added to obtain a colloid; and

[0092] The colloid is dried to obtain a silicone pressure-sensitive adhesive.

[0093] In an embodiment of the present invention, the silicone rubber is at least one of methyl hydroxy silicone rubber, vinyl silicone rubber, and phenyl silicone rubber.

[0094] The organic solvent is at least one of benzene, toluene, ethyl acetate, xylene, N-methylpyrrolidone and butanone. The silicone resin and silicone rubber can be dissolved in this organic solvent for uniform mixing.

[0095] The catalyst is an organic complex of platinum or an organic tin compound.

[0...

Embodiment 1

[0153] Provide 5 parts by weight of methyl hydroxy silicone rubber, 15 parts of silicone resin, 30 parts of benzene, dissolve methyl hydroxy silicone rubber and silicone resin in benzene to obtain a mixture; wherein, methyl hydroxy silicone rubber and organic The mass ratio of the silicone resin is 1:4, the quantity ratio of the M chain segment and the Q chain segment in the silicone resin is 1:0.7, the R 1 is methyl, and the range of m is 15.

[0154] Provide 2 parts of chloroplatinic acid diethyl phthalate complex, add chloroplatinic acid diethyl phthalate complex to the mixture, add chloroplatinic acid diethyl phthalate complex The mixture of chloroplatinic acid phthalate is heated at a temperature of 80 °C and a time of 70 minutes, and the diethyl chloroplatinate phthalate complex is used as a catalyst to promote the interaction between methyl hydroxy silicone rubber and silicone resin. Condensation reaction occurs to obtain colloid;

[0155] After the colloid is cooled,...

Embodiment 2

[0159] In parts by weight, 15 parts of methyl hydroxy silicone rubber, 30 parts of silicone resin, and 54 parts of toluene are provided, and the methyl hydroxy silicone rubber and silicone resin are dissolved in toluene to obtain a mixture; wherein, methyl hydroxy silicone rubber and organic The mass ratio of the silicone resin is 1:2, the quantity ratio of the M chain segment and the Q chain segment in the silicone resin is 1:0.75, the R 1 is a hydrogen radical, and the range of m is 17.

[0160] 0.5 part of dibutyltin dilaurate is provided, the dibutyltin dilaurate is added to the mixture, the mixture added with the dibutyltin dilaurate is heated, and the dibutyltin dilaurate is used as a catalyst, It can promote the condensation reaction between methyl hydroxy silicone rubber and silicone resin to obtain colloid. The temperature of this heating treatment is 85℃ and the time is 60min;

[0161] After the colloid is cooled, provide 0.5 part of benzoyl peroxide, add benzoyl pe...

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Abstract

The invention provides an organosilicon pressure sensitive adhesive and a preparation method thereof, a composite film structure applying the organosilicon pressure sensitive adhesive, a vibration film applying the composite film structure and a sound generating device applying the vibration film. The organosilicon pressure sensitive adhesive includes the preparation raw materials in parts by weight: 15-60 parts of organosilicon resin, 5-55 parts of organosilicon rubber, 30-90 parts of an organic solvent and 0.1-5 parts of a catalyst. The vibration film applying the organosilicon pressure sensitive adhesive has good high temperature resistance, so that the vibration film cannot generate a polarization phenomenon during vibration, and the sound generating device applying the vibration filmhas good tone quality and audition stability.

Description

technical field [0001] The invention relates to the technical field of sound-emitting devices, in particular to a silicone-based pressure-sensitive adhesive, a preparation method of the silicone-based pressure-sensitive adhesive, a composite membrane structure using the silicone-based pressure-sensitive adhesive, and a vibration-based vibration device using the composite membrane structure. A membrane, and a sound-generating device using the vibrating membrane. Background technique [0002] The diaphragm is the core component of the sound device. Acrylic pressure-sensitive adhesive has better damping performance. In order to make the diaphragm have better damping performance, acrylic pressure-sensitive adhesive is usually used to make the damping adhesive layer of the diaphragm. However, because the acrylic pressure-sensitive adhesive contains polar groups such as ester groups, the high temperature resistance of the damping adhesive layer is poor. When the input voltage inc...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J7/38
CPCC08L2205/025C09J7/38C09J183/04C08L83/04
Inventor 王海峰王婷李春刘春发
Owner GOERTEK INC
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