Flexible strain sensor capable of responding ultrafast, and preparation method thereof

A strain sensor and flexible technology, applied in the field of sensors, can solve the problems of large gaps and restrictions on the application of flexible sensors, and achieve the effects of compact stacking, sensitive transmission of stress/strain waves, and large contact area

Inactive Publication Date: 2019-01-08
INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The response time of traditional resistive strain sensors is on the order of ten microseconds, while the response time of existing flex

Method used

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  • Flexible strain sensor capable of responding ultrafast, and preparation method thereof
  • Flexible strain sensor capable of responding ultrafast, and preparation method thereof
  • Flexible strain sensor capable of responding ultrafast, and preparation method thereof

Examples

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preparation example Construction

[0036] The invention provides a method for preparing an ultrafast response flexible strain sensor, comprising the following steps:

[0037] (1) modifying the surface of the flexible substrate, and then stretching the obtained modified flexible substrate to form a penetrating long crack on the surface of the modified flexible substrate;

[0038] (2) coating the functionalized graphene dispersion on the surface of the stretched flexible substrate in step (1) to form a functionalized graphene film; the dispersion solvent of the graphene dispersion is N-methylpyrrolidone;

[0039] (3) reducing the functionalized graphene film to form a graphene sensitive layer;

[0040] (4) brushing conductive silver glue on both sides of the graphene sensitive layer and bonding wires to obtain a flexible strain sensor with ultra-fast response;

[0041] The response time of the flexible strain sensor with ultra-fast response is 50 μs˜500 μs.

[0042] The invention modifies the surface of the fle...

Embodiment 1

[0070] The substrate used in Example 1 is a self-prepared PDMS substrate. The preparation method is as follows: add polydimethylsiloxane elastomer and curing agent in a beaker at a mass ratio of 10:1, and stir evenly with a stirrer for 2 to 10 minutes , use a vacuum machine to repeatedly extract the air in the beaker until the bubbles in the PDMS mixture completely disappear, add an appropriate amount of PDMS mixture to the petri dish, and heat at a constant temperature of 60°C for 2 hours in a vacuum drying oven to generate polydimethylsiloxane with a thickness of 100 μm alkane film, cut the resulting polydimethylsiloxane into a substrate with a size of about 2cm×1cm, and set aside.

[0071] (1) Modification of the base layer:

[0072] Oxygen plasma treatment was performed on the surface of the substrate with a power of 300w, a gas flow rate of 40mL / min, and a time of 5min.

[0073] (2) Stretching of the substrate

[0074] After the aforementioned substrate modification tre...

Embodiment 2

[0087] Other steps are identical with embodiment 1, only change the modification of base layer in step (1) into chemical modification, modification process is as follows:

[0088] Attach the prepared PDMS substrate evenly to the surface of the glass slide, leaving a part of the upper end blank, clamp the blank space of the slide glass with a folder, put it in a petri dish for use, and weigh 0.248g of Tris medicine with a precision balance (trishydroxymethylaminomethane), transferred to a beaker, add 100g deionized water, and stir on a magnetic stirrer (400r / min) to configure the buffer. Add dilute hydrochloric acid dropwise to the sustained-release solution until the pH is 8.5 to provide a weakly alkaline environment for the growth of dopamine. Weigh 0.2476g of dopamine hydrochloride drug with a precision balance, pour it into the corrected buffer solution, then insert the glass slide with the substrate into the dopamine solution, place it on a magnetic stirrer (400r / min) and ...

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Abstract

The invention provides a flexible strain sensor capable of responding ultrafast, and a preparation method thereof. The method comprises the following steps: firstly performing modification processingand stretching processing on a flexible substrate surface, and then coating functionalized graphene dispersion liquid on the flexible substrate surface after stretching processing to form a functionalized graphene film; and then performing reduction processing to form a graphene sensitive layer; brushing conductive silver adhesive and adhering a conductor to obtain the flexible strain sensor capable of responding ultrafast. By performing the modification and stretching processing on the flexible substrate, the transmission of the substrate counter stress/strain wave is more sensitive; a dispersing solvent of the functionalized graphene dispersion liquid is NMP, the NMP solvent is high in boiling point and slow in evaporation, so that the coffee ring effect is obvious; a gradient stacking structure is formed through graphene wafers, and the sensing property of the graphene sensitive layer is further optimized.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to an ultrafast response flexible strain sensor and a preparation method thereof. Background technique [0002] The strain sensor is a kind of flexible sensor device that can sense the deformation of the object to be measured and convert the material deformation into an electrical or optical signal that is easy to transmit and process. "Flexibility" requires that the strain sensor can be conformally covered on the surface of the object to be measured without rules, while maintaining good functionality. In recent years, with the development of flexible materials and processing technology, flexible sensors have gradually become a research hotspot. [0003] The basic structure of a flexible strain sensor is generally composed of a three-layer structure of a sensitive material (Sense Material), an interface (Interface), and a substrate (Substract). The substrate is connected to the me...

Claims

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Application Information

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IPC IPC(8): G01B7/16
CPCG01B7/18
Inventor 杨婷婷徐炜代刚李小石杜亦佳
Owner INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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