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Silicon wafer diamond wire cutting waste material recycling method

A diamond wire cutting and waste recycling technology, applied in chemical instruments and methods, silicon compounds, non-metallic elements, etc., can solve the problems of secondary pollution and high price, improve recovery rate and purity, reduce slag viscosity, increase The effect of silicone fluid fluidity

Inactive Publication Date: 2019-01-11
内蒙古华鑫硅材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the conventional treatment method for these waste materials is to return them to the furnace and use the C element in them as a reducing agent. This method is expensive and may cause secondary pollution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A method for recovering waste from diamond wire cutting of crystalline silicon wafers, the method for recovering waste comprises the following steps:

[0019] (1) Raw material screening and grinding

[0020] Select diamond wire cutting waste of crystalline silicon wafers as raw material, dry at 120°C for 3 hours, add 10 times of water to it after pulverization, stir evenly and let it stand for 10 minutes to remove impurities floating on the liquid surface, and put the obtained mixture into a ball mill for grinding Ball milling, let stand, precipitate, then discharge the supernatant, and press filter the obtained precipitate to obtain a filter cake for use;

[0021] (2) Squeeze into a ball

[0022] Put the filter cake obtained in step (1) into a ball mill and grind for 8 hours, sieve, add an adhesive and then granulate, put it into a fish feed machine, and squeeze it into a sphere;

[0023] (3) Heating

[0024] Add 8% calcium oxide to the sphere obtained in step (2) f...

Embodiment 2

[0029] A method for recovering waste from diamond wire cutting of crystalline silicon wafers, the method for recovering waste comprises the following steps:

[0030] (1) Raw material screening and grinding

[0031] Select diamond wire cutting waste of crystalline silicon wafers as raw material, dry at 160°C for 5 hours, add 20 times of water to it after crushing, stir evenly and let it stand for 20 minutes to remove impurities floating on the liquid surface, and put the obtained mixture into a ball mill for grinding Ball milling, let stand, precipitate, then discharge the supernatant, and press filter the obtained precipitate to obtain a filter cake for use;

[0032] (2) Squeeze into a ball

[0033] Put the filter cake obtained in step (1) into a ball mill and grind for 12 hours, sieve, add an adhesive and then granulate, put it into a fish feed machine, and squeeze it into a sphere;

[0034] (3) Heating

[0035] Add 8% calcium oxide to the sphere obtained in step (2) for m...

Embodiment 3

[0040] A method for recovering waste from diamond wire cutting of crystalline silicon wafers, the method for recovering waste comprises the following steps:

[0041] (1) Raw material screening and grinding

[0042] Select diamond wire cutting waste of crystalline silicon wafers as raw material, dry at 140°C for 4 hours, add 15 times of water to it after crushing, stir evenly and let it stand for 15 minutes to remove impurities floating on the liquid surface, and put the resulting mixture into a ball mill for grinding Ball milling, let stand, precipitate, then discharge the supernatant, and press filter the obtained precipitate to obtain a filter cake for use;

[0043] (2) Squeeze into a ball

[0044] Put the filter cake obtained in step (1) into a ball mill and grind for 10 hours, sieve, add an adhesive and then granulate, put it into a fish feed machine, and squeeze it into a sphere;

[0045] (3) Heating

[0046] Add 8% calcium oxide to the sphere obtained in step (2) for ...

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Abstract

The invention discloses a silicon wafer diamond wire cutting waste material recycling method. The silicon wafer diamond wire cutting waste material recycling method comprises following steps: siliconwafer diamond wire cutting waste material is taken as a raw material, is dried at 120 to 160 DEG C for 3 to 5h, and is crushed, 10 to 20 times of water is added into the crushed silicon wafer diamondwire cutting waste material, an obtained mixture is stirred to be uniform, and is allowed to stand for 10 to 20min, floating impurities are removed, the mixture is introduced into a ball mill for ballmilling, then standing and precipitation are carried out, a supernatant is discharged, an obtained precipitate is subjected to press filtration so as to obtain a filter cake; the filter cake is introduced into the ball mill for grinding, sieving is carried out, an adhesive is added for granulation, extruding is carried out so as to obtain balls, 8% calcium oxide is added for mixing, an obtained product is introduced into an intermediate frequency furnace, after introduction and safety confirmation, electricity is provided from an electric current of 500A, in the smelting process, the electriccurrent is maintained at about 1000A through artificial operation, 0.2% of magnesium chloride is added every 10cm reduction of a liquid level with consumption of the main material, fluorite is addedinto the main material, a safety line is set, heating is carried out until the raw materials are molten to the safety line. According to the method, the waste material is subjected to ball preparation, so that silicon liquid fluidity is increased, and element comprehensive utilization is achieved.

Description

technical field [0001] The invention relates to a method for recycling silicon, more specifically, a method for recycling silicon wafer diamond wire cutting waste. Background technique [0002] In recent years, with the increasing shortage of global oil, coal and other energy sources, solar energy has gradually become the most important renewable new energy in the future, and the global solar energy industry has entered a period of rapid development, whether it is monocrystalline silicon used in the semiconductor industry or solar cells. All polysilicon needs to cut high-purity crystalline silicon into silicon wafers. This move not only produced great waste, but also caused a certain degree of environmental pollution. However, whether it is used for electronic-grade monocrystalline silicon or solar-grade polycrystalline silicon, it needs to be produced through a large amount of energy consumption and high cost. If the silicon powder and silicon particles in the silicon wafe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B33/037
CPCC01B33/037
Inventor 朱海东任小平林斌
Owner 内蒙古华鑫硅材料科技有限公司
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