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High thermal conductivity and insulating epoxy resin composition and preparation method

A technology of epoxy resin and thermally conductive insulating filler, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc.

Inactive Publication Date: 2019-01-15
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermal control is a key technology in aerospace research and industry, and it has not been solved well in China until now.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] (1) Preparation of polydopamine-modified metal thermally conductive filler Ag powder

[0047] First, weigh 0.8 parts by weight of Ag powder (Shanghai Mancai Industrial Co., Ltd., spherical, 25 μm) and add it to 100 parts by weight of an aqueous solution, and ultrasonically disperse the Ag powder in an ice-water bath for 10 minutes; add 1.28 parts by weight of Ag powder to the above solution. Tyrosine (Aladdin), adjust the pH to 9, then react at 45°C for 8h; then centrifuge and wash with water to obtain clean polydopamine-modified Ag powder.

[0048] (2) Preparation of high thermal conductivity and insulating epoxy resin composite materials

[0049]100 parts by weight of epoxy resin (E-44, produced by Guangzhou Zhongye Chemical Co., Ltd.), 50 parts by weight of Ag powder heat-conducting filler modified by polydopamine, silica microspheres (Kamishu (Shanghai) Biotechnology Co., Ltd. , particle size 20 μm) 10 parts by weight in acetone (Sinopharm Group Chemical Reagent Co...

Embodiment 2

[0052] (1) Preparation of Cu nanowires

[0053] 2.65 parts by weight Cu(NO 3 ) 2 (Sinopharm Group Chemical Reagent Co., Ltd., AR) was dissolved in 800 parts by weight of 15mol / L NaOH (Sinopharm Group Chemical Reagent Co., Ltd., AR) solution, and then 12 parts by weight of ethylenediamine (Sinopharm Group Chemical Reagent Co., Ltd. As an end-capping agent, 1 part by weight of 35 wt% hydrazine hydrate (Sinopharm Chemical Reagent Co., Ltd., AR) was used as a reducing agent, and the mixing process was carried out in an ice bath. Then the mixed solution was reacted at 75 °C for 1 h without stirring. After the reaction is completed, the copper nanowires are obtained by centrifuging and washing with water. The obtained copper nanowire has a length of 10-60 μm and a diameter of 50-400 nm.

[0054] (2) Preparation of polydopamine-modified metal thermally conductive filler Cu nanowires

[0055] First weigh 2 parts by weight of Cu nanowires and add them to 100 parts by weight of an ...

Embodiment 3

[0060] (1) Preparation of Ag nanosheets

[0061] 6 parts by weight of AgNO at a concentration of 2.35 mM 3 (Sinopharm Group Chemical Reagent Co., Ltd., AR) aqueous solution and 10 parts by weight concentration of PVP (Sinopharm Group Chemical Reagent Co., Ltd., AR) aqueous solution, and 6 parts by weight concentration of TSC (Sinopharm Group Chemical Reagent Co., Ltd. , AR) aqueous solution was mixed homogeneously at room temperature. After stirring for 1 min, quickly add 0.3 parts by weight of NaBH with a concentration of 10 mM 4 (Sinopharm Chemical Reagent Co., Ltd., AR) aqueous solution, the color of the solution changes from colorless to bright yellow. Then put the yellow silver solution into a 50mL single-necked bottle, and reflux at 60°C for several hours, the solution gradually changed from yellow to blue, indicating that silver triangles were synthesized. After the sample was cooled to room temperature, the obtained sample was centrifuged at 13,000 rpm for 6 minutes...

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Abstract

The invention discloses a high thermal conductivity and insulating epoxy resin composition and a preparation method. The epoxy resin composition is prepared by curing the following raw materials underthe action of a curing agent and an accelerator: 100 weight parts of an epoxy resin prepolymer, 5-80 weight parts of thermal conductive and insulating filler and 10-30 weight parts of microspheres. The thermal conductive and insulating filler is composed of thermal conductive powder and melanin structure thermal conductive insulating layer coated on the surface. The thermal conductive powder is elemental metal or carbon-based powder, and the melanin structure thermal conductive insulating layer is obtained by surface modification on the thermal conductive powder through at least one of dopa,dopamine, dopamine hydrochloride and tyrosine. The preparation method includes: curing the components according to the dosage to obtain the high thermal conductivity and insulating epoxy resin composition. The composition provided by the invention satisfies good thermal conductivity and electrical insulation performance at the same time, well solves the matching problem of thermal conductivity andinsulation performance encountered when high power devices work, and can meet the performance requirements of current electronic products for thermal conductive and insulating high polymer materials.

Description

technical field [0001] The present invention relates to the technical field of epoxy resin, and more specifically, relates to a high thermal conductivity insulating epoxy resin composition and a preparation method. Background technique [0002] Traditional thermal conductive materials are mostly metals and metal oxides, as well as other non-metallic materials (such as graphite, carbon black, AlN, SiC, etc.). With the development of science and technology and industrial production, many special heat conduction occasions put forward higher requirements for heat conduction materials, hoping that they have better comprehensive properties, such as light weight, strong chemical corrosion resistance, excellent electrical insulation, impact resistance, Easy to process and shape. Because polymer materials have excellent corrosion resistance, mechanical properties and electrical insulation properties, people gradually use polymer materials to replace traditional heat-conducting mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/06C08K9/04C08K3/08C08K7/18C08K3/36C08K7/00C08K7/24C08K3/04C08K7/06C09K5/14
CPCC08K3/04C08K3/08C08K3/36C08K7/00C08K7/18C08K7/24C08K9/08C08K13/06C08K2003/0806C08K2003/0812C08K2003/085C08K2003/0893C08K2201/011C08L63/00C08L2205/18C09K5/14C08L25/06C08K7/06
Inventor 东为富袁皓汪洋李婷马丕明陈明清
Owner JIANGNAN UNIV
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