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Environment-friendly type polyimide-based high temperature-resistant adhesive and preparation method thereof

A high-temperature-resistant adhesive and polyimide-based technology, applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of volatile rigidity and brittleness, achieve low volatility, improve resistance Effects of improving thermal performance and shear strength

Inactive Publication Date: 2019-01-18
富优特(山东)新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an environment-friendly polyimide-based high-temperature-resistant adhesive and its preparation method, so as to solve the technical problem that the existing polyimide high-temperature adhesive is volatile and has high rigidity and brittleness after drying.

Method used

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  • Environment-friendly type polyimide-based high temperature-resistant adhesive and preparation method thereof
  • Environment-friendly type polyimide-based high temperature-resistant adhesive and preparation method thereof
  • Environment-friendly type polyimide-based high temperature-resistant adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 10 g (0.05 mol) of 4,4'-diaminodiphenyl ether and 104.4 g of dimethylacetamide into the three-necked flask, start mechanical stirring and fill with nitrogen protection, place the three-necked flask in an ice-water bath, and wait for 4,4' -After the diaminodiphenyl ether is completely dissolved, slowly add 16.1g (0.05mol) of 3,3',4,4'-benzophenone tetracarboxylic dianhydride into the three-necked flask in small amounts several times, and keep the ice-water bath for 12 hours to obtain Viscous homogeneous solution, then add 15.15g (0.15mol) triethylamine, stir at room temperature for 2h; then slowly pour into 700ml acetone with a rotation speed of 1000rpm, filter and collect the precipitate, vacuum dry at room temperature for 2h; take 20g of dried powder Add 80g of water, stir at 3000rpm for 1h to form a transparent viscous aqueous solution, continue to add 20g of methylphenyl silicone aqueous dispersion with a solid content of 50wt%, stir at 10000rpm for 2h, and finall...

Embodiment 2

[0030] Compared with Example 1, except that the diamine was replaced by 9.4 g (0.05 mol) of 2,5-diaminobenzenesulfonic acid, other processes remained unchanged.

Embodiment 3

[0032] Compared with Example 1, except that the dianhydride was replaced by 16.2 g (0.05 mol) of 3,3',4,4'-diphenylmethanol tetraacid dianhydride, other processes remained unchanged.

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Abstract

The invention relates to an environment-friendly type polyimide-based high temperature-resistant adhesive, and belongs to the technical field of organic polymer adhesive compositions. The environment-friendly type polyimide-based high temperature-resistant adhesive is prepared by the following steps of enabling dianhydride and diamine to generate condensation reaction to form polyamide acid; precipitating, and preparing polyamide acid salt; further forming a water dispersion body; mixing modified organosilicone resin and a proper amount of additive. The environment-friendly type polyimide-based high temperature-resistant adhesive has the beneficial effects that the rigidity and crispness of an adhesive layer after drying can be effectively reduced, the introduction of a flexible structureby a chemical copolymerizing manner is not required, the manufacturing process is simplified, and the cost is also reduced; compared with a common polyimide high-temperature adhesive, the volatility is lower, and the injury to the body health of a worker and the pollution to the environment by the volatile substances are reduced.

Description

technical field [0001] The invention relates to the technical field of organic polymer adhesive compositions, in particular to an environment-friendly polyimide-based high-temperature-resistant adhesive and a preparation method thereof. Background technique [0002] Aromatic heterocyclic polyimide has good high temperature resistance, mechanical properties, dielectric properties, electrical insulation properties, radiation resistance, flame retardancy, etc., and is widely used in aviation, aerospace, microelectronics, nano, new energy, Liquid crystal, separation film, laser and other national defense, military industry, high-tech and civilian fields. [0003] Organic polymer adhesives are used for the connection of metals, which are easy to operate, flexible and convenient, and can even replace welding and riveting in some cases. Polyimide resin is an ideal metal adhesive that can be used under high temperature conditions (≥250°C). Most of the common polyimide high-tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C09J183/04C09J11/04C09J11/06
CPCC09J11/04C09J11/06C09J179/08C08L83/04C08K3/36C08K5/544C08K5/10
Inventor 王新波马志远
Owner 富优特(山东)新材料科技有限公司
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