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Single-component composite silane modified polyether heat conductive adhesive and preparation method thereof

A technology of silane-modified polyether and composite silane, which is applied in the field of sealants, can solve the problems of inability to apply heat conduction to electronic appliances and insufficient heat conduction performance, and achieve high shear strength, improve mechanical properties, and improve heat resistance. Effect

Inactive Publication Date: 2019-01-25
博邦新材料科技(广州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through experimental research, the above three existing patented sealants also have the problem of insufficient thermal conductivity, which can only be used for traditional bonding and sealing purposes, and cannot be used for thermal conductivity in the electronic and electrical industries.

Method used

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  • Single-component composite silane modified polyether heat conductive adhesive and preparation method thereof
  • Single-component composite silane modified polyether heat conductive adhesive and preparation method thereof
  • Single-component composite silane modified polyether heat conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A one-component composite silane-modified polyether thermally conductive adhesive, comprising the following components in parts by weight:

[0031]

[0032] The preparation process steps of the thermally conductive adhesive are:

[0033] (1) The thermally conductive filler aluminum nitride and the thermally conductive auxiliary filler graphene (400m 2 / g) dried at 100°C for 3 hours and set aside;

[0034](2) the above-mentioned heat conduction auxiliary filler graphene (400m 2 / g), silane-modified polyether resin and surfactant polyoxyethylene sorbitan fatty acid ester are dispersed in a reactor at a high speed for 20-30 minutes, and then ultrasonicated at a power of 1000W for 40-80 minutes to obtain a mixed solution;

[0035] (3) the above mixed solution, epoxy resin bisphenol A type epoxy resin, thermally conductive filler aluminum nitride, plasticizer dimethyl phthalate, reactive diluent n-butyl glycidyl ether and diglycidyl ether , thixotropic agent fumed sili...

Embodiment 2

[0038] A one-component composite silane-modified polyether thermally conductive adhesive, comprising the following components in parts by weight:

[0039]

[0040] The preparation process steps of the thermally conductive adhesive are:

[0041] (1) The thermally conductive filler alumina and the thermally conductive auxiliary filler graphene (600m 2 / g) dried at 100°C for 3 hours and set aside;

[0042] (2) the above-mentioned heat conduction auxiliary filler graphene (600m 2 / g), silane-modified polyether resin and surfactant polyoxyethylene sorbitan fatty acid ester are dispersed in a reactor at a high speed for 20-30 minutes, and then ultrasonicated at a power of 1000W for 40-80 minutes to obtain a mixed solution;

[0043] (3) The above mixed solution, epoxy resin bisphenol A type epoxy resin and bisphenol F type epoxy resin, thermal conductive filler aluminum oxide, plasticizer dibutyl phthalate, reactive diluent allyl group Glycidyl ether and polypropylene glycol di...

Embodiment 3

[0046] A one-component composite silane-modified polyether thermally conductive adhesive, comprising the following components in parts by weight:

[0047]

[0048] The preparation process steps of the thermally conductive adhesive are:

[0049] (1) The thermally conductive filler aluminum nitride and alumina and the thermally conductive auxiliary filler graphene (500m 2 / g) dried at 100°C for 3 hours and set aside;

[0050] (2) the above-mentioned heat conduction auxiliary filler graphene (500m 2 / g), silane-modified polyether resin and surfactant polyoxyethylene sorbitan fatty acid ester are dispersed in a reactor at a high speed for 20-30 minutes, and then ultrasonicated at a power of 1000W for 40-80 minutes to obtain a mixed solution;

[0051] (3) the above-mentioned mixed solution, epoxy resin bisphenol A type epoxy resin, thermally conductive filler aluminum nitride and aluminum oxide, plasticizer dibutyl phthalate, reactive diluent vinyl n-butyl glycidyl ether and ...

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Abstract

The invention provides a single-component composite silane modified polyether heat conductive adhesive and a preparation method thereof. The heat conductive adhesive comprises silane modified polyether resin, epoxy resin, a plasticizer, an active diluting agent, heat conductive filler, heat conductive auxiliary filler, a surfactant, a thixotropic agent, a water removing agent, a heat stabilizer, an adhesion accelerant and a curing agent. By adopting an epoxy-silane modified polyether composite resin system, the high shear strength (8 to 10 MPa) and high heat conductive coefficient (15 to 25 W / (m.k)) as well as excellent adhesion performance of the heat conductive adhesive can be realized, by selecting the silane modified polyether resin comprising phenyl, the heat resistance of the traditional silane modified polyether resin can be greatly improved, the component constitution is relatively simple, and the mass production is easy to implement. The single-component wettable gas cured product is simple in process operation, low in requirement for equipment and environment of an electronic assembling workshop, and capable of being widely applied to the adhesion sealing of elements anddevices in the electron industry.

Description

technical field [0001] The invention belongs to the technical field of sealants, and in particular relates to a single-component composite silane-modified polyether heat-conducting adhesive and a preparation method thereof. Background technique [0002] At present, with the continuous innovation of science and technology, the electronic and electrical industry has developed rapidly, and gradually formed more refined, portable and functional product features. Thermally conductive adhesives are high-performance elastomers used to bond other heat-generating components, such as transistors, to printed circuit board assemblies or heat sinks. As an indispensable main component in electronic and electrical products, thermally conductive adhesives can effectively reduce product defects caused by heat concentration. At present, there are various types of thermally conductive adhesives on the market, mainly including: silicone, acrylic, epoxy, epoxy-acrylic composite system and epoxy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J171/00C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08K2003/2227C08K2003/2296C08K2003/285C08L2201/08C08L2203/20C08L2205/025C08L2205/03C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C09J171/00C08L63/00C08L71/02C08K13/02C08K5/12C08K3/28C08K3/042C08K3/36C08K3/22C08L71/00
Inventor 王金孙胜利
Owner 博邦新材料科技(广州)有限公司
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