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A kind of diamond grinding wheel with microstructure and its preparation method

A diamond grinding wheel and microstructure technology, which is applied in the field of diamond grinding wheels, can solve problems such as inconsistent heights of cutting edges, affect the surface quality of workpieces, reduce grinding efficiency, etc., and achieve superior grinding performance, good wear resistance, and manufacturing accuracy high effect

Active Publication Date: 2020-10-02
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problem that the shape, distribution position, and height of the cutting edge of the existing diamond grinding wheel are inconsistent, thereby limiting the grinding quality and reducing the grinding efficiency. In order to solve the problem of clogging and affecting the surface quality of the workpiece, a diamond grinding wheel with a microstructure and its preparation method are provided to solve the tool problem in the ultra-precision grinding process of the optical surface of the existing hard and brittle materials

Method used

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  • A kind of diamond grinding wheel with microstructure and its preparation method
  • A kind of diamond grinding wheel with microstructure and its preparation method
  • A kind of diamond grinding wheel with microstructure and its preparation method

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specific Embodiment approach 1

[0037] Embodiment 1: A diamond grinding wheel with a microstructure described in this embodiment includes a SiC ceramic grinding wheel substrate 1, such as figure 1 As shown, the SiC ceramic grinding wheel base 1 is a disc-shaped structure with a diameter of 50 mm to 80 mm, the diameter of the central mounting hole is 1 / 3 to 1 / 2 of the diameter of the SiC ceramic grinding wheel base 1, and the edge thickness of the SiC ceramic grinding wheel base 1 is 3 mm. ~5mm, the height of the positioning surface is 0.5mm~1mm, the outer circumference is a plane or a convex arc surface (that is, the edge of the axial section of the SiC ceramic grinding wheel base 1 is linear or arc-shaped), and the roundness error of the outer circumference is less than 1 μm , the surface shape error of the outer circular contour is less than 1 μm, the flatness of the positioning surface is less than 2 μm, and the perpendicularity between the positioning surface and the axis of the outer circular surface is ...

specific Embodiment approach 2

[0042] Specific embodiment two: the preparation method of a kind of diamond grinding wheel with microstructure described in this embodiment, concrete steps are:

[0043] Step 1: Prepare polycrystalline diamond coating.

[0044] Using chemical vapor deposition (chemical vapor deposition is a chemical technology, which mainly uses one or several gas-phase compounds or simple substances containing thin film elements to perform chemical reactions on the surface of the substrate to form a thin film) on the grinding wheel substrate 1 A polycrystalline diamond coating 2 with a thickness of 20 μm to 50 μm is formed on the outer peripheral surface.

[0045] Specifically, polycrystalline diamond coating 2 was prepared by using hot wire chemical vapor deposition method:

[0046] Such as image 3 As shown, 6 to 8 tungsten wires 3 are evenly arranged on the outer circumference of the grinding wheel base 1, and all the tungsten wires 3 are parallel to the central axis of the grinding wheel ...

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Abstract

The invention discloses a diamond grinding wheel with a micro structure and a manufacturing method for the diamond grinding wheel, and relates to the technical field of ultra-precision machining. Thediamond grinding wheel can solve the problems that existing diamond grinding wheel abrasive particles limit grinding quality, and reduce grinding efficiency, a chip space of the diamond grinding wheelis small, and the like. The diamond grinding wheel utilizes a chemical vapour-phase deposition method to manufacture a diamond abrasive material layer, and the micro structure is manufactured on thediamond abrasive material layer surface. The diamond grinding wheel with the micro structure and the manufacturing method for the diamond grinding wheel disclosed by the invention can be mainly applied to the ultra-precision machining field of hard and brittle material optical surfaces.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing, in particular to a diamond grinding wheel used for ultra-precision grinding of optical surfaces. Background technique [0002] Ultra-precision machining technology has been paid more and more attention, and hard and brittle materials such as precision ceramics, glass, and optical crystals are widely used in aerospace, mechatronics, and other fields. In order to obtain nanoscale surface roughness, submicron surface accuracy and micron subsurface damage on these hard and brittle materials, resin-based or metal-based sintered diamond grinding wheels with abrasive grain sizes below 10 microns are currently used. It is used to realize the ultra-precision grinding process of its optical surface. [0003] Resin-based or metal-based sintered diamond grinding wheels use resin or bronze as a bond, fully mix the diamond abrasive with the bond, and then use the sintering method to shape a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D7/02B24D18/00
CPCB24D7/02B24D18/00
Inventor 郭兵张俊吴明涛赵清亮刘文超
Owner HARBIN INST OF TECH
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