Method for preparing glue for producing high-speed copper-clad plates and product of glue

A copper-clad laminate, high-speed technology, applied in adhesives, epoxy resin glue, textiles and papermaking, etc., can solve the problems of large loss, unstable transmission performance, low dielectric, etc., achieve low dielectric loss factor, meet performance requirements, Effect of low dielectric constant

Active Publication Date: 2019-02-22
重庆德凯实业股份有限公司
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] High-frequency and high-speed substrate materials mainly solve the high-frequency characteristic defects of unstable transmission performance and large loss of ordinary copper-clad laminates in the fields of microwave and millimeter waves in communications. , put forward a higher and more urgent demand

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing glue for producing high-speed copper-clad plates and product of glue
  • Method for preparing glue for producing high-speed copper-clad plates and product of glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Special glue for high-speed copper clad laminates:

[0025] 1. Bismaleimide resin modification: put 0.65g of barbituric acid, 123.5g of brominated bisphenol A epoxy resin, 11.2g of bismaleimide resin, and 77g of butyrolactone into the reactor In the process, a stable and homogeneous mixture was formed, and then reacted at 135°C for 2-3 hours, and the temperature was lowered to 65°C after the reaction stopped; butyrolactone was only used as a solvent, and bismaleimide resin, ba Bituric acid is added together, and only bismaleimide resin and barbituric acid are reacted. The reaction can be carried out at 130-150°C for 2-4 hours, and the temperature is lowered to 60-70°C after the reaction stops. The bromine element in the brominated bisphenol A epoxy resin accounts for 18-25%.

[0026] 2. Then add 75g of dimethylformamide and 24.93g of curing agent ethylenediamine, and mix together to form a uniform resin A solution;

[0027] 3. Dissolve 122g of polyphenylene ether res...

Embodiment 2

[0031] Preparation of high-speed copper clad laminate:

[0032] 1. Reinforcement material pretreatment: select low dielectric constant glass fiber cloth as the reinforcement material, and burn it at 40°C for 30 minutes, then cool it down to room temperature naturally; then soak the heat-treated low dielectric constant glass fiber cloth in the treatment solution 10-15min, air-dry naturally for 30-45min, then place it in an electric blower oven at 100°C and dry for 2H; the glass cloth treatment solution is a 1.5% aqueous solution of silane coupling agent, and then adjust the pH value with glacial acetic acid Adjust to 3-4, stir and react at room temperature for 45 minutes. The dielectric constants of the glass fiber cloth used in the examples are all between 4.2-4.5.

[0033] 2. Preparation of the adhesive sheet (semi-cured state): apply the special glue for high-speed copper-clad laminates prepared in Example 1 to the treated low-dielectric constant glass fiber cloth through t...

Embodiment 3

[0038] 1. Bismaleimide resin modification: put 1.68g of barbituric acid, 116.3g of brominated bisphenol A epoxy resin, 25g of bismaleimide resin, and 160g of butyrolactone into the reactor , to form a stable and uniform mixture, then react at 135°C for 2-3 hours, and then cool down to 65°C after the reaction stops;

[0039] 2. Then add dimethylformamide and curing agent ethylenediamine 23.12g according to the resin mass ratio of 1:5-7, and mix together to form a uniform resin A solution;

[0040]3. Dissolve 115.5g of polyphenylene ether resin in toluene (heating), then add 6.05g of dicyclopentadiene phenol epoxy resin and 5.75g of benzoyl peroxide to form a stable mixture. Under the conditions, react for 2-3 hours, and form a stable resin B solution after the reaction;

[0041] 4. Mix the resin A solution and the resin B solution evenly together, and add 0.67g of catalyst dimethylimidazole to prepare a special glue for producing high-speed copper-clad laminates.

[0042] 5. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Glass transition temperatureaaaaaaaaaa
Login to view more

Abstract

The invention relates to a method for preparing glue for producing high-speed copper-clad plates. The method comprises the following steps: blending and modifying barbituric acid with brominated bisphenol A epoxy resin and bismaleimide resin to prepare modified bismaleimide resin; forming a stable and uniform mixture from the modified bismaleimide resin by using butyrolactone as a solvent; and further adding other materials to prepare the glue specially used for producing high-speed copper-clad plates. The high-speed copper-clad plates prepared by the glue have low dielectric constant and dielectric loss factor, can meet other performance requirement of copper-clad plates, and are suitable for manufacture of high-speed printed circuit boards.

Description

technical field [0001] The invention relates to the field of production and preparation of copper-clad laminates, in particular to a method for preparing glue for producing high-speed copper-clad laminates and its products. Background technique [0002] With the rapid development of intelligent electronic products and the revolution of information technology, global information technology is developing rapidly towards digitization and networking. Ultra-large capacity information transmission, ultra-fast speed and ultra-high-density information processing have become the key factors in the development of information and communication equipment (ICT) technology. the goal pursued. Digital circuits are gradually entering the stage of high-speed information processing and high-frequency signal transmission. In order to process increasing data, the frequency of electronic equipment becomes higher and higher. At this time, the performance of the substrate will seriously affect the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J163/00C09J171/12C09J11/06C09J11/08C08G73/12D06M13/50H05K1/05C09J7/21
CPCC08G73/12C08L2203/20C08L2205/025C08L2205/03C08L2205/035C09J11/06C09J11/08C09J163/00C09J2400/143C09J7/21D06M13/50H05K1/053C08L71/12C08L79/085C08L63/00
Inventor 李洪彬
Owner 重庆德凯实业股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap