Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device

A resin composition, resin technology, applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., can solve the problem of long processing time, and achieve the effect of excellent heat resistance and excellent developability

Active Publication Date: 2019-03-01
MITSUBISHI GAS CHEM CO INC
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, the hole opening by laser processing has problems such as forming a high-density substrate with a large number of holes, and the processing time becomes longer.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device
  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device
  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0232] Hereinafter, the present invention will be described in more detail through examples, but the present invention is not limited by these examples.

Synthetic example 1

[0234] (Synthesis of Cyanate Compounds)

[0235] 300 g (1.28 moles in terms of OH group) and 194.6 g (1.92 moles) of triethylamine (1.5 moles relative to 1 mole of hydroxyl groups) of 1-naphthol aralkyl resin (manufactured by Nippon Steel Sumitomo Chemical Co., Ltd.) were dissolved in distilled water. 1800 g of methyl chloride was used as solution 1.

[0236] 125.9 g (2.05 moles) of cyanogen chloride (1.6 moles relative to 1 mole of hydroxyl), 293.8 g of dichloromethane, 194.5 g (1.92 moles) of 36% hydrochloric acid (1.5 moles relative to 1 mole of hydroxyl), and 1205.9 g of water , while keeping the liquid temperature at -2 to -0.5°C under stirring, solution 1 was poured over 30 minutes. After solution 1 was poured, after stirring at the same temperature for 30 minutes, pour 65 g (0.64 moles) of triethylamine (0.5 moles relative to 1 mole of hydroxyl) in 65 g of dichloromethane over 10 minutes. Solution 2). After solution 2 was injected, it was stirred at the same temperat...

Embodiment 1

[0240] (Manufacture of resin composition and resin sheet)

[0241] Dicyclopentadiene type epoxy resin (n in formula (1) is 1 to 3. XD-1000 (trade name) , manufactured by Nippon Kayaku Co., Ltd.) 22.4 parts by mass, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 as a photocuring initiator (B) (Irgacure (registered trademark) 369, manufactured by BASFJapan Ltd.) 6.5 parts by mass, propylene glycol monomethyl ether acetate (hereinafter sometimes abbreviated as PGMEA) solution of TrisP-PA epoxy acrylate compound (C) (KAYARAD (registered trademark) ZCR-6007H, non-volatile content 65% by mass, acid value: 70 mgKOH / g, manufactured by Nippon Kayaku Co., Ltd.) 77.5 parts by mass (50.4 parts by mass in terms of non-volatile content), other than (C) component 17.4 parts by mass of dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA, manufactured by Nippon Kayaku Co., Ltd.) of the compound (D) having an ethylenically unsaturated group, maleimide compound (E) ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Conductivityaaaaaaaaaa
Login to View More

Abstract

Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a support body, and a multilayer printed circuit board and a semiconductor device that use said resin composition and said resin sheet with a support body. The resin composition includes a dicyclopentadiene-type epoxy resin (A) expressed by formula (1), a photocuring initiator (B), a compound (C) expressed by formula (2), and a compound (D) that has an ethylenically unsaturated group other than the (C) component.

Description

technical field [0001] The present invention relates to a resin composition, a resin sheet using the same, a multilayer printed wiring board, and a semiconductor device. Background technique [0002] Research on reducing the thickness of laminated boards used in multilayer printed wiring boards has been actively conducted due to miniaturization and high density of multilayer printed wiring boards. Along with thickness reduction, thickness reduction is also required for an insulating layer, and the resin sheet which does not contain a glass cloth is requested|required. The mainstream resin composition used as the material of the insulating layer is a thermosetting resin, and the opening for obtaining electrical conduction between the insulating layers is usually performed by laser processing. Moreover, in the resin sheet using a thermosetting resin, as a method of forming a conductor circuit on an insulating layer, the method of forming a conductor circuit by copper plating ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08G59/20H05K1/03
CPCC08G59/20H05K1/03C08G59/4261C08G59/4284C08G59/688C08L63/00H05K1/0298H05K1/0373
Inventor 喜多村慎也铃木卓也四家诚司
Owner MITSUBISHI GAS CHEM CO INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com