Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device

A resin composition, resin technology, applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., can solve the problem of long processing time, and achieve the effect of excellent heat resistance and excellent developability

Active Publication Date: 2019-03-01
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, the hole opening by laser processing has problems such as forming a high-density substrate with a large number of holes, and the processing time becomes longer.

Method used

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  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device
  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device
  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device

Examples

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Embodiment

[0232] Hereinafter, the present invention will be described in more detail through examples, but the present invention is not limited by these examples.

Synthetic example 1

[0234] (Synthesis of Cyanate Compounds)

[0235] 300 g (1.28 moles in terms of OH group) and 194.6 g (1.92 moles) of triethylamine (1.5 moles relative to 1 mole of hydroxyl groups) of 1-naphthol aralkyl resin (manufactured by Nippon Steel Sumitomo Chemical Co., Ltd.) were dissolved in distilled water. 1800 g of methyl chloride was used as solution 1.

[0236] 125.9 g (2.05 moles) of cyanogen chloride (1.6 moles relative to 1 mole of hydroxyl), 293.8 g of dichloromethane, 194.5 g (1.92 moles) of 36% hydrochloric acid (1.5 moles relative to 1 mole of hydroxyl), and 1205.9 g of water , while keeping the liquid temperature at -2 to -0.5°C under stirring, solution 1 was poured over 30 minutes. After solution 1 was poured, after stirring at the same temperature for 30 minutes, pour 65 g (0.64 moles) of triethylamine (0.5 moles relative to 1 mole of hydroxyl) in 65 g of dichloromethane over 10 minutes. Solution 2). After solution 2 was injected, it was stirred at the same temperat...

Embodiment 1

[0240] (Manufacture of resin composition and resin sheet)

[0241] Dicyclopentadiene type epoxy resin (n in formula (1) is 1 to 3. XD-1000 (trade name) , manufactured by Nippon Kayaku Co., Ltd.) 22.4 parts by mass, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 as a photocuring initiator (B) (Irgacure (registered trademark) 369, manufactured by BASFJapan Ltd.) 6.5 parts by mass, propylene glycol monomethyl ether acetate (hereinafter sometimes abbreviated as PGMEA) solution of TrisP-PA epoxy acrylate compound (C) (KAYARAD (registered trademark) ZCR-6007H, non-volatile content 65% by mass, acid value: 70 mgKOH / g, manufactured by Nippon Kayaku Co., Ltd.) 77.5 parts by mass (50.4 parts by mass in terms of non-volatile content), other than (C) component 17.4 parts by mass of dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA, manufactured by Nippon Kayaku Co., Ltd.) of the compound (D) having an ethylenically unsaturated group, maleimide compound (E) ...

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Abstract

Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a support body, and a multilayer printed circuit board and a semiconductor device that use said resin composition and said resin sheet with a support body. The resin composition includes a dicyclopentadiene-type epoxy resin (A) expressed by formula (1), a photocuring initiator (B), a compound (C) expressed by formula (2), and a compound (D) that has an ethylenically unsaturated group other than the (C) component.

Description

technical field [0001] The present invention relates to a resin composition, a resin sheet using the same, a multilayer printed wiring board, and a semiconductor device. Background technique [0002] Research on reducing the thickness of laminated boards used in multilayer printed wiring boards has been actively conducted due to miniaturization and high density of multilayer printed wiring boards. Along with thickness reduction, thickness reduction is also required for an insulating layer, and the resin sheet which does not contain a glass cloth is requested|required. The mainstream resin composition used as the material of the insulating layer is a thermosetting resin, and the opening for obtaining electrical conduction between the insulating layers is usually performed by laser processing. Moreover, in the resin sheet using a thermosetting resin, as a method of forming a conductor circuit on an insulating layer, the method of forming a conductor circuit by copper plating ...

Claims

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Application Information

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IPC IPC(8): C08G59/20H05K1/03
CPCC08G59/20H05K1/03C08G59/4261C08G59/4284C08G59/688C08L63/00H05K1/0298H05K1/0373
Inventor 喜多村慎也铃木卓也四家诚司
Owner MITSUBISHI GAS CHEM CO INC
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