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Self-assembly copper ball, conductive ink as well as preparation method and application of self-assembly copper ball

A technology of conductive ink and self-assembly, which is applied in the field of its preparation and self-assembly of copper balls, can solve the problems of high resistivity of conductive inks, poor conductivity, and non-mentioned porous copper balls, and achieve good oxidation resistance and good anti-oxidation properties. Oxidation ability, environment-friendly effect

Active Publication Date: 2019-03-15
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] CN104292983A discloses a conductive ink. The components and formula of the conductive ink are as follows: 5-30 parts of graphene; 5-20 parts of carbon black; 5-20 parts of copper powder; 5-30 parts of resin; 20-40 parts of solvent; 1-20 parts of auxiliary agent; the conductive ink prepared by this invention has high resistivity and poor conductivity
[0006] CN105458295A discloses a porous copper ball and a preparation method thereof; the preparation method comprises the following steps: adding a copper source, an organic acid complexing agent, and an organic amine complexing agent into a solvent, stirring evenly, and then adding a reducing agent hydrazine hydrate for reaction , centrifuge, take the precipitate, vacuum dry after washing to obtain porous copper balls; the porous copper balls prepared by this invention are not mentioned to be applicable to conductive inks

Method used

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  • Self-assembly copper ball, conductive ink as well as preparation method and application of self-assembly copper ball
  • Self-assembly copper ball, conductive ink as well as preparation method and application of self-assembly copper ball
  • Self-assembly copper ball, conductive ink as well as preparation method and application of self-assembly copper ball

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Embodiment 1

[0069] In this embodiment, a self-assembled copper ball is provided. The self-assembled copper ball includes a composite copper ball and a polymer coated on the surface of the composite copper ball. The composite copper ball includes copper particles and is adsorbed on the surface of the copper particles. The oxidation product of the reducing agent; wherein the polymer is polyvinylpyrrolidine K29-K32, its number average molecular weight is 58,000, and the oxidation product of the reducing agent is dehydroascorbic acid.

[0070] The preparation method of the self-assembled copper ball is as follows:

[0071] Mix copper hydroxide, polyvinylpyrrolidone K29-K32 and L-ascorbic acid in water according to the mass ratio of 1:0.26:12, wherein the quality of copper hydroxide is 3.92g, the quality of polyvinylpyrrolidone K29-K32 is 1g, L- The mass of ascorbic acid is 12 g, reacted at 40° C. for 90 minutes, centrifuged, and the obtained solid was centrifugally washed with ethanol, and va...

Embodiment 2

[0086] In this embodiment, a self-assembled copper ball is provided. The self-assembled copper ball includes a composite copper ball and a polymer coated on the surface of the composite copper ball. The composite copper ball includes copper particles and is adsorbed on the surface of the copper particles. The oxidation product of the reducing agent; wherein the polymer is polyvinylpyrrolidine K29-K32, its number average molecular weight is 58,000, and the oxidation product of the reducing agent is dehydroascorbic acid.

[0087] The preparation method of the self-assembled copper ball is as follows:

[0088] Mix copper hydroxide, polyvinylpyrrolidone K29-K32 and L-ascorbic acid in a mixed solution of 200mL water and 200ml ethanol according to the mass ratio of 1:0.26:12, wherein the quality of copper hydroxide is 3.92g, polyvinylpyrrolidone K29- The mass of K32 was 1 g, the mass of L-ascorbic acid was 12 g, reacted at 80° C. for 30 min, and then centrifuged, and the obtained so...

Embodiment 3

[0096] In this embodiment, a self-assembled copper ball is provided. The self-assembled copper ball includes a composite copper ball and a polymer coated on the surface of the composite copper ball. The composite copper ball includes copper particles and is adsorbed on the surface of the copper particles. The oxidation product of the reducing agent; wherein the polymer is polyvinylpyrrolidine K88-K96, its number average molecular weight is 130,000, and the oxidation product of the reducing agent is dehydroascorbic acid.

[0097] The preparation method of the self-assembled copper ball is as follows:

[0098] Mix copper hydroxide, polyvinylpyrrolidone K88-K96 and L-ascorbic acid in a mixed solution of 200mL water and 200ml ethanol according to the mass ratio of 1:0.26:12, wherein the quality of copper hydroxide is 3.92g, polyvinylpyrrolidone K88- The mass of K96 is 1g, the mass of L-ascorbic acid is 12g, react at 60°C for 60min, then centrifuge, wash the obtained solid with eth...

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Abstract

The invention provides a self-assembly copper ball, conductive ink as well as a preparation method and application of the self-assembly copper ball. The self-assembly copper ball comprises a compositecopper ball and a polymer coated on the surface of the composite copper ball, wherein the composite copper ball comprises copper particles and oxidation products of a reducing agent, and the oxidation products are adsorbed on the surfaces of the copper particles. The prepared self-assembly copper ball is comparatively good in oxidation resistance; in addition, the self-assembly copper ball is simple in preparation process and easily available in raw materials, so that the self-assembly copper ball is suitable for large-scale industrial volume production; additionally, the conductive ink prepared from the self-assembly copper ball is comparatively high in conductivity and is comparatively low in sintering temperature, so that comparatively high energy loss cannot be caused.

Description

technical field [0001] The invention belongs to the technical field of conductive ink, relates to a self-assembled copper ball, a conductive ink and a preparation method and application thereof, in particular to a self-assembled copper ball, a preparation method thereof, a conductive ink using the same, a preparation method of a conductive ink and Application of conductive ink. Background technique [0002] Printed electronics has the advantages of simple process, high output and low cost, and is slowly replacing traditional photolithography methods. As a functional material for printed electronics, conductive ink has attracted more and more attention. Among them, nano-silver ink has been widely used in various commercial fields because of its high conductivity and stability. However, its high price and easy migration of electrons limit its wide application. Copper conductive ink is considered to be the best substitute for gold and silver conductive ink due to its low pri...

Claims

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Application Information

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IPC IPC(8): C09D11/52
CPCC09D11/52
Inventor 李刚胡新艳朱朋莉赵涛孙蓉
Owner SHENZHEN INST OF ADVANCED TECH