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A kind of powdery active solder for diamond grinding tool

A technology of active solder and diamond, applied in the direction of grinding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of element segregation, solder plasticity deterioration, uneven structure, etc., and achieve low production cost and high wear resistance The effect of reducing and increasing hardness

Active Publication Date: 2021-07-02
宁波中机松兰刀具科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the arc smelting method, due to the small arc heating range, the copper-tin-titanium solder prepared each time is insufficient and cannot be produced industrially. At the same time, the copper-tin-titanium solder prepared by this method is prone to uneven structure and localized elements due to the narrow arc irradiation area. The phenomenon of segregation degrades the performance of copper-tin-titanium solder, making it difficult to use normally
The vacuum smelting method has certain advantages in the preparation of copper-tin-titanium solder, but it is not suitable for solder containing volatile elements, and there is a brittle phase in the copper-tin-titanium alloy, which makes the plasticity of the solder worse and is easy to bring into Impurity elements reduce the mechanical properties of copper-tin-titanium solder, which cannot meet the actual performance index requirements of the project
Therefore, arc melting and vacuum melting methods have certain limitations in the preparation of copper-tin-titanium solder

Method used

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  • A kind of powdery active solder for diamond grinding tool

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preparation example Construction

[0030] The preparation method of active powdery solder of the present invention comprises the following steps:

[0031] 1) Metal powder pre-dispersion: Add metal powders of copper, tin, aluminum, titanium, zinc, silicon and nickel to absolute ethanol, and mechanically stir and ultrasonically disperse the mixed solution of metal powder and absolute ethanol at the same time. During this process, the vibration frequency of the ultrasonic vibrator is 50~100Hz, and the action time is 30~500min.

[0032] 2) Wet ball milling: Transfer the mixed solution of pre-dispersed copper, tin, aluminum, titanium, zinc, silicon, nickel metal powder and absolute ethanol to the ball mill tank, adjust the amount of absolute ethanol so that all steel balls Submerge in absolute ethanol and perform ball milling. In this process, the ball-to-material ratio is between 3:1~30:1, the ball milling speed is 30~300r / min, and the ball milling time is 0.5~72 hours. The total amount of absolute ethanol added i...

Embodiment 1

[0037]Follow the specific steps described above. A mixed coarse powder containing 60wt% of copper powder, 15wt% of tin powder, 8wt% of aluminum powder, 7wt% of zinc powder, 7wt% of titanium powder and 3wt% of silicon powder is used. The average particle size of the mixed powder is selected at a particle size of about 200 meshes, and the purity of copper powder, tin powder, aluminum powder, zinc powder, titanium powder, and silicon powder is all 99.5%. In the pre-dispersion process, add 6g of copper powder, 1.5g of tin powder, 0.8g of aluminum powder, 0.7g of zinc powder, 0.7g of titanium powder, 0.3g of silicon powder, 20g of absolute ethanol, and the speed of the stirrer at 200r / min. The ultrasonic vibration frequency is 60 Hz, the action time is 200 min, and the solution temperature is room temperature 30°C. The ball-to-material ratio in the ball milling process is 10:1, the ball milling time is 24 hours, and the ball mill speed is 150r / min. The drying temperature is 100°C...

Embodiment 2

[0041] Follow the specific steps described above. A mixed coarse powder containing 55wt% of copper powder, 23wt% of tin powder, 7wt% of aluminum powder, 8wt% of zinc powder, 5wt% of titanium powder and 2wt% of silicon powder is used. The average particle size of the mixed powder is selected at a particle size of about 180 meshes, and the purity of copper powder, tin powder, aluminum powder, zinc powder, titanium powder, and silicon powder is all 99.5%. In the pre-dispersion process, add 5.5g of copper powder, 2.3g of tin powder, 0.7g of aluminum powder, 0.8g of zinc powder, 0.5g of titanium powder, 0.2g of silicon powder, 25g of absolute ethanol, and the speed of the stirrer at 250r / min , the ultrasonic vibration frequency is 100Hz, the action time is 250min, and the solution temperature is room temperature 30°C. The ball-to-material ratio in the ball milling process is 15:1, the ball milling time is 36 hours, and the ball mill speed is 200r / min. The drying temperature is 10...

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Abstract

The invention provides a powdery active brazing filler metal for diamond grinding tools. On the basis of copper tin titanium active brazing filler metal, Al-Zn-Si-Ni is compounded, and the obtained solder alloy has a low melting temperature and a low melting point for diamond, which can be used at 800°C. A complete liquid phase is obtained below. Under the solid solution strengthening effect of aluminum nickel element and the multiple effects of active element titanium, etc., when the active solder alloy is used to braze diamond and the substrate, the diamond and the substrate can form a firm metallurgical bond, and the brazing filler metal is used to braze graphite / The shear strength of No. 45 steel joints can reach more than 35.7MPa. The powdery active solder for diamond grinding tool of the present invention has low welding temperature during brazing, little heat loss to diamond, does not contain precious metal elements, and can be sintered or brazed diamond products under gas shielded welding, which is beneficial to simplify Production process, reduce production cost.

Description

technical field [0001] The invention belongs to the technical field of brazing materials, and in particular relates to a powdery active brazing material for diamond grinding tools. Background technique [0002] Active brazing refers to the interaction between carbide-forming elements such as Ti, Zr, Hf and V in the liquid solder and carbon materials (such as diamond) during the brazing process, forming Ti C, VC and other intermetallic bonds at the interface of carbon materials. Compound layer, so as to realize the connection method of atomic level bonding between the substrate, solder and diamond. Commonly used active solders suitable for brazing diamond include nickel-based active solders, copper-based active solders and silver-based active solders, of which Ni-based active solders mainly include Ni-Ti, Ni-Cr, Ni-Cr-Si -B alloy solder, etc. The liquidus melting temperature of Ni-based active solder is generally higher than 900°C, and diamond is prone to thermal damage dur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00C22C9/02B22F1/00B22F9/04
CPCB22F1/0003B22F9/04B22F2009/043B24D18/00C22C9/02
Inventor 龙伟民黄森钟素娟纠永涛李和鑫宋克兴王裕昌吴铭方
Owner 宁波中机松兰刀具科技有限公司