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Acidic hole-adjusting agent used in circuit board hole metallization process, and preparation method of circuit board

A hole metallization and circuit board technology, applied in the field of PCB circuit board manufacturing, can solve the problems of non-compliance with environmental protection requirements, high waste water nitrogen and COD, difficulty in meeting the needs of high-performance circuit board manufacturing, etc., to achieve good electrical interconnection performance, Low COD and nitrogen content, good cleaning effect

Active Publication Date: 2021-03-23
深圳市天熙科技开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing alkaline pore conditioner treatment is bound to be difficult to meet the needs of high-performance circuit board manufacturing
[0007] In addition, due to the use of a large amount of organic amines in the alkaline pore conditioner, the waste water nitrogen and COD are extremely high, which does not meet the current environmental protection requirements. This is also a problem that needs to be improved urgently in the current pore metallization process.

Method used

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  • Acidic hole-adjusting agent used in circuit board hole metallization process, and preparation method of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Prepare the acidic pore adjusting agent according to the method of aforementioned (1), and the concrete proportioning ratio is as follows:

[0050] Sulfuric acid 20g / L;

[0051] Glycolic acid 30.0g / L;

[0052] Hydroxyethylene diphosphonic acid 10.0g / L;

[0053] TX-10 5.0g / L;

[0054] Diethylenetriamine and acrylamide 1:1 hyperbranched copolymer 1.5g / L;

[0055] Deionized water balance.

[0056] Heat the prepared pore adjusting agent to 50°C for later use. The through-hole copper-clad laminate with a thickness of 2.0mm to be tested is processed according to the hole metallization process of the aforementioned steps a~i. After the copper plating is completed, the sample is dried for test evaluation, and the obtained results are recorded as 1-1.

Embodiment 2

[0058] Prepare the acidic pore adjusting agent according to the method of aforementioned (1), and the concrete proportioning ratio is as follows:

[0059] Hydrochloric acid 30g / L;

[0060] Citric acid 150.0g / L;

[0061] Hydroxyethylene diphosphonic acid 30.0g / L;

[0062] Triethylenetetramine and acrylamide 1:1.5 hyperbranched copolymer 5.0g / L;

[0063] TTX-100 2.0g / L;

[0064] Deionized water balance.

[0065] Heat the prepared pore adjusting agent to 50°C for later use. The through-hole copper-clad laminate with a thickness of 2.0mm to be tested is processed according to the hole metallization process of the aforementioned steps a~i. After the copper plating is completed, the sample is dried for test evaluation, and the obtained results are recorded as 2-1.

Embodiment 3

[0067] Prepare the acidic pore adjusting agent according to the method of aforementioned (1), and the concrete proportioning ratio is as follows:

[0068] Phosphoric acid 60g / L;

[0069] Methanesulfonic acid 100.0g / L;

[0070] Amino trimethylene phosphonic acid 30.0g / L;

[0071] Triethylenetetramine and methyl acrylate 2:5 hyperbranched copolymer 10.0g / L;

[0072] NP-10 4.0g / L;

[0073] Deionized water balance.

[0074] Heat the prepared pore adjusting agent to 50°C for later use. The through-hole copper-clad laminate with a thickness of 2.0 mm to be tested is processed according to the hole metallization process of the aforementioned steps a~i. After the copper plating is completed, the sample is dried for test evaluation, and the obtained results are recorded as 3-1.

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Abstract

The invention discloses an acidic pore forming agent used in the circuit board hole metallization process and a preparation method of the circuit board. The composition of the pore shaping agent is an acid, a hyperbranched polymer starting from a polyamine, a wetting agent and deionized water. Compared with the alkaline pore forming agent used in the prior art, the present invention uses an organic carboxylic acid that is extremely easy to clean as a cleaning aid, and a hyperbranched polymer with strong cationic properties under acidic conditions as the surface of the dielectric material. The charge modifier is very easy to clean. Therefore, it can improve the problem that alkaline pore-forming agents are not easy to clean, and too much surface charge modifier is easy to remain, causing excessive adsorption of palladium activator, resulting in abnormal quality of circuit board metallization. The acidic pore shaping agent disclosed by the invention has good treatment effect and high efficiency, and is suitable for application in the hole metallization process of horizontal continuous operation of circuit boards.

Description

technical field [0001] The invention relates to the field of PCB circuit board manufacturing, in particular to an acidic hole-adjusting agent for pretreatment of a hole metallization process in the PCB manufacturing process, and a method for preparing a circuit board. At the same time, the present invention can also be applied to the surface degreasing adjustment process of other non-metallic materials before metallization (such as the metallization treatment of plastic electroplating). Background technique [0002] Printed circuit board (PCB) has become an indispensable main component for electronic products to achieve circuit interconnection. As the core process of printed circuit board manufacturing, the hole metallization process mainly uses electroless copper plating and electroplating copper to plate a conductive layer on the insulating PCB hole wall to connect the interlayer wires. Electroless copper plating (Electroless copperplating), as the core process of hole me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C11D1/72C11D3/37C11D3/04C11D3/20C11D3/34C11D3/36C11D3/60C11D11/00H05K3/42
CPCH05K3/429C11D1/008C11D1/72C11D3/042C11D3/2079C11D3/2086C11D3/3409C11D3/364C11D3/3765C11D3/3773H05K3/00C11D2111/22
Inventor 张磊李晓彬
Owner 深圳市天熙科技开发有限公司
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