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A class A non-gas gel polystyrene insulation board and preparation method thereof

A thermal insulation board and airgel technology, applied in the field of construction, can solve problems such as low mechanical strength, high moisture absorption rate, and large capacity, and achieve the effects of low thermal conductivity, high compressive strength, and low apparent density

Active Publication Date: 2021-12-14
北京新时代寰宇科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there are two types of wall insulation materials commonly used in my country: inorganic insulation materials and organic insulation materials. Inorganic insulation materials include rock wool, expanded perlite, vitrified microbeads, and foam concrete. Higher advantages, but high moisture absorption rate is a common problem, and poor weather resistance, large bulk density, which limits its application
Organic insulation materials include extruded polystyrene board (XPS), polystyrene insulation board (EPS), polyurethane board (PU), foam phenolic board, etc., which have the advantages of low thermal conductivity, good water resistance, and light bulk density, but the common problem is fire resistance. Poor, most of them are Class B, and produce a large amount of toxic and harmful gases when burning, with great safety hazards, low mechanical strength, and limited applications

Method used

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  • A class A non-gas gel polystyrene insulation board and preparation method thereof
  • A class A non-gas gel polystyrene insulation board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Preparation of polybenzene thermal plate products by the following formulations 1:

[0033] PO42.5 silicate cement 1000 copies, 700 fly ash, hydrophobic SIO 2 16 parts of airgel, 10 polyphenyl pellets, 20 animal protein foaming agents, 12 polypropylene fibers, 8 parts of polycarboxylic acid, 1 hydrocarboxylic acid, 1 part, silane coupling agent 0.4 parts, no 80 parts of water, 600 water.

Embodiment 2

[0035] Preparation of polybenzene thermal plate products by the following formulations 2:

[0036] PO42.5 silicate cement 1200 parts, 400 fly ash, hydrophobic SIO 2 4 parts of gas gel, 36 polyphenyl pellets, 5 animal protein foaming agents, 2 polypropylene fibers, 8 parts of polycarboxylic acid, 5 parts of HPMC, 2 silane coupling agents, no 20 parts of water ethanol, 1500 water.

Embodiment 3

[0038] Preparation of polybenzene thermal plate products by the following formula 3:

[0039] PO42.5 silicate cement 1100 parts, 500 fly, hydrophobic SIO 2 4 parts of gas gel, 20 polyphenyl pellets, 15 animal protein foaming agents, 6 polypropylene fibers, 5 parts of polycarboxylic acid, 5 parts, HPMC, 1 silane coupling agent, no 20 parts of water ethanol, 1200 water.

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PUM

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Abstract

The invention discloses a grade A non-combustible gel polystyrene insulation board and a preparation method thereof, belonging to the field of construction, comprising the following raw materials in parts by weight: 1000-1200 parts of gelling material, 400-700 parts of filler, 4 parts of airgel ~16 parts, 10~36 parts of polystyrene particles, 5~20 parts of foaming agent, 2~12 parts of fiber, 2~8 parts of water reducing agent, 1~5 parts of anti-cracking agent, 0.4~2 parts of coupling agent and 20-80 parts of absolute ethanol. The A-level non-combustible airgel polystyrene board of the present invention overcomes the shortcomings of existing organic thermal insulation materials such as poor fire resistance, poor durability, and low mechanical strength, and has A-level non-combustibility, low thermal conductivity, low apparent density, and compressive strength. High, crack resistance, environmental protection and non-toxic, etc., it is suitable for the thermal insulation system of the building envelope.

Description

technical field [0001] The invention relates to the construction field, in particular to a grade A non-combustible gel polystyrene insulation board and a preparation method thereof. Background technique [0002] There are three basic modes of heat transfer: conduction, convection, and radiation. For insulation materials, heat conduction is mainly done by the solid part of the insulation material; heat convection is mainly done by the gas in the insulation material; heat radiation transfer does not require any medium. [0003] At present, there are two types of wall insulation materials commonly used in my country: inorganic insulation materials and organic insulation materials. Inorganic insulation materials include rock wool, expanded perlite, vitrified microbeads, and foam concrete. Higher advantages, but the high moisture absorption rate is a common problem, and the weather resistance is poor, and the bulk density is large, which limits its application. Organic insulatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B28/04C04B28/06C04B28/30C04B38/10C04B111/28C04B111/76
Inventor 杨李宁胡宝苓杨康张迎新田俊岭
Owner 北京新时代寰宇科技发展有限公司