Active silicone oil and low-pollution heat-conducting silicone grease composition

A technology of active silicone oil and thermally conductive silicone grease, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of oil separation, migration, hardening, and cracking of thermally conductive silicone grease, and achieve the effect of solving cracking

Inactive Publication Date: 2019-05-17
东莞优邦材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, usually the silicone oil is not effectively combined on the surface of the filler, and the silicone oil will migrate in a state of free movement during the working process, such as methyl silicone oil, phenyl silicone oil, and long-chain alkyl silicone oil. The influence of impact and surface tension will migrate to produce oil separation, thermal conductive silicone grease will appear cracking, pulverization and other phenomena, silicone oil will be affected by surface tension and may migrate to the surface of electronic devices, causing pollution
At the same time, in the synthesis process of ordinary silicone oil currently on the market, the product obtained by equilibrium polymerization and high temperature removal of low molecular weight at 180°C contains about 1% of ΣD3-D10 volatile silicone low-molecular ring bodies, and this part The ring body has no active groups. When used, it is affected by the surface temperature of the device. At high temperature, it will volatilize and diffuse to the surface of some sensitive devices such as relays, liquid crystal displays, LED screens, optical sensors, etc., especially in closed devices. It will contaminate the location where electrical contact is required, causing the contact to fail to conduct electricity, or it will harden at high temperature, making it difficult to disassemble and repair
[0004] In view of this, it is necessary to develop a low-pollution thermally conductive silicone grease to solve the problems of easy oil separation and migration of existing thermally conductive silicone greases and pollution caused by the diffusion of organic silicon low-molecular rings, and to develop and prepare low-pollution thermally conductive silicon Resin is of great significance in high-end electronics, microelectronics, information electronics and other products, and has become a hot spot for development

Method used

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  • Active silicone oil and low-pollution heat-conducting silicone grease composition
  • Active silicone oil and low-pollution heat-conducting silicone grease composition
  • Active silicone oil and low-pollution heat-conducting silicone grease composition

Examples

Experimental program
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Effect test

Embodiment 1

[0056] Use 100g of synthetic A-structure silicone oil (m=28, viscosity 45mPa.s, silicone low-molecular ring body ΣD3~D10=80ppm), 300g zinc oxide (median particle size 0.5 microns), mix well, and vacuum defoam , Obtain example 1# thermal conductive silicone grease.

Embodiment 2

[0058] Use 70g of silicone oil with structure C synthesized (m=28, viscosity 45mPa.s, organic silicon low-molecular ring body ΣD3~D10=80ppm), 30g of bis(terminal trimethylsilane) bis(terminal trimethylsilane) to control ΣD3~D10 at 110ppm Methyl silicone oil (viscosity 500mPa.s), 300g zinc oxide (median particle size 0.5 micron), mixed evenly, vacuum defoaming, to obtain example 2 thermal conductive silicone grease.

Embodiment 3

[0060] The structure that is synthesized with 100g is the silicone oil (m=100, viscosity 300mPa.s, organosilicon low molecular ring body ΣD3~D10=120ppm) of F, 500g zinc oxide (median particle size 0.5 micron), 800g spherical aluminum oxide ( Median particle diameter 5 micrometers), mixed uniformly, vacuum defoaming, obtained Example 3 thermal conductive silicone grease.

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Abstract

The invention discloses active silicone oil, and further discloses a low-pollution heat-conducting silicone grease composition. The active silicone oil can control the oil content sigma D3-D10 of a volatile low molecular organic silicone ring body to be less than 200ppm. The active silicone oil is structurally characterized in that one end is of a hydrolyzable trimethoxysilane or triethoxysilane structure, and the other end is of any structure of methyl or vinyl or butyl methyl silicone oil or phenyl silicone oil, or all the ends are of a hydrolyzable alkoxysilane structure, and a molecule chain structure is a high temperature resistant dimethyl siloxane polymer or methyl phenyl siloxane liquid polymer. The low-pollution heat-conducting silicone grease composition is prepared from the components in parts by weight: 10-100 parts of active silicone oil, 100-3000 parts of heat-conducting filler and 0-90 parts of non-active silicone oil, wherein the sum of the content of the two types of silicone oil is 100 parts. According to the active silicone oil and the low-pollution heat-conducting silicone grease composition, the silicone oil of the specific alkoxy structure is adopted, the content of the volatile organic silicone ring body is greatly reduced, the effective binding force of the silicone oil and the filler is improved, the migration of the silicone oil and the diffusion of the ring body are avoided, and the advantages such as low pollution and good heat resistance are achieved.

Description

technical field [0001] The invention relates to the technical field of organosilicon materials, in particular to an active silicone oil and a low-pollution heat-conducting silicone grease composition thereof. Background technique [0002] The size of integrated circuits used in mobile phones, computers, communications, Internet, Internet of Things, automatic driving, smart equipment, 5G and other industries is getting smaller and smaller, the computing speed is doubling, and the power of chips is getting bigger and bigger. However, heat management has become a bottleneck hindering chip development and design, and Moore's Law seems to be facing unprecedented challenges. In new smartphones, notebook computers, tablet computers, etc., the pursuit of high functionality, small size, light weight, and flatness makes user experience a special consideration for designers. In the future 5G communication, the chip is highly integrated, the size is reduced, and the power is increased,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K3/22C08K7/18C08K3/28C09K5/14
Inventor 刘良军徐玉文王文菲
Owner 东莞优邦材料科技股份有限公司
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