Micro hollow silicon needle tube array and a manufacturing method thereof
A manufacturing method and technology of hollow silicon, applied in microstructure technology, other medical devices, microstructure devices, etc., can solve the problem of high processing cost of micro-hollow silicon needle tube arrays, reduce the size of hollow micro-needle tube tips, and increase the volume of liquid in silicon tubes. Needle tube flow resistance and other issues, to achieve the effect of light weight, simple structure, and reduce production costs
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0075] The fabrication steps of the hollow silicon needle tube array include:
[0076] (1) 2.2-micron silicon dioxide is deposited on both sides of the SOI silicon wafer.
[0077] (2) The silicon dioxide of the SOI device layer is patterned to form a mask pattern for deep silicon etching, and a circular hole structure with a 5-micron diameter inside the silicon needle tube is etched by an inductively coupled plasma (ICP) deep silicon etching process. Etched to the buried oxide layer (thickness 100 microns).
[0078] (3) In the same step, a circular hole structure of the storage solution is etched on the back substrate, with a diameter of 300 microns, and is etched to a buried oxide layer (thickness of 500 microns).
[0079] (4) Remove the photoresist of the device layer and perform the second patterning. During patterning, the new photoresist will cover the circular hole structure etched for the first time. The resist does not flow into it but forms a mask over it.
[0080]...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| diameter | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


