Thermosetting resin composition, prepreg prepared from thermosetting resin composition and laminated board

A technology of resin composition and prepreg, which is applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., and can solve problems such as insufficient rigidity, poor adhesion, and low strength

Active Publication Date: 2019-05-28
常熟生益科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. , low glass transition temperature, poor adhesion and other problems, there are still many problems to be solved in practical applications

Method used

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  • Thermosetting resin composition, prepreg prepared from thermosetting resin composition and laminated board
  • Thermosetting resin composition, prepreg prepared from thermosetting resin composition and laminated board
  • Thermosetting resin composition, prepreg prepared from thermosetting resin composition and laminated board

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0095] Put 1000g of tetrahydrofuran, 100g of dicyclohexylcarbodiimide, 58.8g of maleic anhydride, and 228g of bisphenol A into the three-necked reaction flask. After fully dissolving, put it in the three-necked reaction flask and mix thoroughly, and then add the catalytic amount under stirring. 4-Dimethylaminopyridine was reacted at room temperature for 5 hours, and then the product was separated and purified to obtain activated ester resin A-1. The equivalent of hydroxyl functional groups in the activated ester (A-1) resin was calculated as 690 g / equivalent based on the input ratio (58.8+228-18*0.6=276,276 / 0.4=690), the functional equivalent of the ester group is 230 g / equivalent based on the input ratio, and the functional equivalent of the unsaturated double bond is 460 g / equivalent.

[0096] In a flask equipped with a thermometer, a dropping funnel, a condenser, a shunt tube, and a stirrer, 1000 g of the solvent methyl isobutyl ketone was put into the flask, and then 276 g of ...

Synthetic example 2

[0098] Put 1000g of tetrahydrofuran, 100g of dicyclohexylcarbodiimide, 58.8g of maleic anhydride, 160g of 2,7 dihydroxynaphthalene into the three-necked reaction flask, fully dissolve them, put them in the three-necked reaction flask, mix well, and then add under stirring Catalytic amount of 4-dimethylaminopyridine was reacted at room temperature for 5 hours, and then the product was separated and purified to obtain active ester resin (A-2). The equivalent of hydroxyl functional groups in the active ester (A-2) resin was calculated based on the input ratio It is 520 g / equivalent (58.8+160-18*0.6=208,208 / 0.4=520), the functional equivalent of ester group is 173 g / equivalent based on the input ratio, and the functional equivalent of unsaturated double bond is 347 g / equivalent.

[0099] In a flask equipped with a thermometer, a dropping funnel, a condenser tube, a shunt tube, and a stirrer, 1000 g of the solvent methyl isobutyl ketone was put into the flask, and then 208 g of resin A...

Embodiment 1～9 and comparative example 2～3

[0104] According to the formula shown in Table 1, it is first necessary to pre-polymerize the unsaturated polyester active ester, olefinic crosslinking agent, and initiator in Example 5 into a prepolymer according to the method of Example 1. Saturated polyester active ester, ethylenic crosslinking agent, and initiator are prepolymerized into a prepolymer according to the method of Example 2. Examples 3 to 4, Examples 7 to 9 and Comparative Examples 2 to 3 were not pre-polymerized, but were ordinary physical blending, which is not specifically described here.

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Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition is prepared from the materials in parts by weight: (a) 100 parts of epoxy resin, (b) 50-200 parts of unsaturated polyester active-ester resin shown in the structural formula (I), (c) 10-200 parts of resin which contains maleimido and vinyl simultaneously and is shown in the structural formula (II), (d) 10-200 parts of cyanate ester resin and (e) 0.05-4 parts of an accelerant. Through unsaturated-bond reactivity between unsaturated polyester active-ester, the resin which contains the maleimido and thevinyl simultaneously and cyanate ester, the epoxy resin, the maleimide resin and the cyanate ester resin are effectively combined in a resin system, and thus a cured resin composition has excellent dielectricity, heat resistance, strength and stiffness and flexibility, is high in peel strength, low in water absorption and small in hot-shrinkage rate, and can be applied to high-speed and high-frequency printed circuit boards.

Description

Technical field [0001] The invention relates to a thermosetting resin composition and a prepreg and laminate prepared by using the same, and belongs to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of information processing and information transmission high-speed and high-frequency technology, higher and higher requirements have been placed on the dielectric properties of printed circuit board materials. To put it simply, the printed circuit board material needs to have a low dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, it is desirable to provide a thermosetting resin composition. The printed circuit board material made of this thermosetting resin composition can exhibit a sufficiently low low dielectric constant and low dielectric constant during the high-speed and high-fre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L67/06C08L79/08C08L79/04C08L61/14C08L71/12B32B15/20B32B15/14B32B33/00
Inventor 何继亮焦锋陈诚王宁黄荣辉马建崔春梅储正振
Owner 常熟生益科技有限公司
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