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A kind of double-sided hot-melt adhesive tape and preparation method thereof

A hot-melt tape, double-sided technology, used in adhesives, heat-activated films/sheets, film/sheet-like adhesives, etc., can solve the problems of decreased bonding strength, easy heat conduction, etc. The effect of high curing strength and low production cost

Active Publication Date: 2021-05-14
DONGGUAN AOZON ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the different bonding parts on both sides of the tape, the heat is easily transferred to each other, resulting in a decrease in the bonding strength of one side. Therefore, we propose a double-sided hot-melt tape and its preparation method

Method used

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  • A kind of double-sided hot-melt adhesive tape and preparation method thereof

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Embodiment 1

[0031] A double-sided hot-melt adhesive tape, comprising a first release paper layer, a pressure-sensitive adhesive layer, a heat-insulating base material layer, a heat-activated adhesive layer and a second release paper layer laminated in sequence, the pressure-sensitive adhesive The mixture layer is composed of the following raw materials in parts by weight: 70 parts of 2-ethylhexyl acrylate, 60 parts of dodecyl acrylate, 30 parts of methyl methacrylate, 42 parts of filler, benzoyl diphenyl 15 parts of phosphine, 8 parts of solubilizer;

[0032] The heat-insulating substrate layer is composed of the following raw materials in parts by weight: 55 parts of polyethylene terephthalate, 13 parts of boron carbide, 12 parts of silicon phosphide, and 11 parts of nano-tin oxide;

[0033] The heat-activated adhesive layer is composed of the following raw materials in parts by weight: 80 parts of aromatic polyester polyurethane, 55 parts of polymer polyester resin, 15 parts of activate...

Embodiment 2

[0050] A double-sided hot-melt adhesive tape, comprising a first release paper layer, a pressure-sensitive adhesive layer, a heat-insulating base material layer, a heat-activated adhesive layer and a second release paper layer laminated in sequence, the pressure-sensitive adhesive The mixture layer is composed of the following raw materials in parts by weight: 95 parts of 2-ethylhexyl acrylate, 75 parts of dodecyl acrylate, 35 parts of methyl methacrylate, 50 parts of filler, benzoyl diphenyl 20 parts of phosphine, 11 parts of solubilizer;

[0051] The heat-insulating substrate layer is composed of the following raw materials in parts by weight: 55 parts of polyethylene terephthalate, 15 parts of boron carbide, 14 parts of silicon phosphide, and 13 parts of nano-tin oxide;

[0052] The heat-activated adhesive layer is composed of the following raw materials in parts by weight: 90 parts of aromatic polyester polyurethane, 65 parts of polymer polyester resin, 17 parts of activat...

Embodiment 3

[0069] A double-sided hot-melt adhesive tape, comprising a first release paper layer, a pressure-sensitive adhesive layer, a heat-insulating base material layer, a heat-activated adhesive layer and a second release paper layer laminated in sequence, the pressure-sensitive adhesive The mixture layer is composed of the following raw materials in parts by weight: 120 parts of 2-ethylhexyl acrylate, 90 parts of dodecyl acrylate, 40 parts of methyl methacrylate, 58 parts of filler, benzoyl diphenyl 25 parts of phosphine, 14 parts of solubilizer;

[0070] The heat-insulating substrate layer is composed of the following raw materials in parts by weight: 75 parts of polyethylene terephthalate, 17 parts of boron carbide, 16 parts of silicon phosphide, and 15 parts of nano-tin oxide;

[0071] The heat-activated adhesive layer is composed of the following raw materials in parts by weight: 100 parts of aromatic polyester polyurethane, 75 parts of polymer polyester resin, 18 parts of activ...

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Abstract

The invention relates to the technical field of adhesive tapes, in particular to a double-sided hot-melt adhesive tape, which comprises a first release paper layer, a pressure-sensitive adhesive layer, a heat-insulating substrate layer, a heat-activated adhesive layer and a second release paper layer laminated in sequence. Type paper layer, the heat-insulating base material layer is composed of the following raw materials in parts by weight: polyethylene terephthalate, boron carbide, silicon phosphide, and nano-tin oxide; The tape, through the setting of the heat-insulating substrate layer, prevents the heat transfer of the adhesive on both sides, causing the end face with a low melting point to lose its bonding performance due to excessive temperature. The pressure-sensitive adhesive layer has better pressure-sensitive properties and has an initial Good adhesion and holding power, high peel strength, used as the adhesive layer, with strong adhesive force, fast curing speed of heat-activated adhesive layer, excellent storage stability, high curing strength, low preparation cost, etc. , with outstanding substantive features and remarkable progress.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to a double-sided hot-melt adhesive tape and a preparation method thereof. Background technique [0002] For industrial pressure sensitive tape applications, double sided tapes are very often used in order to bond two materials to each other. Due to the extremely diverse deployment tendencies, the requirements in some cases are very specific, so that demanding requirements are placed on the corresponding adhesive tapes. In the field of lithium batteries, for example, requirements for high temperature stability and high resistance to solvents and fuels are very frequently present. These properties are achieved in a very good form by means of crosslinked pressure-sensitive acrylate adhesives (acrylate PSA). Moreover, also in the industrial field, the substrates which can be bonded vary extremely widely. In some cases it may be advantageous to use a heat-activatable adhesive ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/25C09J7/35C09J7/38C09J175/04C09J167/00C09J4/02C09J4/06C09J11/04C09J11/06C08L67/02C08K3/38C08K3/34C08K3/22
Inventor 任寒晟黄敬王杰
Owner DONGGUAN AOZON ELECTRONICS MATERIAL
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