A kind of preparation method of optoelectronic device and optoelectronic device
A technology of optoelectronic devices and perovskites, which is applied in the fields of electrical solid-state devices, semiconductor/solid-state device manufacturing, electrical components, etc.
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[0057] According to another aspect of the present invention, there is provided a method for preparing the above photoelectric device, which includes preparing a perovskite film layer. The method for preparing a perovskite film layer includes: setting a precursor solution on a substrate and making the precursor solution on the substrate Diffusion on the bottom, the precursor solution includes a metal halide, a first organic cation halide, a second organic cation halide and a polar solvent; after the precursor solution reacts for the first time, add an anti-solvent, react for a second time, Removing the polar solvent and the above-mentioned anti-solvent, and using centrifugal force to get rid of the excess first organic cation halide to obtain the above-mentioned perovskite film layer; wherein, the above-mentioned first organic cation halide is used as a precursor of the ligand, and the above-mentioned The anti-solvent is capable of dissolving the above-mentioned first organic ca...
Embodiment 1
[0088] Preparation process of PeLED device
[0089] 1. ITO glass substrate cleaning: gently wipe the front and back of the ITO glass substrate with a dust-free cloth, then scrub with a cotton swab in acetone and ethanol solution, and then ultrasonically follow the sequence of acetone-ethanol-deionized water-ethanol for 10 minutes , blow dry carefully with a nitrogen gun after sonication, and finally treat under air plasma for 15 minutes.
[0090] 2. Preparation of nickel oxide hole transport layer: drop the nickel oxide precursor solution onto the ITO glass substrate and spin-coat at 4000 rpm for 40 seconds, and anneal on a hot stage at 270°C for 30 minutes, wait for the temperature to drop After reaching room temperature, the device was treated with ozone for 30 minutes.
[0091] 3. Spin-coating hole transport layer: Spin-coat 8 mg / mL TFB (solvent is m-xylene) on the nickel oxide layer at a speed of 2000 rpm for 45 seconds, then place the device on a hot stage Anneal at 150...
Embodiment 2
[0096] The difference with Example 1 is that PBABr and PbBr of different quality are weighed 2 , so that PBABr and PbBr 2 The molar ratio is 1.4.
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